JP2012523118A5 - - Google Patents

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Publication number
JP2012523118A5
JP2012523118A5 JP2012503531A JP2012503531A JP2012523118A5 JP 2012523118 A5 JP2012523118 A5 JP 2012523118A5 JP 2012503531 A JP2012503531 A JP 2012503531A JP 2012503531 A JP2012503531 A JP 2012503531A JP 2012523118 A5 JP2012523118 A5 JP 2012523118A5
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JP
Japan
Prior art keywords
bonding
bonding tool
wire
during
predetermined
Prior art date
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JP2012503531A
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English (en)
Japanese (ja)
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JP5567657B2 (ja
JP2012523118A (ja
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Priority claimed from PCT/US2010/028824 external-priority patent/WO2010120473A2/en
Publication of JP2012523118A publication Critical patent/JP2012523118A/ja
Publication of JP2012523118A5 publication Critical patent/JP2012523118A5/ja
Application granted granted Critical
Publication of JP5567657B2 publication Critical patent/JP5567657B2/ja
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JP2012503531A 2009-04-01 2010-03-26 導電性バンプまたはワイヤループを形成する方法 Active JP5567657B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16567909P 2009-04-01 2009-04-01
US61/165,679 2009-04-01
PCT/US2010/028824 WO2010120473A2 (en) 2009-04-01 2010-03-26 Conductive bumps, wire loops, and methods of forming the same

Publications (3)

Publication Number Publication Date
JP2012523118A JP2012523118A (ja) 2012-09-27
JP2012523118A5 true JP2012523118A5 (enExample) 2013-05-09
JP5567657B2 JP5567657B2 (ja) 2014-08-06

Family

ID=42983063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012503531A Active JP5567657B2 (ja) 2009-04-01 2010-03-26 導電性バンプまたはワイヤループを形成する方法

Country Status (6)

Country Link
US (1) US8152046B2 (enExample)
JP (1) JP5567657B2 (enExample)
KR (1) KR101641102B1 (enExample)
CN (1) CN102187444B (enExample)
TW (1) TWI511209B (enExample)
WO (1) WO2010120473A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US8899469B2 (en) 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
TWI538762B (zh) * 2014-01-03 2016-06-21 樂金股份有限公司 銲球凸塊與封裝結構及其形成方法
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
JP6515515B2 (ja) * 2014-12-11 2019-05-22 日亜化学工業株式会社 発光装置の製造法
WO2016126306A1 (en) * 2015-02-05 2016-08-11 Sikorsky Aircraft Corporation Self-powered multi-functional structural health monitoring sensor
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547770A (ja) 1991-08-12 1993-02-26 Matsushita Electric Ind Co Ltd バンプ形成方法
JP2964724B2 (ja) * 1991-09-18 1999-10-18 松下電器産業株式会社 バンプ形成方法
JPH09252005A (ja) * 1996-03-15 1997-09-22 Shinkawa Ltd バンプ形成方法
IT1305646B1 (it) * 1998-08-07 2001-05-15 St Microelectronics Srl Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'
KR100317117B1 (ko) * 1998-12-02 2001-12-22 이충전 사이클론 집진장치를 가지는 진공청소기
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
CN1497694A (zh) * 2002-10-16 2004-05-19 ESECó�׹�˾ 当用引线键合器键合时确定最佳键合参数的方法
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
US7188759B2 (en) 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
TWI301662B (en) * 2006-03-07 2008-10-01 Phoenix Prec Technology Corp Package substrate and the manufacturing method making the same
JP2007266062A (ja) * 2006-03-27 2007-10-11 Toshiba Corp 半導体装置の製造方法
US20070297151A1 (en) * 2006-06-27 2007-12-27 Mosley Larry E Compliant conductive interconnects

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