JP2007281531A - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP2007281531A JP2007281531A JP2007200800A JP2007200800A JP2007281531A JP 2007281531 A JP2007281531 A JP 2007281531A JP 2007200800 A JP2007200800 A JP 2007200800A JP 2007200800 A JP2007200800 A JP 2007200800A JP 2007281531 A JP2007281531 A JP 2007281531A
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract
【解決手段】第1ボンド点Aにワイヤ4の先端に形成されたボールを圧着して圧着ボール11を形成する工程を行う。この工程は、圧着ボール11の形成後にキャピラリ5を上昇させ、続いて第2ボンド点Bと反対方向に移動させてリバース動作を行う工程と、次にキャピラリ5を僅かに下降させる工程と、続いてキャピラリ5を上昇させ、その後キャピラリ5を第2ボンド点Bの方向に該第2ボンド点Bと反対側のキャピラリ5の下面が圧着ボール11の上方に位置するように移動させる工程と、次にキャピラリ5を下降させてワイヤ4を圧着ボール11上に押圧する工程とを行う。前記圧着ボール形成工程後は、第1ボンド点A上の圧着ボール11上と第2ボンド点Bにワイヤ4を接続する工程とを行う。
【選択図】 図1
Description
B 第2ボンド点
1 回路基板
2 電極パッド
3 ダイ
4 ワイヤ
5 キャピラリ
11 圧着ボール
12、13 圧着ワイヤ
21、22、23、24 屈折部
31 水平部分
32 傾斜部
Claims (2)
- 第1ボンド点にワイヤの先端に形成されたボールを圧着して圧着ボールを形成する工程と、次に圧着ボール上にワイヤを押圧して圧着ワイヤを形成する工程と、その後キャピラリを上昇させてワイヤを繰り出し、キャピラリを第2ボンド点の方向に移動させてワイヤを第2ボンド点に接続する工程とを行い、第1ボンド点と第2ボンド点との間をワイヤで接続するワイヤボンディング方法において、前記圧着ワイヤを形成する工程は、圧着ボールを形成した後にキャピラリを上昇させ、続いて第2ボンド点と反対方向に移動させてリバース動作を行う工程と、次にキャピラリを僅かに下降させる工程と、続いてキャピラリを上昇させ、その後キャピラリを第2ボンド点の方向に該第2ボンド点と反対側のキャピラリの下面が前記圧着ボールの上方に位置するように移動させる工程と、次にキャピラリを下降させてワイヤを圧着ボール上に押圧する工程よりなることを特徴とするワイヤボンディング方法。
- 第1ボンド点にワイヤの先端に形成されたボールを圧着して圧着ボールを形成する工程と、次に圧着ボール上にワイヤを押圧して圧着ワイヤを形成する工程と、その後キャピラリを上昇させ、続いてキャピラリを第2ボンド点と反対方向に移動させるリバース動作を少なくとも1回行う工程と、その後キャピラリを上昇させてワイヤを繰り出し、キャピラリを第2ボンド点の方向に移動させてワイヤを第2ボンド点に接続する工程とを行い、第1ボンド点と第2ボンド点との間をワイヤで接続するワイヤボンディング方法において、前記圧着ワイヤを形成する工程は、圧着ボールを形成した後にキャピラリを上昇させ、続いて第2ボンド点と反対方向に移動させてリバース動作を行う工程と、次にキャピラリを僅かに下降させる工程と、続いてキャピラリを上昇させ、その後キャピラリを第2ボンド点の方向に該第2ボンド点と反対側のキャピラリの下面が前記圧着ボールの上方に位置するように移動させる工程と、次にキャピラリを下降させてワイヤを圧着ボール上に押圧する工程よりなることを特徴とするワイヤボンディング方法。
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Application Number | Priority Date | Filing Date | Title |
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JP2007200800A JP4547405B2 (ja) | 2007-08-01 | 2007-08-01 | ワイヤボンディング方法 |
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JP2007200800A JP4547405B2 (ja) | 2007-08-01 | 2007-08-01 | ワイヤボンディング方法 |
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JP2003183917A Division JP4021378B2 (ja) | 2003-06-27 | 2003-06-27 | ワイヤボンディング方法 |
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JP4547405B2 JP4547405B2 (ja) | 2010-09-22 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04277642A (ja) * | 1991-03-06 | 1992-10-02 | Nec Yamagata Ltd | ワイヤーボンディング方法 |
JPH0951011A (ja) * | 1995-08-10 | 1997-02-18 | Tanaka Denshi Kogyo Kk | 半導体チップのワイヤボンディング方法 |
JP2000012595A (ja) * | 1998-06-23 | 2000-01-14 | Shinkawa Ltd | ワイヤボンディング方法 |
JP2004172477A (ja) * | 2002-11-21 | 2004-06-17 | Kaijo Corp | ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4599720A (en) * | 1982-07-06 | 1986-07-08 | International Business Machines Corporation | Satellite communications system |
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- 2007-08-01 JP JP2007200800A patent/JP4547405B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04277642A (ja) * | 1991-03-06 | 1992-10-02 | Nec Yamagata Ltd | ワイヤーボンディング方法 |
JPH0951011A (ja) * | 1995-08-10 | 1997-02-18 | Tanaka Denshi Kogyo Kk | 半導体チップのワイヤボンディング方法 |
JP2000012595A (ja) * | 1998-06-23 | 2000-01-14 | Shinkawa Ltd | ワイヤボンディング方法 |
JP2004172477A (ja) * | 2002-11-21 | 2004-06-17 | Kaijo Corp | ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置 |
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JP4547405B2 (ja) | 2010-09-22 |
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