HUE059775T2 - Hõelvezetõ lemez, hõelvezetõ elem, továbbá félvezetõ eszköz - Google Patents

Hõelvezetõ lemez, hõelvezetõ elem, továbbá félvezetõ eszköz

Info

Publication number
HUE059775T2
HUE059775T2 HUE19775479A HUE19775479A HUE059775T2 HU E059775 T2 HUE059775 T2 HU E059775T2 HU E19775479 A HUE19775479 A HU E19775479A HU E19775479 A HUE19775479 A HU E19775479A HU E059775 T2 HUE059775 T2 HU E059775T2
Authority
HU
Hungary
Prior art keywords
heat dissipating
semiconductor device
sheet
dissipating member
dissipating sheet
Prior art date
Application number
HUE19775479A
Other languages
English (en)
Inventor
Toshiyuki Sawamura
Toshiyuki Tanaka
Akira Watanabe
Katsuhiko Hidaka
Original Assignee
Mitsubishi Chem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chem Corp filed Critical Mitsubishi Chem Corp
Publication of HUE059775T2 publication Critical patent/HUE059775T2/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HUE19775479A 2018-03-30 2019-03-29 Hõelvezetõ lemez, hõelvezetõ elem, továbbá félvezetõ eszköz HUE059775T2 (hu)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018068075 2018-03-30
JP2018068471 2018-03-30
JP2019046007 2019-03-13

Publications (1)

Publication Number Publication Date
HUE059775T2 true HUE059775T2 (hu) 2022-12-28

Family

ID=68061904

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE19775479A HUE059775T2 (hu) 2018-03-30 2019-03-29 Hõelvezetõ lemez, hõelvezetõ elem, továbbá félvezetõ eszköz

Country Status (7)

Country Link
US (1) US11834603B2 (hu)
EP (1) EP3780089B1 (hu)
JP (1) JP7196905B2 (hu)
CN (1) CN111868921B (hu)
HU (1) HUE059775T2 (hu)
TW (1) TWI801547B (hu)
WO (1) WO2019189746A1 (hu)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4134398A4 (en) * 2020-04-08 2023-09-20 Mitsubishi Chemical Corporation METHOD FOR PRODUCING A RESIN COMPOSITION LAYER, RESIN COMPOSITION LAYER PRODUCED BY SAID PRODUCTION METHOD, AND COMPOSITE MOLDED ARTICLE COMPRISING SAID RESIN COMPOSITION LAYER
CN116997607A (zh) 2021-03-29 2023-11-03 三菱化学株式会社 树脂组合物、片材固化物、复合成型体及半导体器件

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5184543B2 (ja) * 2007-09-26 2013-04-17 三菱電機株式会社 熱伝導性シート及びパワーモジュール
JPWO2012070289A1 (ja) * 2010-11-26 2014-05-19 三菱電機株式会社 熱伝導性シート及びパワーモジュール
TWI547436B (zh) 2011-11-29 2016-09-01 Mitsubishi Chem Corp 氮化硼凝集粒子、含有該粒子之組成物、以及具有由該組成物所構成的層之三維積體電路
US20150037575A1 (en) * 2012-03-30 2015-02-05 Showa Denko K.K. Curable heat radiation composition
JP6274014B2 (ja) * 2013-05-27 2018-02-07 三菱ケミカル株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
KR102400206B1 (ko) 2014-02-05 2022-05-19 미쯔비시 케미컬 주식회사 질화붕소 응집 입자, 질화붕소 응집 입자의 제조 방법, 그 질화붕소 응집 입자 함유 수지 조성물, 성형체, 및 시트
JP2015189609A (ja) * 2014-03-27 2015-11-02 三菱化学株式会社 窒化ホウ素シートの製造方法
JP6500339B2 (ja) 2014-03-31 2019-04-17 三菱ケミカル株式会社 放熱シートおよび放熱シート用塗布液、並びにパワーデバイス装置
JP6256158B2 (ja) 2014-03-31 2018-01-10 三菱ケミカル株式会社 放熱シートおよび放熱シート製造方法、放熱シート用スラリー、並びにパワーデバイス装置
JP6364883B2 (ja) 2014-03-31 2018-08-01 三菱ケミカル株式会社 窒化ホウ素粒子および窒化ホウ素粒子の製造方法、該窒化ホウ素粒子を含む放熱シート用塗布液、該窒化ホウ素粒子を含む放熱シート、並びにパワーデバイス装置
JP6786778B2 (ja) * 2015-08-12 2020-11-18 三菱ケミカル株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP2017059704A (ja) * 2015-09-17 2017-03-23 日立化成株式会社 熱伝導組成物、熱伝導シート、熱伝導シートの製造方法、及び部材
JP6696402B2 (ja) 2016-10-21 2020-05-20 三菱自動車工業株式会社 電動車両のハーネス用プロテクタ
JP6802036B2 (ja) 2016-10-26 2020-12-16 日本工機株式会社 無人浮遊機用の保持装置、無人浮遊機、消火器の交換・装填装置及び自動消火システム
WO2018235919A1 (ja) * 2017-06-23 2018-12-27 積水化学工業株式会社 放熱シート、放熱シートの製造方法及び積層体
JP6858101B2 (ja) 2017-08-31 2021-04-14 株式会社Pfu 座標検出装置及び学習済みモデル
JP7101693B2 (ja) * 2017-09-28 2022-07-15 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
WO2020100482A1 (ja) * 2018-11-16 2020-05-22 富士高分子工業株式会社 熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
EP3780089B1 (en) 2022-08-17
CN111868921B (zh) 2023-11-28
WO2019189746A1 (ja) 2019-10-03
JP7196905B2 (ja) 2022-12-27
CN111868921A (zh) 2020-10-30
EP3780089A1 (en) 2021-02-17
TW201942325A (zh) 2019-11-01
EP3780089A4 (en) 2021-06-16
US20200407618A1 (en) 2020-12-31
US11834603B2 (en) 2023-12-05
TWI801547B (zh) 2023-05-11
JPWO2019189746A1 (ja) 2021-04-30

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