JP6568671B2 - 熱圧着ボンディングシステムおよび当該システムを動作させる方法 - Google Patents
熱圧着ボンディングシステムおよび当該システムを動作させる方法 Download PDFInfo
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- JP6568671B2 JP6568671B2 JP2015035950A JP2015035950A JP6568671B2 JP 6568671 B2 JP6568671 B2 JP 6568671B2 JP 2015035950 A JP2015035950 A JP 2015035950A JP 2015035950 A JP2015035950 A JP 2015035950A JP 6568671 B2 JP6568671 B2 JP 6568671B2
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Description
本出願は、この参照によりその内容が本明細書に組み込まれる、2014年2月28日付けで出願された米国仮特許出願第61/945,916号に対して利益を主張する。
この出願の発明に関連する先行技術文献情報としては、以下のものがある。
(先行技術文献)
(特許文献)
(特許文献1) 米国特許第6,113,732号明細書
(特許文献2) 米国特許出願公開第2013/0333726号明細書
Claims (32)
- 半導体素子をボンディングするための熱圧着ボンディングシステムであって、
ボンディングされる半導体素子を加熱する加熱装置を含むとともに、当該熱圧着ボンディングシステムのボンディングサイクルにおける冷却段階の間に加圧冷却流体を受け入れるように構成された流体流路とを含むボンド・ヘッド・アセンブリと、
加圧冷却流体源と、
前記加圧冷却流体源から加圧冷却流体を受け入れ、前記受け入れられた加圧冷却流体の圧力を上昇させる増圧ポンプと、
前記増圧ポンプからの加圧冷却流体を受け入れる加圧流体リザーバと、
前記加圧流体リザーバから前記流体流路に向かう加圧冷却流体の供給を制御する制御弁であって、前記ボンディングサイクルの前記冷却段階の間の異なる段階において供給量が異なるように前記加圧冷却流体を制御するものである、前記制御弁と
を有する熱圧着ボンディングシステム。 - 請求項1記載の熱圧着ボンディングシステムにおいて、さらに、
前記流体流路に提供される前記加圧冷却流体の供給を調整する流量制御弁を有するものである熱圧着ボンディングシステム。 - 請求項2記載の熱圧着ボンディングシステムにおいて、前記流量制御弁は前記制御弁と直列に配置されているものである熱圧着ボンディングシステム。
- 請求項3記載の熱圧着ボンディングシステムにおいて、前記流量制御弁は前記流体流路に提供される前記加圧冷却流体の流れに対して前記制御弁の下流に配置されている熱圧着ボンディングシステム。
- 請求項3記載の熱圧着ボンディングシステムにおいて、前記流量制御弁は前記流体流路に提供される前記加圧冷却流体の流れに対して前記制御弁の上流に配置されている熱圧着ボンディングシステム。
- 請求項2記載の熱圧着ボンディングシステムにおいて、前記流量制御弁は前記制御弁を含む流体流路と並列に配置された流体流路に含まれるものである熱圧着ボンディングシステム。
- 請求項2記載の熱圧着ボンディングシステムにおいて、前記増圧ポンプは前記流量制御弁に加圧冷却流体を提供するものである熱圧着ボンディングシステム。
- 請求項2記載の熱圧着ボンディングシステムにおいて、前記流量制御弁は、前記増圧ポンプと、前記加圧流体リザーバと、前記制御弁とを含む流体流路と並列に配置された流体流路に含まれるものである熱圧着ボンディングシステム。
- 請求項2記載の熱圧着ボンディングシステムにおいて、さらに、
前記制御弁および前記流量制御弁の少なくとも1つを制御するコンピュータを有するものである熱圧着ボンディングシステム。 - 請求項9記載の熱圧着ボンディングシステムにおいて、さらに、
前記加熱装置の温度を検知する温度センサを有し、前記コンピュータは前記温度センサによって検知される前記加熱装置の温度に関係する情報を受信するものである熱圧着ボンディングシステム。 - 請求項2記載の熱圧着ボンディングシステムにおいて、前記流量制御弁はアナログ制御弁である熱圧着ボンディングシステム。
- 請求項1記載の熱圧着ボンディングシステムにおいて、前記制御弁はデジタルオン/オフ制御弁である熱圧着ボンディングシステム。
- 請求項1記載の熱圧着ボンディングシステムにおいて、前記増圧ポンプは、前記加圧冷却流体源から受け入れる前記加圧冷却流体の圧力を少なくとも50%上昇させるものである熱圧着ボンディングシステム。
- 請求項1記載の熱圧着ボンディングシステムにおいて、前記ボンド・ヘッド・アセンブリは、さらに、
前記半導体素子を基板にボンディングするボンドツールを有し、前記加熱装置は、当該ボンドツールを加熱することによって前記半導体素子を加熱するとともに、前記流体流路に提供される前記加圧冷却流体によって冷却されるものである熱圧着ボンディングシステム。 - 請求項1記載の熱圧着ボンディングシステムにおいて、前記加熱装置は前記半導体素子を基板にボンディングするボンドツールとして機能するとともに、前記流体流路に提供される前記加圧冷却流体によって冷却されるものである熱圧着ボンディングシステム。
