WO2014014643A1 - Methods of forming wire interconnect structures - Google Patents

Methods of forming wire interconnect structures Download PDF

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Publication number
WO2014014643A1
WO2014014643A1 PCT/US2013/048860 US2013048860W WO2014014643A1 WO 2014014643 A1 WO2014014643 A1 WO 2014014643A1 US 2013048860 W US2013048860 W US 2013048860W WO 2014014643 A1 WO2014014643 A1 WO 2014014643A1
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WO
WIPO (PCT)
Prior art keywords
wire
bond
length
location
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/048860
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English (en)
French (fr)
Inventor
Thomas J. COLOSIMO, Jr.
Jon W. Brunner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Priority to CN201380037938.4A priority Critical patent/CN104471693B/zh
Priority to US14/413,475 priority patent/US9502371B2/en
Priority to KR1020157000968A priority patent/KR102094563B1/ko
Priority to JP2015523103A priority patent/JP6297553B2/ja
Publication of WO2014014643A1 publication Critical patent/WO2014014643A1/en
Anticipated expiration legal-status Critical
Priority to US15/298,406 priority patent/US9865560B2/en
Priority to US15/678,619 priority patent/US10153247B2/en
Ceased legal-status Critical Current

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Definitions

  • the present invention relates to semiconductor packaging, and more particularly, to improved methods of forming wire interconnect structures.
  • a wire bonder i .e., wire bonding machine
  • wire bonding machine may form wire loops between respective locations to be electrically interconnected.
  • Exemplary wire bonding techniques include ball bonding and wedge bonding. Steps in a ball bonding application include : bonding a free air ball to a first bond location (e.g., a die pad of a
  • a semiconductor die extending a length of wire continuous with the bonded free air ball to a second bond location (e.g ., a lead of a leadframe) ; and bonding the wire to the second bond location, thereby forming a wire loop between the first bond location and the second bond location.
  • a second bond location e.g ., a lead of a leadframe
  • bond sites e.g ., die pads, leads, etc.
  • bonding energy may be used including, for example, ultrasonic energy, thermosonic energy, thermo- compressive energy, amongst others.
  • Wire bonding machines have also been used to form wire contacts and interconnects having a free end for a number of years.
  • U.S. Patent No. 5,476,211 to Khandros discloses forming such conductive contacts using ball bonding techniques.
  • conventional techniques of forming such wire contacts and interconnects suffer from a lack of consistency (e.g., height consistency, shape consistency, etc.) and undesirable shapes of the wire contacts and interconnects.
  • a method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool ; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond ; and (e) separating (e.g ., stretching and tearing) the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
  • a method of forming a wire interconnect structure comprising the steps of:
  • FIGS. 1A-1I are block, side view diagrams illustrating formation of vertical wire interconnects in accordance with an exemplary embodiment of the present invention.
  • FIG. 2 is a block, side view diagram illustrating formation of vertical wire interconnects on a substrate in accordance with another exemplary embodiment of the present invention.
  • interconnect structures or "wire interconnect structures” are intended to refer to conductive structures that may be used to provide any type of electrical interconnection (e.g ., a temporary interconnection as in a contact used for testing, a permanent interconnection as in a semcionductor package interconnect, etc.).
  • FIGS. 1A-1I illustrate a method of forming one or more wire interconnect structures in accordance with an exemplary embodiment of the present invention.
  • free air ball 106 is seated at the tip of bonding tool 104 (e.g ., wire bonding tool 104) with wire 110 extending upwardly through a bore, or the like, in wire bonding tool 104 and through open wire clamp 108.
  • Wire bonding tool 104 and wire clamp 108 are carried by a common bond head assembly (not shown) and as such, move together, for example, in a vertical Z axis.
  • free air ball 106 is formed on an end of wire 110 that hangs below the tip of bonding tool 104 using an electronic flame-off device or the like (not shown) . It will be understood that, many elements are omitted from the simplified views of FIGS. 1A-1I (e.g., an ultrasonic transducer carrying bonding tool 104, etc.) .
  • wire 110 is drawn upwards (e.g., using a vacuum control tensioner or the like) such that free air ball 106 is seated at the tip of bonding tool 104 as shown in FIG. 1A.
  • Wire bonding tool 104 and wire clamp 108 are positioned over substrate 100.
  • substrate 100 may be any type of element to which a wire interconnect may be bonded .
  • Exemplary substrates include leadframes, semiconductor die, BGA (ball grid array) package elements, flip chip elements, package-on-package (POP) elements, etc.
  • Bonding location 102 may be any type structure configured to receive a wire interconnect. For example, if substrate 100 is a semiconductor die then bonding location 102 may be a die pad . Other exemplary bonding locations include leads, circuits traces, etc.
  • bonding tool 104 and wire clamp 108 are then moved downwardly, as at the arrows in a downward Z direction, towards bonding location 102 (e.g., along with other elements of the bond head assembly) .
  • bonding tool 104 and wire clamp 108 are lowered and free air ball 106 contacts bonding location 102 and will form a ball bond using, for example, bonding force, ultrasonic energy, and heat (e.g., a heat block positioned below substrate 100, not shown) .
  • bonding force e.g., ultrasonic energy
  • heat e.g., a heat block positioned below substrate 100, not shown
