JP5985393B2 - アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ - Google Patents
アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ Download PDFInfo
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- JP5985393B2 JP5985393B2 JP2012523170A JP2012523170A JP5985393B2 JP 5985393 B2 JP5985393 B2 JP 5985393B2 JP 2012523170 A JP2012523170 A JP 2012523170A JP 2012523170 A JP2012523170 A JP 2012523170A JP 5985393 B2 JP5985393 B2 JP 5985393B2
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- island
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/351—Substrate regions of field-effect devices
- H10D62/357—Substrate regions of field-effect devices of FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/254—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes extend entirely through the semiconductor bodies, e.g. via-holes for back side contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
Landscapes
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23113909P | 2009-08-04 | 2009-08-04 | |
| US61/231,139 | 2009-08-04 | ||
| PCT/CA2010/001202 WO2011014951A1 (en) | 2009-08-04 | 2010-08-04 | Island matrixed gallium nitride microwave and power switching transistors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013501362A JP2013501362A (ja) | 2013-01-10 |
| JP2013501362A5 JP2013501362A5 (enExample) | 2016-02-25 |
| JP5985393B2 true JP5985393B2 (ja) | 2016-09-06 |
Family
ID=43543843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012523170A Active JP5985393B2 (ja) | 2009-08-04 | 2010-08-04 | アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9064947B2 (enExample) |
| EP (1) | EP2465141B1 (enExample) |
| JP (1) | JP5985393B2 (enExample) |
| KR (1) | KR20120041237A (enExample) |
| AU (1) | AU2010281317A1 (enExample) |
| CA (1) | CA2769940C (enExample) |
| WO (1) | WO2011014951A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9818857B2 (en) | 2009-08-04 | 2017-11-14 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| US9029866B2 (en) | 2009-08-04 | 2015-05-12 | Gan Systems Inc. | Gallium nitride power devices using island topography |
| EP2465141B1 (en) | 2009-08-04 | 2021-04-07 | GaN Systems Inc. | Gallium nitride microwave and power switching transistors with matrix layout |
| DE102010001788A1 (de) * | 2010-02-10 | 2011-08-11 | Forschungsverbund Berlin e.V., 12489 | Skalierbarer Aufbau für laterale Halbleiterbauelemente mit hoher Stromtragfähigkeit |
| US8791508B2 (en) * | 2010-04-13 | 2014-07-29 | Gan Systems Inc. | High density gallium nitride devices using island topology |
| KR102052307B1 (ko) * | 2011-11-09 | 2019-12-04 | 스카이워크스 솔루션즈, 인코포레이티드 | 전계 효과 트랜지스터 구조 및 관련된 무선-주파수 스위치 |
| FR2984429B1 (fr) | 2011-12-16 | 2014-02-14 | Snecma | Bandes d'amortissement de vibrations a evacuation de fluides, pour protection acoustique de carter de soufflante de turbomachine d'aeronef |
| US20140027778A1 (en) * | 2012-07-25 | 2014-01-30 | International Rectifier Corporation | Robust Fused Transistor |
| US9331154B2 (en) * | 2013-08-21 | 2016-05-03 | Epistar Corporation | High electron mobility transistor |
| EP3063792B1 (en) * | 2013-10-29 | 2019-06-12 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| KR101729653B1 (ko) | 2013-12-30 | 2017-04-25 | 한국전자통신연구원 | 질화물 반도체 소자 |
| GB201418752D0 (en) * | 2014-10-22 | 2014-12-03 | Rolls Royce Plc | Lateral field effect transistor device |
| DE102016103581B4 (de) * | 2016-02-29 | 2019-11-14 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit nadelförmigen Feldplatten und einer Gatestruktur mit Rand- und Knotenbereichen |
| US9842920B1 (en) | 2016-07-12 | 2017-12-12 | Semiconductor Components Industries, Llc | Gallium nitride semiconductor device with isolated fingers |
| JP2018026401A (ja) * | 2016-08-08 | 2018-02-15 | アイシン精機株式会社 | 半導体デバイス |
| US10147796B1 (en) * | 2017-05-26 | 2018-12-04 | Stmicroelectronics Design And Application S.R.O. | Transistors with dissimilar square waffle gate patterns |
| US10403624B2 (en) | 2017-05-26 | 2019-09-03 | Stmicroelectronics Design And Application S.R.O. | Transistors with octagon waffle gate patterns |
| US10529802B2 (en) | 2017-09-14 | 2020-01-07 | Gan Systems Inc. | Scalable circuit-under-pad device topologies for lateral GaN power transistors |
| US10218346B1 (en) | 2017-09-14 | 2019-02-26 | Gan Systems Inc. | High current lateral GaN transistors with scalable topology and gate drive phase equalization |
| US11082039B2 (en) | 2017-11-08 | 2021-08-03 | Gan Systems Inc. | GaN transistor with integrated drain voltage sense for fast overcurrent and short circuit protection |
| US11387169B2 (en) | 2020-08-04 | 2022-07-12 | Nxp Usa, Inc. | Transistor with I/O ports in an active area of the transistor |
| US11502026B2 (en) | 2020-10-12 | 2022-11-15 | Nxp Usa, Inc. | Transistor with flip-chip topology and power amplifier containing same |
| US11587852B2 (en) | 2020-10-12 | 2023-02-21 | Nxp Usa, Inc. | Power amplifier modules with flip-chip and non-flip-chip power transistor dies |
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-
2010
- 2010-08-04 EP EP10805910.6A patent/EP2465141B1/en active Active
- 2010-08-04 CA CA2769940A patent/CA2769940C/en active Active
- 2010-08-04 JP JP2012523170A patent/JP5985393B2/ja active Active
- 2010-08-04 WO PCT/CA2010/001202 patent/WO2011014951A1/en not_active Ceased
- 2010-08-04 AU AU2010281317A patent/AU2010281317A1/en not_active Abandoned
- 2010-08-04 US US13/388,694 patent/US9064947B2/en active Active
- 2010-08-04 KR KR1020127005615A patent/KR20120041237A/ko not_active Withdrawn
Also Published As
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| WO2011014951A1 (en) | 2011-02-10 |
| EP2465141B1 (en) | 2021-04-07 |
| US20120138950A1 (en) | 2012-06-07 |
| US9064947B2 (en) | 2015-06-23 |
| AU2010281317A1 (en) | 2012-02-23 |
| EP2465141A1 (en) | 2012-06-20 |
| KR20120041237A (ko) | 2012-04-30 |
| JP2013501362A (ja) | 2013-01-10 |
| CA2769940A1 (en) | 2011-02-10 |
| CA2769940C (en) | 2016-04-26 |
| EP2465141A4 (en) | 2017-04-26 |
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