CN106158778B - 具有侧面接触垫和底部接触垫的集成电路封装 - Google Patents

具有侧面接触垫和底部接触垫的集成电路封装 Download PDF

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CN106158778B
CN106158778B CN201510226315.2A CN201510226315A CN106158778B CN 106158778 B CN106158778 B CN 106158778B CN 201510226315 A CN201510226315 A CN 201510226315A CN 106158778 B CN106158778 B CN 106158778B
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die
contact pads
leads
substrate module
conductive contacts
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CN106158778A (zh
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徐艳博
毕建设
王津生
王志杰
宗飞
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NXP USA Inc
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NXP USA Inc
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Priority to US14/850,958 priority patent/US9362212B1/en
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Abstract

本公开涉及具有侧面接触垫和底部接触垫的集成电路封装。封装的集成电路器件包括基板模块、引线、具有第一和第二组管芯接触垫的IC管芯、以及封装剂。基板模块具有分别在其上表面和下表面的上导电接触件组和下导电接触件组。上导电接触件组被电连接至下导电接触件组。第一组管芯接触垫被电连接至上导电接触件组。第二组管芯接触垫被电连接至引线。某些实施例为具有引线和支撑不同类型的外部连接(诸如BGA和QFN)的导电球两者的多形式封装器件。

Description

具有侧面接触垫和底部接触垫的集成电路封装
背景技术
本发明涉及集成电路(IC)封装，并且更具体地，涉及多形式IC封装。
存在许多常规类型的IC封装。大部分常规IC封装至少包括(i)IC管芯，(ii)用于将管芯电连接至其他电子组件的导电接口，诸如印刷电路板(PCB)，以及(iii)密封管芯以保护管芯并保持管芯贴附至导电接口的密封剂。导电接口为具有导电迹线的引线框或衬底。
常规封装类型包括例如双列直插式封装(DIP)、四方扁平封装(QFP)、四方扁平封装无引脚(QFN)、球栅阵列(BGA)和针栅阵列(PGA)。对于特定应用选择特定封装类型取决于多个因素。一些应用要求相对大量的对于IC器件的输入/输出(I/O)互连。对于那些应用中的一些，增加I/O互连的密度可以以生产成本为代价增加芯片的利用率。如这里使用，术语“芯片”指的是封装的、切单的IC器件。
附图说明
从以下的具体描述、所附权利更求和附图，本发明的方面、特征和优点会全部变得明显，其中相似的附图标记指类似的或相同的元件。注意，附图中的元件未按比例绘制。
图1A为包括衬底模块的二维阵列的衬底板的简化的俯视图；
图1B为图1A的衬底模块的简化的放大截面侧视图；
图1C为图1A的衬底板的简化的底视图；
