JP5714195B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5714195B2 JP5714195B2 JP2014556665A JP2014556665A JP5714195B2 JP 5714195 B2 JP5714195 B2 JP 5714195B2 JP 2014556665 A JP2014556665 A JP 2014556665A JP 2014556665 A JP2014556665 A JP 2014556665A JP 5714195 B2 JP5714195 B2 JP 5714195B2
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- 239000004065 semiconductor Substances 0.000 title claims description 111
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 claims description 43
- 230000001174 ascending effect Effects 0.000 claims description 20
- 238000005304 joining Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
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Description
以上
以上
Claims (4)
- 半導体装置の製造方法であって、
キャピラリによってワイヤの側面を一の電極に押し付けて、前記ワイヤの側面を前記一の電極に接合する接合工程と、前記接合工程の後、キャピラリによって前記ワイヤを他の電極上までルーピングするルーピング工程と、を交互に繰り返して3つ以上の半導体チップまたは基板の電極を共通のワイヤによって順次接続し、
前記ルーピング工程は、
前記接合工程の後、前記一の電極から前記キャピラリを垂直に上昇させる第一上昇工程と、
前記第一上昇工程の後、前記他の電極の方に向って斜め下方向に前記キャピラリを移動させる第一の斜め移動工程と、
前記第一の斜め移動工程の後、再度、前記キャピラリを垂直に上昇させる第二上昇工程と、
前記第二上昇工程の後、前記他の電極と反対側に向って斜め下方向に前記キャピラリを移動させるリバース工程と、
前記リバース工程の後、前記一の電極直上まで斜め上方向に前記キャピラリを移動させる第二の斜め移動工程と、
前記第二の斜め移動工程の後、再度、前記キャピラリを垂直に上昇させる第三上昇工程と、
前記第三上昇工程の後、前記他の電極の直上に向って弧状にキャピラリを移動させる弧状移動工程と、
を含む半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法であって、
前記接合工程は、前記キャピラリによって前記共通のワイヤをその直径の1/4〜1/2の厚さに押しつぶして扁平形状にすると共に超音波加振を行って前記共通のワイヤを前記各電極に接合する半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法であって、
前記リバース工程は、前記接合工程において前記ワイヤの側面が接合された接合部を通る前記電極に垂直な線に対する角度が10〜20°となる点までキャピラリを移動させる半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法であって、
前記電極のうちの少なくとも1つは、半導体チップの表面から凹んだパッドであり、
前記接合工程は、
前記キャピラリによって前記共通のワイヤを前記パッドの凹み深さよりも厚い厚さに押しつぶして扁平形状にすると共に超音波加振を行って前記共通のワイヤを前記パッドに接合する半導体装置の製造方法。
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JPWO2017078109A1 (ja) * | 2015-11-05 | 2018-08-30 | 株式会社新川 | 半導体装置およびその製造方法 |
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