TWI531015B - 形成導線互連結構的方法 - Google Patents

形成導線互連結構的方法 Download PDF

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Publication number
TWI531015B
TWI531015B TW102125018A TW102125018A TWI531015B TW I531015 B TWI531015 B TW I531015B TW 102125018 A TW102125018 A TW 102125018A TW 102125018 A TW102125018 A TW 102125018A TW I531015 B TWI531015 B TW I531015B
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Taiwan
Prior art keywords
wire
forming
solder ball
substrate
bonding
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TW102125018A
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English (en)
Chinese (zh)
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TW201405683A (zh
Inventor
湯瑪斯Ｊ 科洛西莫
約翰Ｗ 布倫納
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庫利克和索夫工業公司
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    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW102125018A 2012-07-17 2013-07-12 形成導線互連結構的方法 TWI531015B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261672449P 2012-07-17 2012-07-17

Publications (2)

Publication Number Publication Date
TW201405683A TW201405683A (zh) 2014-02-01
TWI531015B true TWI531015B (zh) 2016-04-21

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US (3) US9502371B2 (enExample)
JP (1) JP6297553B2 (enExample)
KR (1) KR102094563B1 (enExample)
CN (1) CN104471693B (enExample)
TW (1) TWI531015B (enExample)
WO (1) WO2014014643A1 (enExample)

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JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
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US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP2022033633A (ja) 2020-08-17 2022-03-02 キオクシア株式会社 半導体装置
KR20220045684A (ko) 2020-10-06 2022-04-13 에스케이하이닉스 주식회사 지그재그 모양의 와이어를 포함하는 반도체 패키지
JP7471692B2 (ja) * 2020-11-25 2024-04-22 株式会社新川 ワイヤ形成方法及び半導体装置の製造方法
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
JP7441558B2 (ja) 2021-09-16 2024-03-01 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
JP7741745B2 (ja) 2022-02-15 2025-09-18 キオクシア株式会社 半導体装置およびその製造方法
TW202347637A (zh) 2022-02-15 2023-12-01 美商庫利克和索夫工業公司 確定用於產生與工件相關的複數個導線迴路的順序的方法

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US10153247B2 (en) 2018-12-11
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US20170040280A1 (en) 2017-02-09
US20150132888A1 (en) 2015-05-14
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JP2015533258A (ja) 2015-11-19
CN104471693A (zh) 2015-03-25
TW201405683A (zh) 2014-02-01
JP6297553B2 (ja) 2018-03-20
US9502371B2 (en) 2016-11-22
WO2014014643A1 (en) 2014-01-23
CN104471693B (zh) 2018-05-08

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