JP2015165566A5 - - Google Patents

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Publication number
JP2015165566A5
JP2015165566A5 JP2015035950A JP2015035950A JP2015165566A5 JP 2015165566 A5 JP2015165566 A5 JP 2015165566A5 JP 2015035950 A JP2015035950 A JP 2015035950A JP 2015035950 A JP2015035950 A JP 2015035950A JP 2015165566 A5 JP2015165566 A5 JP 2015165566A5
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Japan
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heating
heating device
thermocompression bonding
prior
patent document
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JP2015035950A
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English (en)
Japanese (ja)
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JP2015165566A (ja
JP6568671B2 (ja
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JP2015035950A 2014-02-28 2015-02-26 熱圧着ボンディングシステムおよび当該システムを動作させる方法 Active JP6568671B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461945916P 2014-02-28 2014-02-28
US61/945,916 2014-02-28

Publications (3)

Publication Number Publication Date
JP2015165566A JP2015165566A (ja) 2015-09-17
JP2015165566A5 true JP2015165566A5 (enExample) 2018-02-08
JP6568671B2 JP6568671B2 (ja) 2019-08-28

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JP2015035950A Active JP6568671B2 (ja) 2014-02-28 2015-02-26 熱圧着ボンディングシステムおよび当該システムを動作させる方法

Country Status (5)

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US (2) US9659902B2 (enExample)
JP (1) JP6568671B2 (enExample)
KR (1) KR102332745B1 (enExample)
CN (1) CN104882387B (enExample)
TW (1) TWI644374B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10245668B2 (en) * 2016-10-31 2019-04-02 Kulicke And Soffa Industries, Inc Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
EP3340287B1 (en) * 2016-12-23 2020-10-28 Huawei Technologies Co., Ltd. Pattern-based temperature measurement for a bonding device and a bonding system
JP2018147911A (ja) * 2017-03-01 2018-09-20 東レエンジニアリング株式会社 ボンディングヘッド冷却システムおよびこれを備えた実装装置ならびに実装方法
EP3808860B1 (en) * 2018-07-06 2023-11-08 Shanghai Joulead Electric Co., Ltd Inductive hot crimping apparatus
US11784160B2 (en) * 2020-09-23 2023-10-10 International Business Machines Corporation Asymmetric die bonding
CN112462221B (zh) * 2020-11-05 2022-06-17 清华大学 一种用于压接式半导体的高温老化失效的模拟测试装置
US12431404B2 (en) 2020-11-13 2025-09-30 International Business Machines Corporation Fatigue failure resistant electronic package
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
KR20220153723A (ko) * 2021-05-11 2022-11-21 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
TWI787036B (zh) * 2022-01-04 2022-12-11 萬潤科技股份有限公司 散熱片壓合方法及裝置
JP2023170980A (ja) * 2022-05-20 2023-12-01 芝浦メカトロニクス株式会社 実装装置及び実装方法
US12456709B2 (en) * 2022-12-28 2025-10-28 International Business Machines Corporation Structures and processes for void-free hybrid bonding

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830649A (enExample) * 1971-08-25 1973-04-23
JP2757738B2 (ja) * 1992-12-25 1998-05-25 ヤマハ株式会社 回路部品の着脱装置および回路部品の着脱方法
JP3591977B2 (ja) * 1996-03-18 2004-11-24 キヤノン株式会社 マイクロ波プラズマｃｖｄ法を用いた膜堆積方法および膜堆積装置
JP3455838B2 (ja) * 1997-01-28 2003-10-14 澁谷工業株式会社 不活性ガス供給機構付ボンディングヘッド
JP4544755B2 (ja) * 2001-01-17 2010-09-15 パナソニック株式会社 ボンディングヘッド及び部品装着装置
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
JP4014481B2 (ja) * 2002-04-30 2007-11-28 東レエンジニアリング株式会社 ボンディング方法およびその装置
JP4631796B2 (ja) * 2006-05-22 2011-02-16 パナソニック株式会社 電子部品の熱圧着装置
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
TWI529829B (zh) * 2011-05-27 2016-04-11 東麗工程股份有限公司 Installation method and installation device
TWI501828B (zh) * 2012-03-13 2015-10-01 印能科技股份有限公司 晶片壓合裝置及方法
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
KR101920941B1 (ko) * 2012-06-08 2018-11-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법, 유체의 공급 방법 및 기억 매체
JP5793473B2 (ja) * 2012-07-20 2015-10-14 株式会社新川 ボンディング装置用ヒータ及びその冷却方法

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