  • ball bond 112 has now been formed, and bonding tool 104 and wire clamp 108 (in an open position) are moved upwardly while extending a length of wire 114 from ball bond 112 towards another location 116.
  • Length of wire 114 is continuous with ball bond 112.
  • Length of wire 114 may be extended in a single step, or a plurality of steps and associated motions, as desired .
  • the motions used to extend length of wire 114 may be similar to conventional looping motions used to extend a wire loop from a first bond location to a second bond location; however, the portion of wire 114 adjacent tip 120 of bonding tool 104 is not ultrasonically bonded/welded to another location 116.
  • a predetermined level of bond force (e.g ., likely without ultrasonic energy), is applied to tip 120 of wire bonding tool 104 to press the portion of wire 114 against other location 116 (e.g ., see FIG. ID).
  • wire bonding tool 104 is moved to a predetermined position such that a bond force is applied to press the portion of wire 114 against other location 116.
  • this pressing may "deform," or partially cut, pressed portion 118 of wire 114 beneath tip side 120a of bonding tool 104, for example, shown as deformed/cut wire portion 118.
  • deformed/cut wire portion 118 has not been bonded/welded to another location 116. Rather, it may be temporarily stuck to another location 116 during the formation of deformed/cut wire portion 118.
  • wire bonding tool 104 and wire clamp 108 (e.g., in a closed position, but may be open if desired) have been raised to a position above ball bond 112 with wire 110, having deformed/cut wire portion 118, continuous with ball bond 112.
  • a position may be considered to be a top of loop (i .e., TOL) position in conventional wire looping terminology.
  • wire clamp 108 has been moved to an open position, and wire bonding tool 104 and open wire clamp 108 are being raised, as at the arrows in an upward Z direction, to pay out another portion of wire 114' (e.g., a tail length of wire 114') from wire bonding tool tip 120 that is continuous with deformed/cut wire portion 118.
  • wire portion 114' may become a wire tail for a subsequent free air ball.
  • pressed wire portion 118 of wire 110 may be a partial cut in wire 110, and separates wire portions 114, 114'. As illustrated in FIG.
  • wire clamp 108 is closed over an upper portion of wire 110 and, as illustrated in FIG. 1H, wire bonding tool 104 and wire clamp 108 are then raised as at the arrows in an upward Z direction to separate wire 110 proximate deformed/cut wire portion 118 to form wire interconnect structure 122.
  • the enlarged portion of the circle below the tip of wire bonding tool 104 more clearly shows that wire interconnect structure 122 (separated from wire portion 114') may have an upper tapered, or sharp, end 124.
  • FIG. II illustrates substrate 100 with other wire interconnect structures 122 formed on additional bonding locations 102 by the repeating of the method described above. As illustrated, wire interconnect structures 122 may be vertically erect, or substantially so.
  • a portion of wire 114 is pressed against another location 116.
  • another location 116 may be a portion of substrate 100 (e.g. a surface portion of substrate 100, etc.) .
  • the pressing of wire portion 118 may occur at a location other than substrate 100 (e.g ., on another substrate or structure), such as at another location/substrate 200 shown in FIG. 2 that is not (directly) part of substrate 100.
  • Wire interconnect structures formed in accordance with the present invention may have improved consistency in height and resultant wire tail lengths, as well as increased efficiency in production (e.g ., an increase in unit per hour produced) .
  • Wire interconnect structures formed in accordance with the present invention may be used, for example, as contact structures in probe cards, as interconnects between die in stacked die applications, as interconnects in flip chip applications, as interconnects in through silicon via or through mold via applications, as interconnects between packages in POP (package on package) applications, amongst others.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
PCT/US2013/048860 2012-07-17 2013-07-01 Methods of forming wire interconnect structures Ceased WO2014014643A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201380037938.4A CN104471693B (zh) 2012-07-17 2013-07-01 形成导线互连结构的方法
US14/413,475 US9502371B2 (en) 2012-07-17 2013-07-01 Methods of forming wire interconnect structures
KR1020157000968A KR102094563B1 (ko) 2012-07-17 2013-07-01 와이어 상호접속 구조를 형성하는 방법
JP2015523103A JP6297553B2 (ja) 2012-07-17 2013-07-01 ワイヤ配線構造を形成する方法
US15/298,406 US9865560B2 (en) 2012-07-17 2016-10-20 Methods of forming wire interconnect structures
US15/678,619 US10153247B2 (en) 2012-07-17 2017-08-16 Methods of forming wire interconnect structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261672449P 2012-07-17 2012-07-17
US61/672,449 2012-07-17

Related Child Applications (2)

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US14/413,475 A-371-Of-International US9502371B2 (en) 2012-07-17 2013-07-01 Methods of forming wire interconnect structures
US15/298,406 Continuation US9865560B2 (en) 2012-07-17 2016-10-20 Methods of forming wire interconnect structures

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JP (1) JP6297553B2 (enExample)
KR (1) KR102094563B1 (enExample)
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TW (1) TWI531015B (enExample)
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US9865560B2 (en) 2018-01-09
US20170345787A1 (en) 2017-11-30
US10153247B2 (en) 2018-12-11
KR20150036074A (ko) 2015-04-07
US20170040280A1 (en) 2017-02-09
US20150132888A1 (en) 2015-05-14
KR102094563B1 (ko) 2020-03-27
JP2015533258A (ja) 2015-11-19
CN104471693A (zh) 2015-03-25
TW201405683A (zh) 2014-02-01
JP6297553B2 (ja) 2018-03-20
US9502371B2 (en) 2016-11-22
CN104471693B (zh) 2018-05-08
TWI531015B (zh) 2016-04-21

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