CN102187444B - 导电凸部、引线环及导电凸部、引线环的形成方法 - Google Patents

导电凸部、引线环及导电凸部、引线环的形成方法 Download PDF

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CN102187444B
CN102187444B CN201080002737.7A CN201080002737A CN102187444B CN 102187444 B CN102187444 B CN 102187444B CN 201080002737 A CN201080002737 A CN 201080002737A CN 102187444 B CN102187444 B CN 102187444B
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bonding tool
lead
tool
height
welding
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CN102187444A (zh
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加里·S·吉洛蒂
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US8899469B2 (en) 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
TWI538762B (zh) * 2014-01-03 2016-06-21 樂金股份有限公司 銲球凸塊與封裝結構及其形成方法
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
JP6515515B2 (ja) * 2014-12-11 2019-05-22 日亜化学工業株式会社 発光装置の製造法
WO2016126306A1 (en) * 2015-02-05 2016-08-11 Sikorsky Aircraft Corporation Self-powered multi-functional structural health monitoring sensor
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects

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US20040152292A1 (en) * 2002-09-19 2004-08-05 Stephen Babinetz Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
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US5981371A (en) * 1996-03-15 1999-11-09 Kabushiki Kaisha Shinkawa Bump forming method
US6260753B1 (en) * 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US20040152292A1 (en) * 2002-09-19 2004-08-05 Stephen Babinetz Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
US20070199974A1 (en) * 2002-09-19 2007-08-30 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
CN1497694A (zh) * 2002-10-16 2004-05-19 ESECó�׹�˾ 当用引线键合器键合时确定最佳键合参数的方法
US20060054665A1 (en) * 2004-09-08 2006-03-16 Kulicke And Soffa Industries Inc. Methods for forming conductive bumps and wire loops

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