图1D为在将引线框阵列附接至衬底板的上面之后，包括图1A的衬底板和引线框阵列的装配件的简化俯视图；
图1E为在将IC管芯附接至对应的衬底模块之后的图1D的装配件的简化俯视图；
图1F为衬底模块、对应的引线框模块和图1E中附接的IC管芯中的一个的简化放大的截面侧视图；
图1G为将IC管芯电连接(使用接合引线)至对应的引线框模块之后的图1E的装配件的简化俯视图；
图1H为图1G中的衬底模块、对应的引线框模块、附接的IC管芯中的一个以及对应的接合引线的简化放大的截面侧视图；
图1I为使用封装剂的封装之后的图1G的装配件的简化俯视图。
图1J为图1I中的衬底模块、对应的引线框模块、附接的IC管芯中的一个、对应接合引线以及对应封装剂的简化放大的截面侧视图；
图1K为图1I中的装配件的切单产生的多形式芯片的简化俯视图；
图1L为图1K的多形式芯片的简化改大截面侧视图；以及
图1M为图1K的多形式芯片的底部透视图。
具体实施方式
在此公开了本发明的详细的说明性实施例。然而，出于描述本发明的示例性实施例的目的，这里公开的具体结构和功能的细节仅仅是代表性的。本发明的实施例可以用许多可替代的形式来实现并且不应当被看作仅限于这里所阐明的实施例。另外，这里使用的术语仅用于描述特定实施例的目的，并非意在限制本发明的示例性实施例。
除非上下文清楚地指示另外的情况，否则如这里使用的单数形式“一”、“一个”、“所述”也意在包括复数形式。进一步理解，术语“包括”、“包含”、“具有”、“含有”、“拥有”和/或“配有”指明了所陈述的特征、步骤或组件的存在，但并不排除一个或多个其他的特征、步骤或组件的存在或附加。还应当指出的是，在一些可替代的实施方式中，所提及的功能/动作可以不按照图中提及的顺序进行。
在一个实施例中，IC管芯被封装，以使导电接口包括底面上的接触垫阵列和芯片侧面上的引线两者。一个实施方式可以考虑修改的QFN和BGA封装类型的组合。
图1A-1M示出根据本发明的一个实施例的图1L、1M和1K的示例性多形式芯片121的组装步骤。组装过程包括引线框堆叠、管芯安装、引线接合、封装和切单。
图1A为衬底板100的的简化俯视图，其包括10个衬底模块101的二维阵列。图1B为图1A中的衬底模块101中的一个沿着剖切线YY的简化放大截面侧视图。图1B的衬底模块101代表全部衬底模块101。图1C为图1A的衬底板100的简化底视图。每个衬底模块101包括对应的衬底材料102。衬底板100还包括衬底材料外围104。衬底材料102和104可以为例如基于环氧树脂的材料。衬底板100可以为例如设计用于组装BGA封装的常规衬底板。
衬底模块101包括对应的衬底材料102。如图1A和1B所示，衬底模块101在衬底材料102的上表面106上具有三十六个上接触垫103的6＊6阵列。如图1B和1C所示，衬底模块101在衬底材料102的底表面107上具有对应的三十六个下接触垫105的6＊6阵列。
上接触垫103设计用于利用诸如接合球或接合凸块的导电球来附接IC管芯。下接触垫105(其为特定类型的底侧导电连接器)用于使用导电球附接至PCB或其他组件。单独地以及作为阵列全体地，上接触垫103小于下接触垫105。上阵列的间距小于下阵列的间距。再分布层(RDL)108被插入在上接触垫103和下接触垫105之间，再分布层108将每个上接触垫103连接至对应的下接触垫105。再分布层108可以包括衬底材料102内的水平迹线和通过衬底材料102的垂直通孔。要指出的是，像其他对应的截面侧视图一样，图1B未示出再分布层108的迹线和通孔。
图1D为将引线框阵列110附接至衬底板100的上面之后，包括图1A的衬底板100和引线框阵列110的装配件109的简化俯视图。引线框阵列110类似于修改为去掉管芯垫和系杆的QFN引线框。引线框阵列110包括对应于十个衬底模块101的十个引线框模块111。每个引线框模块111包括四个支撑杆112。要指出的是，相邻的引线框模块111的支撑杆112是共享的。
