IT1305646B1 - Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita' - Google Patents

Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'

Info

Publication number
IT1305646B1
IT1305646B1 ITVA980019A IT1305646B1 IT 1305646 B1 IT1305646 B1 IT 1305646B1 IT VA980019 A ITVA980019 A IT VA980019A IT 1305646 B1 IT1305646 B1 IT 1305646B1
Authority
IT
Italy
Prior art keywords
coining
summit
pitches
welded
formation
Prior art date
Application number
Other languages
English (en)
Inventor
Loci Renard
Battista Vitali
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT98VA000019 priority Critical patent/IT1305646B1/it
Publication of ITVA980019A0 publication Critical patent/ITVA980019A0/it
Priority to US09/368,560 priority patent/US6260753B1/en
Publication of ITVA980019A1 publication Critical patent/ITVA980019A1/it
Application granted granted Critical
Publication of IT1305646B1 publication Critical patent/IT1305646B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1183—Reworking, e.g. shaping
    • H01L2224/1184—Reworking, e.g. shaping involving a mechanical process, e.g. planarising the bump connector
    • H—ELECTRICITY
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    • H01L2224/13016—Shape in side view
    • H01L2224/13017—Shape in side view being non uniform along the bump connector
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/01203—3N purity grades, i.e. 99.9%
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
IT98VA000019 1998-08-07 1998-08-07 Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita' IT1305646B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT98VA000019 IT1305646B1 (it) 1998-08-07 1998-08-07 Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'
US09/368,560 US6260753B1 (en) 1998-08-07 1999-08-05 Gold bumps bonding on connection pads and subsequent coining of their vertex

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT98VA000019 IT1305646B1 (it) 1998-08-07 1998-08-07 Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'

Publications (3)

Publication Number Publication Date
ITVA980019A0 ITVA980019A0 (it) 1998-08-07
ITVA980019A1 ITVA980019A1 (it) 2000-02-07
IT1305646B1 true IT1305646B1 (it) 2001-05-15

Family

ID=11423483

Family Applications (1)

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IT98VA000019 IT1305646B1 (it) 1998-08-07 1998-08-07 Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'

Country Status (2)

Country Link
US (1) US6260753B1 (it)
IT (1) IT1305646B1 (it)

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US6527163B1 (en) * 2000-01-21 2003-03-04 Tessera, Inc. Methods of making bondable contacts and a tool for making such contacts
IT1317214B1 (it) * 2000-04-11 2003-05-27 St Microelectronics Srl Struttura di capillare per il collegamento di fili di rame da un chipdi circuito a semiconduttore e un connettore terminale corrispondente
TW515067B (en) * 2001-05-31 2002-12-21 Orient Semiconductor Elect Ltd Metal bump having higher pillar and the fabricated device thereof
JP3573133B2 (ja) * 2002-02-19 2004-10-06 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6622903B1 (en) * 2002-03-27 2003-09-23 Palomar Technologies, Inc. Production of a tailless ball bump
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
WO2010120473A2 (en) * 2009-04-01 2010-10-21 Kulicke And Soffa Industries, Inc. Conductive bumps, wire loops, and methods of forming the same
US9455544B2 (en) 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool

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US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
US4582767A (en) 1984-03-13 1986-04-15 Sanyo Electric Co., Ltd. Lead storage battery
JPH02250328A (ja) * 1989-03-24 1990-10-08 Toshiba Corp ワイヤボンダ、ワイヤボンダを用いたバンプ形成方法
JPH05275428A (ja) * 1991-03-20 1993-10-22 Fujitsu Ltd バンプの形成方法
EP0570590B1 (en) 1991-12-06 1997-03-26 Yuasa Corporation Thin battery and monolithic thin battery
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US5432017A (en) 1992-09-14 1995-07-11 Motorola, Inc. Battery pack and method of forming same
JPH06104263A (ja) * 1992-09-22 1994-04-15 Toshiba Corp バンプ形成用ツ−ルおよびバンプ形成方法
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