- 熱圧着ボンディングシステムを動作させる方法であって、
加圧冷却流体源を提供する工程と、
増圧ポンプにより前記加圧冷却流体源からの加圧冷却流体の圧力を上昇させる工程と、
前記増圧ポンプからの加圧冷却流体を加圧流体リザーバで受け入れる工程と、
前記加圧流体リザーバから前記熱圧着ボンディングシステムのボンド・ヘッド・アセンブリに含まれる流体流路に向かう前記加圧冷却流体の流れを制御弁により制御する工程であって、前記熱圧着ボンディングシステムのボンディングサイクルにおける冷却段階の間の異なる段階において供給量が異なるように前記加圧冷却流体の流れを制御するものである、前記制御する工程と
を有する方法。 - 請求項16記載の方法において、さらに、
流量制御弁により前記流体流路に提供される加圧冷却流体の供給を調整する工程を有するものである方法。 - 請求項17記載の方法において、前記流量制御弁は前記制御弁と直列に配置されているものである方法。
- 請求項18記載の方法において、前記流量制御弁は前記流体流路に提供される前記加圧冷却流体の前記流れに対して前記制御弁の下流に配置されているものである方法。
- 請求項18記載の方法において、前記流量制御弁は前記流体流路に提供される前記加圧冷却流体の前記流れに対して前記制御弁の上流に配置されているものである方法。
- 請求項17記載の方法において、前記流量制御弁は前記制御弁を含む流体流路と並列に配置されているものである方法。
- 請求項17記載の方法において、さらに、
前記増圧ポンプにより前記流量制御弁に加圧冷却流体を提供する工程を有するものである方法。 - 請求項17記載の方法において、前記流量制御弁は、前記増圧ポンプと、前記加圧流体リザーバと、前記制御弁とを含む流体流路と並列に配置されているものである方法。
- 請求項17記載の方法において、さらに、
コンピュータにより前記制御弁および前記流量制御弁の少なくとも1つを制御する工程を有するものである方法。 - 請求項24記載の方法において、さらに、
温度センサにより前記ボンド・ヘッド・アセンブリの加熱装置の温度を検知する工程と、
コンピュータにより前記温度センサによって検知される前記加熱装置の温度に関係する情報を受信する工程と
を有するものである方法。 - 請求項17記載の方法において、前記流量制御弁はアナログ制御弁である方法。
- 請求項16記載の方法において、前記制御弁はデジタルオン/オフ制御弁である方法。
- 請求項16記載の方法において、前記加圧冷却流体源からの前記加圧冷却流体の圧力は、前記増圧ポンプにより少なくとも50%上昇されるものである方法。
- 請求項16記載の方法において、前記ボンド・ヘッド・アセンブリは、半導体素子を基板にボンディングするボンドツールを含み、前記ボンド・ヘッド・アセンブリの加熱装置は前記ボンドツールを加熱することによって前記半導体素子を加熱するとともに、前記流体流路に提供される前記加圧冷却流体によって冷却されるものである方法。
- 請求項16記載の方法において、前記ボンド・ヘッド・アセンブリは、半導体素子を基板にボンディングするボンドツールとして構成された加熱装置を含み、当該加熱装置は、前記流体流路に提供される前記加圧冷却流体によって冷却されるものである方法。
- 半導体素子をボンディングするための熱圧着ボンディングシステムであって、
ボンディングされる半導体素子を加熱する加熱装置を含むとともに、当該熱圧着ボンディングシステムのボンディングサイクルにおける冷却段階の間に加圧冷却流体を受け入れるように構成された流体流路とを含むボンド・ヘッド・アセンブリと、
加圧冷却流体源と、
前記加圧冷却流体源から前記流体流路に向かう加圧冷却流体の供給を制御する流量制御弁であって、前記ボンディングサイクルの前記冷却段階の間の異なる段階において供給量が異なるように前記加圧冷却流体を制御するものである、前記流量制御弁と、
前記流量制御弁を制御するように構成されたコンピュータであって、前記ボンディングサイクルの前記冷却段階の間の異なる段階において、前記流体流路に提供される前記加圧冷却流体の供給量が異なるように前記流量制御弁を制御するものである、前記コンピュータと
を有する熱圧着ボンディングシステム。 - 熱圧着ボンディングシステムを動作させる方法であって、
熱圧着ボンディング工程の加熱段階において、前記熱圧着ボンディングシステムのボンド・ヘッド・アセンブリの加熱装置を加熱する工程と、
加圧冷却流体源を提供する工程と、
前記加熱段階の後、流量制御弁により、前記加圧冷却流体源から前記熱圧着ボンディングシステムの前記ボンド・ヘッド・アセンブリに含まれる流体流路に向かう加圧冷却流体の供給を制御する工程であって、前記流体流路に提供される前記加圧冷却流体の供給は、前記熱圧着ボンディング工程の冷却段階の間の異なる段階において、前記流量制御弁により異なる圧力を有するように制御されるものである、前記制御する工程と
を有する方法。
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