每个引线框模块111支撑32个引线指113，其中每个引线框模块111的每个支撑杆112支撑8个对应的引线指113。
图1E为在将10个IC管芯114附接至对应的10个衬底模块101之后的图1D的装配件109的简化俯视图。图1F为图1E中衬底模块101、对应的引线框模块111和对应的附接IC管芯114中的一个沿着剖割线YY的简化放大截面侧视图。
使用36个对应的导电球117将IC管芯114电连接并附接至衬底模块101的上接触垫103。除了导电球117之外，可以另外使用置于IC管芯114和衬底模块101的衬底材料102之间的底部填充剂(未示出)将IC管芯114附接至衬底模块101。
IC管芯114为硅穿孔(TSV)管芯，其在管芯顶端115处具有有源层(未示出)(即具有有源器件的层)。IC管芯114具有将管芯顶部115处的有源层连接至在管芯底部116处的管芯底部接触垫(未示出)的通孔(未示出)。使用对应的导电球117将IC管芯114的管芯底部接触垫连接至对应的上接触垫103。IC管芯114在管芯顶部115上另外具有接合垫(未示出)，其可以被用于将IC管芯114电连接(例如通过引线接合)至对应的引线框模块111。
图1G为在将IC管芯114电连接(使用接合引线118)至对应的引线框模块111之后的图1E的装配件109的简化俯视图。
图1H为图1G中衬底模块101、对应的引线框模块111、对应的附接IC管芯114和对应的接合引线118沿着剖割线YY的简化放大截面侧视图。使用对应的接合引线118将IC管芯114的管芯顶部115上的接触垫电连接至对应的引线指113。
图1I为使用封装剂119封装之后的图1G的装配件109的简化俯视图。图1J为图1I中衬底模块101、对应的引线框模块111、对应的附接IC管芯114、对应的接合引线118和对应的封装剂119沿着剖割线YY的简化放大截面侧视图。
在封装之后，装配件109经历切单(也叫作划片)步骤，在其中衬底模块101被切单(即通过沿着剖割线120切开而相互分离)。可以使用激光(未示出)或圆锯(未示出)完成切单，在这种情况下，剖割线120可以说是表示用于圆锯切开的切割道(saw street)。切单包括：(i)移除引线指113的远端部，留下对应的引线113，(ii)移除封装剂119的远端部，以及(iii)移除每个衬底模块101的衬底材料102的远端部以对应的多形式芯片121而结束。
图1K为图1I的装配件109的对应的衬底模块101的切单产生的多形式芯片121中的一个的简化俯视图。图1L为图1K的多形式芯片121的简化放大截面侧视图。图1M为图1K的多形式芯片121的底部透视图。多形式芯片121准备使用下接触垫105(可以使用导电球连接至PCB)和引线113(可以使用导电凸块或焊料连接至PCB)两者附接至对应的PCB。使用下接触垫105和引线113两者允许多形式芯片121的输入/输出节点的密度比通过只使用下接触垫或只使用引线而获取的输入/输出节点的密度更高。
已经描述了本发明的实施例，其中衬底模块包括上接触垫的6＊6阵列、对应的下接触垫的6＊6阵列和插在其间将每个上接触垫连接至对应的下接触垫的再分布层。然而，本发明不受如此限制。可替代的实施方式可以具有可以以任意适合方式设置的不同数目的上接触垫。可替代的实施方式可以具有可以以任意适合方式设置的不同数目的下接触垫。可替代的实施方式可以具有可以以任意合适的方式将任意数目的上接触垫连接至任意数目的下接触垫的再分布层。
已经描述了本发明的实施例，其中衬底板包括衬底模块和衬底材料外围。然而，本发明不受如此限制。在一些可替代的实施例中，衬底板包括一个或多个衬底模块，而不包括衬底材料外围。
