JP2013501362A5 - - Google Patents

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JP2013501362A5
JP2013501362A5 JP2012523170A JP2012523170A JP2013501362A5 JP 2013501362 A5 JP2013501362 A5 JP 2013501362A5 JP 2012523170 A JP2012523170 A JP 2012523170A JP 2012523170 A JP2012523170 A JP 2012523170A JP 2013501362 A5 JP2013501362 A5 JP 2013501362A5
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Japan
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drain
bonding
copper
reduces
packaging
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JP2012523170A
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JP2013501362A (ja
JP5985393B2 (ja
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Priority claimed from PCT/CA2010/001202 external-priority patent/WO2011014951A1/en
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JP2012523170A 2009-08-04 2010-08-04 アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ Active JP5985393B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23113909P 2009-08-04 2009-08-04
US61/231,139 2009-08-04
PCT/CA2010/001202 WO2011014951A1 (en) 2009-08-04 2010-08-04 Island matrixed gallium nitride microwave and power switching transistors

Publications (3)

Publication Number Publication Date
JP2013501362A JP2013501362A (ja) 2013-01-10
JP2013501362A5 true JP2013501362A5 (enExample) 2016-02-25
JP5985393B2 JP5985393B2 (ja) 2016-09-06

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JP2012523170A Active JP5985393B2 (ja) 2009-08-04 2010-08-04 アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ

Country Status (7)

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US (1) US9064947B2 (enExample)
EP (1) EP2465141B1 (enExample)
JP (1) JP5985393B2 (enExample)
KR (1) KR20120041237A (enExample)
AU (1) AU2010281317A1 (enExample)
CA (1) CA2769940C (enExample)
WO (1) WO2011014951A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
US9029866B2 (en) 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
EP2465141B1 (en) 2009-08-04 2021-04-07 GaN Systems Inc. Gallium nitride microwave and power switching transistors with matrix layout
DE102010001788A1 (de) * 2010-02-10 2011-08-11 Forschungsverbund Berlin e.V., 12489 Skalierbarer Aufbau für laterale Halbleiterbauelemente mit hoher Stromtragfähigkeit
US8791508B2 (en) * 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
KR102052307B1 (ko) * 2011-11-09 2019-12-04 스카이워크스 솔루션즈, 인코포레이티드 전계 효과 트랜지스터 구조 및 관련된 무선-주파수 스위치
FR2984429B1 (fr) 2011-12-16 2014-02-14 Snecma Bandes d'amortissement de vibrations a evacuation de fluides, pour protection acoustique de carter de soufflante de turbomachine d'aeronef
US20140027778A1 (en) * 2012-07-25 2014-01-30 International Rectifier Corporation Robust Fused Transistor
US9331154B2 (en) * 2013-08-21 2016-05-03 Epistar Corporation High electron mobility transistor
EP3063792B1 (en) * 2013-10-29 2019-06-12 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
KR101729653B1 (ko) 2013-12-30 2017-04-25 한국전자통신연구원 질화물 반도체 소자
GB201418752D0 (en) * 2014-10-22 2014-12-03 Rolls Royce Plc Lateral field effect transistor device
DE102016103581B4 (de) * 2016-02-29 2019-11-14 Infineon Technologies Austria Ag Halbleitervorrichtung mit nadelförmigen Feldplatten und einer Gatestruktur mit Rand- und Knotenbereichen
US9842920B1 (en) 2016-07-12 2017-12-12 Semiconductor Components Industries, Llc Gallium nitride semiconductor device with isolated fingers
JP2018026401A (ja) * 2016-08-08 2018-02-15 アイシン精機株式会社 半導体デバイス
US10147796B1 (en) * 2017-05-26 2018-12-04 Stmicroelectronics Design And Application S.R.O. Transistors with dissimilar square waffle gate patterns
US10403624B2 (en) 2017-05-26 2019-09-03 Stmicroelectronics Design And Application S.R.O. Transistors with octagon waffle gate patterns
US10529802B2 (en) 2017-09-14 2020-01-07 Gan Systems Inc. Scalable circuit-under-pad device topologies for lateral GaN power transistors
US10218346B1 (en) 2017-09-14 2019-02-26 Gan Systems Inc. High current lateral GaN transistors with scalable topology and gate drive phase equalization
US11082039B2 (en) 2017-11-08 2021-08-03 Gan Systems Inc. GaN transistor with integrated drain voltage sense for fast overcurrent and short circuit protection
US11387169B2 (en) 2020-08-04 2022-07-12 Nxp Usa, Inc. Transistor with I/O ports in an active area of the transistor
US11502026B2 (en) 2020-10-12 2022-11-15 Nxp Usa, Inc. Transistor with flip-chip topology and power amplifier containing same
US11587852B2 (en) 2020-10-12 2023-02-21 Nxp Usa, Inc. Power amplifier modules with flip-chip and non-flip-chip power transistor dies

Family Cites Families (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3783349A (en) 1971-05-25 1974-01-01 Harris Intertype Corp Field effect transistor
JPS5631752B2 (enExample) * 1973-08-31 1981-07-23
JPS5089263U (enExample) * 1973-12-14 1975-07-29
JPS5181067U (enExample) * 1974-12-20 1976-06-28
US4152714A (en) * 1978-01-16 1979-05-01 Honeywell Inc. Semiconductor apparatus
NL8103218A (nl) * 1981-07-06 1983-02-01 Philips Nv Veldeffekttransistor met geisoleerde stuurelektrode.
