JP2015533258A5 - - Google Patents

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Publication number
JP2015533258A5
JP2015533258A5 JP2015523103A JP2015523103A JP2015533258A5 JP 2015533258 A5 JP2015533258 A5 JP 2015533258A5 JP 2015523103 A JP2015523103 A JP 2015523103A JP 2015523103 A JP2015523103 A JP 2015523103A JP 2015533258 A5 JP2015533258 A5 JP 2015533258A5
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JP
Japan
Prior art keywords
bonding
patent document
wire
ball
energy
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JP2015523103A
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English (en)
Japanese (ja)
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JP2015533258A (ja
JP6297553B2 (ja
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Priority claimed from PCT/US2013/048860 external-priority patent/WO2014014643A1/en
Publication of JP2015533258A publication Critical patent/JP2015533258A/ja
Publication of JP2015533258A5 publication Critical patent/JP2015533258A5/ja
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Publication of JP6297553B2 publication Critical patent/JP6297553B2/ja
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JP2015523103A 2012-07-17 2013-07-01 ワイヤ配線構造を形成する方法 Active JP6297553B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261672449P 2012-07-17 2012-07-17
US61/672,449 2012-07-17
PCT/US2013/048860 WO2014014643A1 (en) 2012-07-17 2013-07-01 Methods of forming wire interconnect structures

Publications (3)

Publication Number Publication Date
JP2015533258A JP2015533258A (ja) 2015-11-19
JP2015533258A5 true JP2015533258A5 (enExample) 2016-06-16
JP6297553B2 JP6297553B2 (ja) 2018-03-20

Family

ID=49949169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015523103A Active JP6297553B2 (ja) 2012-07-17 2013-07-01 ワイヤ配線構造を形成する方法

Country Status (6)

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US (3) US9502371B2 (enExample)
JP (1) JP6297553B2 (enExample)
KR (1) KR102094563B1 (enExample)
CN (1) CN104471693B (enExample)
TW (1) TWI531015B (enExample)
WO (1) WO2014014643A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014014643A1 (en) * 2012-07-17 2014-01-23 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures
US9870946B2 (en) 2013-12-31 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level package structure and method of forming same
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
US10256208B2 (en) 2014-10-03 2019-04-09 Intel Corporation Overlapping stacked die package with vertical columns
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP2022033633A (ja) 2020-08-17 2022-03-02 キオクシア株式会社 半導体装置
KR20220045684A (ko) 2020-10-06 2022-04-13 에스케이하이닉스 주식회사 지그재그 모양의 와이어를 포함하는 반도체 패키지
JP7471692B2 (ja) * 2020-11-25 2024-04-22 株式会社新川 ワイヤ形成方法及び半導体装置の製造方法
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
JP7441558B2 (ja) 2021-09-16 2024-03-01 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
JP7741745B2 (ja) 2022-02-15 2025-09-18 キオクシア株式会社 半導体装置およびその製造方法
TW202347637A (zh) 2022-02-15 2023-12-01 美商庫利克和索夫工業公司 確定用於產生與工件相關的複數個導線迴路的順序的方法

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DE3536908A1 (de) * 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
US6295729B1 (en) * 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6836962B2 (en) * 1993-11-16 2005-01-04 Formfactor, Inc. Method and apparatus for shaping spring elements
US5421503A (en) * 1994-08-24 1995-06-06 Kulicke And Soffa Investments, Inc. Fine pitch capillary bonding tool
JPH09289276A (ja) * 1996-04-23 1997-11-04 Hitachi Ltd リードフレームおよびそれを用いた半導体装置
EP1158579B1 (en) * 1996-10-01 2008-11-19 Panasonic Corporation Wire bonding capillary for forming bump electrodes
JPH10135219A (ja) * 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
JPH10135220A (ja) 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
JP3189115B2 (ja) * 1996-12-27 2001-07-16 株式会社新川 半導体装置及びワイヤボンディング方法
US7032311B2 (en) * 2002-06-25 2006-04-25 Eli Razon Stabilized wire bonded electrical connections and method of making same
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
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JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
US7255538B2 (en) * 2005-02-09 2007-08-14 Hamilton Sundstrand Corporation Shrink-fit stress coupling for a shaft of differing materials
JP4744238B2 (ja) * 2005-08-29 2011-08-10 田中電子工業株式会社 ワイヤの切断方法
JP4530975B2 (ja) * 2005-11-14 2010-08-25 株式会社新川 ワイヤボンディング方法
JP4509043B2 (ja) * 2006-02-14 2010-07-21 株式会社新川 スタッドバンプの形成方法
JPWO2008117488A1 (ja) * 2007-03-23 2010-07-08 三洋電機株式会社 半導体装置およびその製造方法
WO2014014643A1 (en) * 2012-07-17 2014-01-23 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures

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