SG10202001386VA - Chemical mechanical polishing for copper and through silicon via applications - Google Patents

Chemical mechanical polishing for copper and through silicon via applications

Info

Publication number
SG10202001386VA
SG10202001386VA SG10202001386VA SG10202001386VA SG10202001386VA SG 10202001386V A SG10202001386V A SG 10202001386VA SG 10202001386V A SG10202001386V A SG 10202001386VA SG 10202001386V A SG10202001386V A SG 10202001386VA SG 10202001386V A SG10202001386V A SG 10202001386VA
Authority
SG
Singapore
Prior art keywords
copper
mechanical polishing
chemical mechanical
silicon via
via applications
Prior art date
Application number
SG10202001386VA
Inventor
Shi Xiaobo
Allen Schlueter James
Leonard O'neill Mark
Original Assignee
Versum Materials Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG10202001386VA publication Critical patent/SG10202001386VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
SG10202001386VA 2019-02-28 2020-02-14 Chemical mechanical polishing for copper and through silicon via applications SG10202001386VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962811874P 2019-02-28 2019-02-28
US16/752,116 US20200277514A1 (en) 2019-02-28 2020-01-24 Chemical Mechanical Polishing For Copper And Through Silicon Via Applications

Publications (1)

Publication Number Publication Date
SG10202001386VA true SG10202001386VA (en) 2020-09-29

Family

ID=69742787

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202001386VA SG10202001386VA (en) 2019-02-28 2020-02-14 Chemical mechanical polishing for copper and through silicon via applications

Country Status (8)

Country Link
US (1) US20200277514A1 (en)
EP (1) EP3702425A1 (en)
JP (1) JP7240346B2 (en)
KR (1) KR20200105431A (en)
CN (1) CN111732897A (en)
IL (1) IL272585B1 (en)
SG (1) SG10202001386VA (en)
TW (1) TW202039775A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4259736A1 (en) * 2020-12-14 2023-10-18 Versum Materials US, LLC Chemical mechanical planarization (cmp) for copper and through-silicon via (tsv)
EP4314179A1 (en) * 2021-03-29 2024-02-07 Entegris, Inc. Suspension for chemical mechanical planarization (cmp) and method employing the same
CN113789127B (en) * 2021-10-20 2023-07-28 博力思(天津)电子科技有限公司 Polishing solution for copper film of through silicon via

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
SG144688A1 (en) 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
US7300601B2 (en) 2002-12-10 2007-11-27 Advanced Technology Materials, Inc. Passivative chemical mechanical polishing composition for copper film planarization
US20040175942A1 (en) 2003-01-03 2004-09-09 Chang Song Y. Composition and method used for chemical mechanical planarization of metals
CN1842577A (en) * 2003-06-06 2006-10-04 应用材料公司 Polishing composition and method for polishing a conductive material
CN101356628B (en) 2005-08-05 2012-01-04 高级技术材料公司 High throughput chemical mechanical polishing composition for metal film planarization
TWI385226B (en) 2005-09-08 2013-02-11 羅門哈斯電子材料Ｃｍｐ控股公司 Polymeric barrier removal polishing slurry
TWI343945B (en) 2005-12-27 2011-06-21 Hitachi Chemical Co Ltd Slurry for metal polishing and polishing method of polished film
US20100015807A1 (en) 2006-12-22 2010-01-21 Techno Semichem Co., Ltd. Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
WO2009020625A1 (en) 2007-08-09 2009-02-12 Planar Solutions, Llc Copper polishing slurry
JPWO2009031389A1 (en) 2007-09-03 2010-12-09 Jsr株式会社 Chemical mechanical polishing aqueous dispersion and preparation method thereof, kit for preparing chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method of semiconductor device
US7955520B2 (en) 2007-11-27 2011-06-07 Cabot Microelectronics Corporation Copper-passivating CMP compositions and methods
US8435421B2 (en) 2007-11-27 2013-05-07 Cabot Microelectronics Corporation Metal-passivating CMP compositions and methods
WO2010123300A2 (en) 2009-04-22 2010-10-28 Lg Chem, Ltd. Slurry for chemical mechanical polishing
EP2427523B1 (en) 2009-05-06 2015-10-28 Basf Se An aqueous metal polishing agent comprising a polymeric abrasive containing pendant functional groups and its use in a cmp process
JP5646862B2 (en) 2009-09-18 2014-12-24 長興開発科技股▲ふん▼有限公司 Polishing method of semiconductor wafer having through silicon via structure and polishing composition used therefor
US8586481B2 (en) 2010-06-01 2013-11-19 Applied Materials, Inc. Chemical planarization of copper wafer polishing
US8980122B2 (en) 2011-07-08 2015-03-17 General Engineering & Research, L.L.C. Contact release capsule useful for chemical mechanical planarization slurry
US9057004B2 (en) 2011-09-23 2015-06-16 International Business Machines Corporation Slurry for chemical-mechanical polishing of metals and use thereof
US8734665B2 (en) 2011-10-12 2014-05-27 International Business Machines Corporation Slurry for chemical-mechanical polishing of copper and use thereof
US8974692B2 (en) * 2013-06-27 2015-03-10 Air Products And Chemicals, Inc. Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
US10217645B2 (en) * 2014-07-25 2019-02-26 Versum Materials Us, Llc Chemical mechanical polishing (CMP) of cobalt-containing substrate
KR101854499B1 (en) 2015-04-24 2018-05-04 삼성에스디아이 주식회사 Cmp slurry composition for copper wire and polishing method using the same
US9978609B2 (en) 2015-04-27 2018-05-22 Versum Materials Us, Llc Low dishing copper chemical mechanical planarization
WO2016195997A1 (en) 2015-05-29 2016-12-08 Weatherby Michael T Automated helmet gas bladder maintenance system and method
US10253216B2 (en) 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
CN110099977B (en) 2016-11-09 2021-05-11 福吉米株式会社 Polishing composition and method for polishing silicon wafer

Also Published As

Publication number Publication date
JP2020141137A (en) 2020-09-03
EP3702425A1 (en) 2020-09-02
TW202039775A (en) 2020-11-01
JP7240346B2 (en) 2023-03-15
IL272585B1 (en) 2024-04-01
CN111732897A (en) 2020-10-02
KR20200105431A (en) 2020-09-07
IL272585A (en) 2020-08-31
US20200277514A1 (en) 2020-09-03

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