JPS5868954A (ja) * 1981-10-20 1983-04-25 Mitsubishi Electric Corp 高周波トランジスタのパツケ−ジ
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
US4636825A (en) 1985-10-04 1987-01-13 Fairchild Semiconductor Corporation Distributed field effect transistor structure
JPH07112064B2 (ja) 1986-02-10 1995-11-29 株式会社東芝 絶縁ゲート電界効果型トランジスタ
US5068603A (en) * 1987-10-07 1991-11-26 Xilinx, Inc. Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays
JP2679333B2 (ja) * 1990-02-26 1997-11-19 日本電気株式会社 ショットキー障壁接合ゲート型電界効果トランジスタ
JP3039021B2 (ja) 1991-08-13 2000-05-08 松下電器産業株式会社 ロータリートランスの製造方法
JPH0589263A (ja) 1991-09-30 1993-04-09 Sanyo Electric Co Ltd データ処理装置
JP2948007B2 (ja) 1991-12-26 1999-09-13 日立電子株式会社 微動ステージ
US5355008A (en) 1993-11-19 1994-10-11 Micrel, Inc. Diamond shaped gate mesh for cellular MOS transistor array
US5517046A (en) * 1993-11-19 1996-05-14 Micrel, Incorporated High voltage lateral DMOS device with enhanced drift region
KR0137975B1 (ko) 1994-01-19 1998-06-15 김주용 반도체 장치 및 그 제조방법
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
US5767546A (en) 1994-12-30 1998-06-16 Siliconix Incorporated Laternal power mosfet having metal strap layer to reduce distributed resistance
DE19581809B4 (de) 1995-04-06 2008-12-24 Transpacific Ip, Ltd. MOS-Zelle, Mehrfachzellentransistor und IC-Chip
US5714784A (en) 1995-10-19 1998-02-03 Winbond Electronics Corporation Electrostatic discharge protection device
US6353290B1 (en) * 1996-03-06 2002-03-05 The United States Of America As Represented By The Secretary Of The Army Microwave field emitter array limiter
US5789791A (en) 1996-08-27 1998-08-04 National Semiconductor Corporation Multi-finger MOS transistor with reduced gate resistance
US6800903B2 (en) 1996-11-05 2004-10-05 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
JP3499103B2 (ja) 1997-02-21 2004-02-23 三菱電機株式会社 半導体装置
US6002156A (en) 1997-09-16 1999-12-14 Winbond Electronics Corp. Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
US6037822A (en) * 1997-09-30 2000-03-14 Intel Corporation Method and apparatus for distributing a clock on the silicon backside of an integrated circuit
US7560296B2 (en) * 2000-07-07 2009-07-14 Lumilog Process for producing an epitalixal layer of galium nitride
JP3441353B2 (ja) * 1998-01-29 2003-09-02 京セラ株式会社 電界効果型トランジスタ
DE69938776D1 (de) 1998-02-07 2008-07-03 Sirenza Microdevices Inc Rf-mos-transistor
US6084266A (en) * 1998-03-02 2000-07-04 Vanguard International Semiconductor Corporation Layout of semiconductor devices to increase the packing density of a wafer
US6100549A (en) * 1998-08-12 2000-08-08 Motorola, Inc. High breakdown voltage resurf HFET
JP2000208759A (ja) 1999-01-12 2000-07-28 Rohm Co Ltd 半導体装置
JP3587081B2 (ja) 1999-05-10 2004-11-10 豊田合成株式会社 Iii族窒化物半導体の製造方法及びiii族窒化物半導体発光素子
JP2001028425A (ja) * 1999-07-15 2001-01-30 Mitsubishi Electric Corp 半導体装置及びその製造方法
US6580098B1 (en) 1999-07-27 2003-06-17 Toyoda Gosei Co., Ltd. Method for manufacturing gallium nitride compound semiconductor
GB9919479D0 (en) 1999-08-17 1999-10-20 Imperial College Island arrays