已经描述了本发明的实施例，其中衬底模块的单个上接触垫小于单个下接触垫，并且上接触垫阵列的间距小于下接触垫阵列的间距。然而，本发明不受如此限制。在一些可替代的实施例中，上接触垫的尺寸与下接触垫相同，或大于下接触垫的尺寸。在一些可替代的实施例中，上接触垫阵列的间距与下接触垫阵列的间距相同或大于下接触垫阵列的间距。
已经描述了本发明的实施例，其中通过再分布层将衬底模块的上接触垫电连接至对应的下接触垫。然而，本发明不受如此限制。在可替代的实施例中，在没有中间再分布层的情况下，使用通过衬底材料的垂直通孔将上接触垫电连接至对应的下接触垫。
已经描述了本发明的实施例，其中下接触垫为用于球形接合附接的接合垫。然而，本发明不受如此限制。衬底模块的可替代实施方式可以替代性地具有其他类型的底面导电连接器，诸如但不限于，(i)对于对应插口的引脚，或者(ii)对于对应插座上对应引脚的开口。
已经描述了本发明的实施例，其中上接触垫的顶部与对应衬底材料的上表面齐平，并且下接触垫的底部与对应衬底材料的底表面齐平。然而，本发明不受如此限制。可替代的实施方式可以具有凹进在对应衬底材料内或延伸到对应衬底材料外的上和/或下接触垫。
已经描述了本发明的实施例，其中IC管芯为通过管芯底部接触垫(使用导电球连接至衬底模块的上接触垫)电连接至下接触垫的TSV管芯。然而，本发明不受如此限制。在一些可替代的实施例中，在IC管芯顶部处的管芯顶部接合垫被引线接合至衬底模块的上接触垫以及对应引线框的引线指。
已经描述了本发明的实施例，其中IC管芯的有源层在管芯顶部。然而，本发明不受如此限制。在一些可替代的实施例中，IC管芯的有源层在管芯底部，其中IC管芯被用作倒装管芯。在这些可替代的实施例中，硅穿孔被用于将管芯底部处的有源层连接至IC管芯的管芯顶部接触垫，该管芯顶部接触垫被用于引线接合至对应的引线框。
已经描述了本发明的实施例，其中在引线框阵列被附接至衬底板之后，IC管芯被连接并附接至衬底板。然而，本发明不受如此限制。在可替代的实施例中，在引线框阵列被附接之前，IC管芯被连接并附接至衬底板。
已经描述了本发明的实施例，其中修改的QFM引线框被用于组装多形式芯片。然而，本发明不受如此限制。在可替代的实施例中，使用其他类型的引线框。在一个可替代的实施例中，使用的引线框为被修改为没有管芯垫或系杆的修改的四方扁平封装(QFP)。修改的QFP引线框包括由支撑杆和接近于该支撑杆定位的挡杆支撑的引线指。在封装期间，衬底模块被封装直到挡杆，这留下引线指的远端部暴露并未封装。在切单期间，支撑杆被移除，并且挡杆被切断，以使单个引线互相电隔离。在切单之后，产生的多形式芯片在底部表面上具有下接触垫并在各边上使引线突出。突出的引线可以被弯成例如鸥翼形引线或j型引线。如果突出的引线被弯成j型引线，则封装剂可以被提供有对应的凹槽，j型引线凹进在其中。
已经描述了本发明的实施例，其中在俯视图中，多形式芯片为正方形。然而，本发明不受如此限制。在替代实施例中，在俯视图中，多形式芯片具有除了正方形之外的形状。
已经描述了本发明的实施例，其中所述多形式芯片在芯片的四个边上具有引线。然而，本发明不受如此限制。在替代实施例中，多形式芯片在少于四边或超过四边上具有引线。
已经描述了本发明的实施例，其中多形式芯片包括一个IC管芯。然而，本发明不受如此限制。在一些实施例中，多形式芯片包括两个或更多个IC管芯，其可以为例如垂直堆叠或并排放置。
应当指出的是(除非互相排斥)，上面的替代例中的任一个可以与任意其他替代性实施例和/或上面描述的实施例相结合。
进一步理解的是，在不偏离如以下权利要求中表达的本发明的范围的情况下，本领域技术人员可以作出被描述并示出以解释本发明的本质的部分的细节、材料和设置的各种改变。
引线框是被用于将一个或多个IC管芯组装到单个封装的半导体器件中的半导体封装中的金属引线和可能的其他元件(例如，管芯座、电力条(power bar))的集合。在细装为封装器件之前，引线框可以具有将那些元件保持在适当位置的支撑结构(例如，矩形金属框)。在组装过程期间，支撑结构可以被移除。如这里使用，不管存在或不存在这些支撑结构，术语“引线框”可以被用来指在组装之前或之后元件的集合。
