JP5567657B2 - 導電性バンプまたはワイヤループを形成する方法 - Google Patents

導電性バンプまたはワイヤループを形成する方法 Download PDF

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JP5567657B2
JP5567657B2 JP2012503531A JP2012503531A JP5567657B2 JP 5567657 B2 JP5567657 B2 JP 5567657B2 JP 2012503531 A JP2012503531 A JP 2012503531A JP 2012503531 A JP2012503531 A JP 2012503531A JP 5567657 B2 JP5567657 B2 JP 5567657B2
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bonding
bonding tool
wire
ball
predetermined
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JP2012523118A5 (enExample
JP2012523118A (ja
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ジロッティ、ゲーリー、エス．
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クリック アンド ソッファ インダストリーズ、インク．
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US8899469B2 (en) 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
TWI538762B (zh) * 2014-01-03 2016-06-21 樂金股份有限公司 銲球凸塊與封裝結構及其形成方法
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
JP6515515B2 (ja) * 2014-12-11 2019-05-22 日亜化学工業株式会社 発光装置の製造法
WO2016126306A1 (en) * 2015-02-05 2016-08-11 Sikorsky Aircraft Corporation Self-powered multi-functional structural health monitoring sensor
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects

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JPH0547770A (ja) 1991-08-12 1993-02-26 Matsushita Electric Ind Co Ltd バンプ形成方法
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US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
CN1497694A (zh) * 2002-10-16 2004-05-19 ESECó�׹�˾ 当用引线键合器键合时确定最佳键合参数的方法
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US7188759B2 (en) 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
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KR20110137767A (ko) 2011-12-23
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