JP4362905B2 (ja) 1999-09-21 2009-11-11 富士ゼロックス株式会社 自己走査型発光装置、書き込み用光源および光プリンタ
CN1315195C (zh) * 2000-02-10 2007-05-09 国际整流器有限公司 在单面上带块形连接的垂直导电倒装芯片式器件
JP4629826B2 (ja) 2000-02-22 2011-02-09 パナソニック株式会社 半導体集積回路装置
TW518767B (en) 2000-03-31 2003-01-21 Toyoda Gosei Kk Production method of III nitride compound semiconductor and III nitride compound semiconductor element
AU2001274810A1 (en) 2000-04-17 2001-10-30 Virginia Commonwealth University Defect reduction in gan and related materials
US6627974B2 (en) 2000-06-19 2003-09-30 Nichia Corporation Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
US6477023B1 (en) 2000-07-12 2002-11-05 United Microelectronics Corp. Electrostatic discharge protection apparatus
US20020071293A1 (en) 2000-07-13 2002-06-13 Eden Richard C. Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods a of forming power transistor
US6690042B2 (en) * 2000-09-27 2004-02-10 Sensor Electronic Technology, Inc. Metal oxide semiconductor heterostructure field effect transistor
US6548333B2 (en) 2000-12-01 2003-04-15 Cree, Inc. Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
US7233028B2 (en) 2001-02-23 2007-06-19 Nitronex Corporation Gallium nitride material devices and methods of forming the same
JP3763753B2 (ja) 2001-06-05 2006-04-05 豊田合成株式会社 Iii族窒化物系化合物半導体素子及びその製造方法
EP1420463A4 (en) 2001-08-22 2008-11-26 Sony Corp NITRID SEMICONDUCTOR ELEMENT AND METHOD FOR THE PRODUCTION THEREOF
US7398498B2 (en) * 2001-08-23 2008-07-08 Cadence Design Systems, Inc. Method and apparatus for storing routes for groups of related net configurations
US6555873B2 (en) 2001-09-07 2003-04-29 Power Integrations, Inc. High-voltage lateral transistor with a multi-layered extended drain structure
US6894397B2 (en) * 2001-10-03 2005-05-17 International Rectifier Corporation Plural semiconductor devices in monolithic flip chip
JP3524908B2 (ja) 2002-01-21 2004-05-10 株式会社半導体理工学研究センター 半導体装置
US6713823B1 (en) * 2002-03-08 2004-03-30 Volterra Semiconductor Corporation Conductive routings in integrated circuits
JP3968566B2 (ja) 2002-03-26 2007-08-29 日立電線株式会社 窒化物半導体結晶の製造方法及び窒化物半導体ウエハ並びに窒化物半導体デバイス
US6724044B2 (en) * 2002-05-10 2004-04-20 General Semiconductor, Inc. MOSFET device having geometry that permits frequent body contact
US20030218246A1 (en) * 2002-05-22 2003-11-27 Hirofumi Abe Semiconductor device passing large electric current
US7253486B2 (en) 2002-07-31 2007-08-07 Freescale Semiconductor, Inc. Field plate transistor with reduced field plate resistance
AU2003270578A1 (en) * 2002-09-10 2004-04-30 The Regents Of The University Of California Interconnection architecture and method of assessing interconnection architecture
TW560120B (en) 2002-09-20 2003-11-01 Chung Shan Inst Of Science Nitride based semiconductor laser diode device including a selective growth mask
US6972464B2 (en) 2002-10-08 2005-12-06 Great Wall Semiconductor Corporation Power MOSFET
JP4232584B2 (ja) 2002-10-15 2009-03-04 株式会社デンソー 半導体装置
JP4396200B2 (ja) 2002-10-30 2010-01-13 株式会社デンソー 半導体装置
JP4510370B2 (ja) 2002-12-25 2010-07-21 パナソニック株式会社 半導体集積回路装置