这里引用的“一个实施例”或“实施例”意指结合实施例描述的特定特征、结构或特性可以被包括在本发明的至少一个实施例中。在说明书中各个地方出现的词组“在一个实施例中”不一定全部指相同实施例，也不是一定与其他实施例相互排斥的独立或可替代的实施例。相同的情况适用于术语“实施方式”。
除非另外明确陈述，每个数值和范围应当被解释为近似，犹如在数值或范围的值之前的词语“大约”或“近似”。如本申请中所使用，除非另外明确指出，术语“连接”意图覆盖元件之间的直接连接和间接连接两者。
本申请中权利更求所覆盖的实施例被限制于(1)由本说明书能实现的实施例，以及(2)对应于法定可授权主题的实施例。不能实现的实施例以及对应于非法定可授权主题的实施例即使它们落入权利要求的范围内，也明确放弃要求保护。
在包括任意权利要求的本说明书中，术语“每个”可以被用于指多个前面叙述的元件或步骤的一个或多个特定特征。在与开放式术语“包括”一起使用时，术语“每个”的叙述不排斥另外的、未叙述的元件或步骤。因此，可以理解的是装置可以具有另外的、未叙述的元件，并且方法可以具有另外的、未叙述的步骤，其中另外的、未叙述的元件或步骤不具有一个或多个特定特征。
尽管在以下方法权利要求中以具有对应标号的特定顺序叙述步骤，但是除非权利要求叙述另外提及实施那些步骤中的一些或全部的特定顺序，否则那些步骤不一定致力于限制为以该特定顺序实施。

Claims (8)

1.一种封装的集成电路IC器件，包括：
衬底模块，所述衬底模块包括：
在所述衬底模块的上表面上的上导电接触件组；以及
在所述衬底模块的下表面上的下导电接触件组；
附接至所述衬底模块的上表面上的多个引线；
IC管芯，包括在所述IC管芯底部的第一组管芯接触垫和在所述IC管芯顶部的第二组管芯接触垫；以及
覆盖所述IC管芯的至少一部分、所述衬底模块的上表面的至少一部分、以及所述多个引线的至少一部分的封装剂，其中：
所述上导电接触件组中的至少一个被电连接至所述下导电接触件组中的至少一个；
所述第一组管芯接触垫中的至少一个通过导电球被电连接至所述上导电接触件组中的至少一个；
所述第二组管芯接触垫中的至少一个被电连接至所述多个引线中的至少一个；以及
所述IC器件具有顶部、底部以及多个侧表面；
所述衬底模块的下表面形成所述IC器件的所述底部的至少一部分；以及
所述封装剂、所述衬底模块、以及所述多个引线的暴露导电表面形成所述IC器件的所述侧表面的至少一部分。
2.根据权利要求1所述的IC器件，其中：
所述衬底模块的下表面形成所述IC器件的所述底部的至少一部分。
3.根据权利要求2所述的IC器件，其中所述多个引线的所述暴露导电表面与在所述IC器件的侧表面处的封装剂齐平。
4.根据权利要求2所述的IC器件，其中所述多个引线的所述暴露导电表面为(i)鸥翼形引线和(ii)j型引线中的一个。
5.根据权利要求1所述的IC器件，其中：
所述第二组管芯接触垫中的一个或多个被电连接至具有一个或多个对应接合引线的所述多个引线中的一个或多个；并且
所述封装剂覆盖所述接合引线。
6.根据权利要求1所述的IC器件，其中：
所述衬底模块包括置于所述上导电接触件组和所述下导电接触件组之间的再分布层；并且
所述再分布层将所述上导电接触件组的每个接触垫连接至所述下导电接触件组的一个或多个对应接触垫。
7.根据权利要求1所述的IC器件，其中所述衬底模块包括：通孔组，其将所述上导电接触件组的每个接触垫连接至所述下导电接触件组的对应接触垫。
8.根据权利要求1所述的IC器件，其中：
所述第一组管芯接触垫位于所述IC管芯的底面上；并且
所述IC管芯具有多个硅穿孔(TSV)以将所述IC管芯的顶面上的组件连接至所述第一组管芯接触垫。
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