KR100493059B1 (ko) * 2003-04-18 2005-06-02 삼성전자주식회사 게이트 캐패시턴스를 감소시킬 수 있는 트랜지스터
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
US7135720B2 (en) 2003-08-05 2006-11-14 Nitronex Corporation Gallium nitride material transistors and methods associated with the same
JP2005117020A (ja) 2003-09-16 2005-04-28 Stanley Electric Co Ltd 窒化ガリウム系化合物半導体素子とその製造方法
KR100799857B1 (ko) 2003-10-27 2008-01-31 삼성전기주식회사 전극 구조체 및 이를 구비하는 반도체 발광 소자
DE102004058431B4 (de) * 2003-12-05 2021-02-18 Infineon Technologies Americas Corp. III-Nitrid Halbleitervorrichtung mit Grabenstruktur
JP4667756B2 (ja) * 2004-03-03 2011-04-13 三菱電機株式会社 半導体装置
US7622318B2 (en) 2004-03-30 2009-11-24 Sony Corporation Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and device
JP4810072B2 (ja) 2004-06-15 2011-11-09 株式会社東芝 窒素化合物含有半導体装置
US7943949B2 (en) 2004-09-09 2011-05-17 Bridgelux, Inc. III-nitride based on semiconductor device with low-resistance ohmic contacts
JP2006086398A (ja) * 2004-09-17 2006-03-30 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US20060073621A1 (en) 2004-10-01 2006-04-06 Palo Alto Research Center Incorporated Group III-nitride based HEMT device with insulating GaN/AlGaN buffer layer
JP4272142B2 (ja) 2004-12-07 2009-06-03 株式会社ルネサステクノロジ スイッチング素子並びにそれを用いたアンテナスイッチ回路及び高周波モジュール
JP4400441B2 (ja) * 2004-12-14 2010-01-20 三菱電機株式会社 半導体装置
JP4995722B2 (ja) 2004-12-22 2012-08-08 パナソニック株式会社 半導体発光装置、照明モジュール、および照明装置
TWI261891B (en) * 2004-12-24 2006-09-11 Richtek Technology Corp Power metal oxide semiconductor transistor layout with lower output resistance and high current limit
JP5076278B2 (ja) * 2005-03-14 2012-11-21 日亜化学工業株式会社 電界効果トランジスタ
US7294892B2 (en) 2005-05-27 2007-11-13 Faraday Technology Corp. Multi-transistor layout capable of saving area
JP4705412B2 (ja) * 2005-06-06 2011-06-22 パナソニック株式会社 電界効果トランジスタ及びその製造方法
JP2007103451A (ja) 2005-09-30 2007-04-19 Toshiba Corp 半導体装置及びその製造方法
JP5140962B2 (ja) * 2005-10-28 2013-02-13 日亜化学工業株式会社 窒化物半導体基板の製造方法
EP1965416A3 (en) 2005-12-22 2009-04-29 Freiberger Compound Materials GmbH Free-Standing III-N layers or devices obtained by selective masking of III-N layers during III-N layer growth
JP2007305954A (ja) * 2006-03-27 2007-11-22 Nichia Chem Ind Ltd 電界効果トランジスタ及びその装置
US7449762B1 (en) * 2006-04-07 2008-11-11 Wide Bandgap Llc Lateral epitaxial GaN metal insulator semiconductor field effect transistor
KR100782430B1 (ko) 2006-09-22 2007-12-05 한국과학기술원 고전력을 위한 내부전계전극을 갖는 갈륨나이트라이드기반의 고전자 이동도 트랜지스터 구조
JP5047575B2 (ja) 2006-09-29 2012-10-10 三井化学株式会社 表面保護フィルム
US7964895B2 (en) * 2006-10-05 2011-06-21 International Rectifier Corporation III-nitride heterojunction semiconductor device and method of fabrication
JP5186096B2 (ja) 2006-10-12 2013-04-17 パナソニック株式会社 窒化物半導体トランジスタ及びその製造方法
US8283699B2 (en) 2006-11-13 2012-10-09 Cree, Inc. GaN based HEMTs with buried field plates
JP5300238B2 (ja) 2006-12-19 2013-09-25 パナソニック株式会社 窒化物半導体装置
JP5082752B2 (ja) 2006-12-21 2012-11-28 日亜化学工業株式会社 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子
GB2447509A (en) * 2007-03-16 2008-09-17 Seiko Epson Corp Pattern for Inkjet TFT circuit development
US8212290B2 (en) 2007-03-23 2012-07-03 Cree, Inc. High temperature performance capable gallium nitride transistor
US7675131B2 (en) * 2007-04-05 2010-03-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same
WO2008141324A2 (en) * 2007-05-14 2008-11-20 S.O.I.Tec Silicon On Insulator Technologies Methods for improving the quality of epitaxially-grown semiconductor materials
JP4956281B2 (ja) 2007-05-29 2012-06-20 キヤノン株式会社 無線通信装置およびその制御方法
JP2008311355A (ja) 2007-06-13 2008-12-25 Rohm Co Ltd 窒化物半導体素子
JP5089263B2 (ja) 2007-06-20 2012-12-05 中国電力株式会社 空気混入抑制装置
EP2171747B1 (en) 2007-07-26 2016-07-13 Soitec Method for producing improved epitaxial materials
JP5307991B2 (ja) * 2007-07-27 2013-10-02 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置
GB2451884A (en) 2007-08-16 2009-02-18 Sharp Kk A Semiconductor Device and a Method of Manufacture Thereof
JP2009076866A (ja) * 2007-08-31 2009-04-09 Sumitomo Electric Ind Ltd ショットキーバリアダイオード
JP4762217B2 (ja) 2007-09-28 2011-08-31 富士フイルム株式会社 導光板、導光板ユニットおよび面状照明装置
WO2009067526A2 (en) * 2007-11-19 2009-05-28 Sheats James R High-efficiency, high current solar cell and solar module
US8085553B1 (en) * 2007-12-27 2011-12-27 Volterra Semiconductor Corporation Lead assembly for a flip-chip power switch
US7989953B1 (en) * 2007-12-28 2011-08-02 Volterra Semiconductor Corporation Flip chip power switch with under bump metallization stack
US20090242961A1 (en) * 2008-03-31 2009-10-01 Sanh Tang Recessed channel select gate for a memory device
US8343824B2 (en) * 2008-04-29 2013-01-01 International Rectifier Corporation Gallium nitride material processing and related device structures
CN101299439B (zh) * 2008-06-24 2011-06-22 广州南科集成电子有限公司 耐高压恒流源器件及制造方法
WO2010013195A1 (en) * 2008-07-28 2010-02-04 Nxp B.V. Integrated circuit and method for manufacturing an integrated circuit
EP2151852B1 (en) 2008-08-06 2020-01-15 Soitec Relaxation and transfer of strained layers
US8367520B2 (en) 2008-09-22 2013-02-05 Soitec Methods and structures for altering strain in III-nitride materials
US9117944B2 (en) 2008-09-24 2015-08-25 Koninklijke Philips N.V. Semiconductor light emitting devices grown on composite substrates
EP2346071B1 (en) 2008-10-29 2017-04-05 Fujitsu Limited Compound semiconductor device and method for manufacturing the same
US7851856B2 (en) 2008-12-29 2010-12-14 Alpha & Omega Semiconductor, Ltd True CSP power MOSFET based on bottom-source LDMOS
JP5487631B2 (ja) 2009-02-04 2014-05-07 富士通株式会社 化合物半導体装置及びその製造方法
WO2010118087A1 (en) 2009-04-08 2010-10-14 Efficient Power Conversion Corporation Enhancement mode gan hemt device and method for fabricating the same
EP2465141B1 (en) 2009-08-04 2021-04-07 GaN Systems Inc. Gallium nitride microwave and power switching transistors with matrix layout
US9029866B2 (en) 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
JP5414415B2 (ja) 2009-08-06 2014-02-12 株式会社日立製作所 半導体受光素子及びその製造方法
US8134205B2 (en) 2010-01-06 2012-03-13 Ptek Technology Co., Ltd. Layout structure of power MOS transistor

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