JP2017092464A5 - - Google Patents

Download PDF

Info

Publication number
JP2017092464A5
JP2017092464A5 JP2016214727A JP2016214727A JP2017092464A5 JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5 JP 2016214727 A JP2016214727 A JP 2016214727A JP 2016214727 A JP2016214727 A JP 2016214727A JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5
Authority
JP
Japan
Prior art keywords
patent document
die
semiconductor die
pat
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016214727A
Other languages
English (en)
Japanese (ja)
Other versions
JP6971012B2 (ja
JP2017092464A (ja
Filing date
Publication date
Priority claimed from US15/234,563 external-priority patent/US10121759B2/en
Application filed filed Critical
Publication of JP2017092464A publication Critical patent/JP2017092464A/ja
Publication of JP2017092464A5 publication Critical patent/JP2017092464A5/ja
Application granted granted Critical
Publication of JP6971012B2 publication Critical patent/JP6971012B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016214727A 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 Active JP6971012B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US62/250,745 2015-11-04
US15/234,563 2016-08-11
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods

Publications (3)

Publication Number Publication Date
JP2017092464A JP2017092464A (ja) 2017-05-25
JP2017092464A5 true JP2017092464A5 (enExample) 2019-11-21
JP6971012B2 JP6971012B2 (ja) 2021-11-24

Family

ID=58635709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016214727A Active JP6971012B2 (ja) 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法

Country Status (6)

Country Link
US (2) US10121759B2 (enExample)
JP (1) JP6971012B2 (enExample)
KR (1) KR102593242B1 (enExample)
CN (2) CN107030415B (enExample)
SG (2) SG10201608922TA (enExample)
TW (2) TWI712094B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109560024B (zh) * 2018-11-06 2020-11-06 武汉新芯集成电路制造有限公司 一种晶圆键合装置及其校正方法
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
WO2021202211A1 (en) * 2020-03-29 2021-10-07 Kulicke And Soffa Industries, Inc. Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
US11515284B2 (en) * 2020-07-14 2022-11-29 Semiconductor Components Industries, Llc Multi-segment wire-bond
JP7794821B2 (ja) 2020-11-05 2026-01-06 クリック アンド ソッファ インダストリーズ、インク． ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法
JP7834780B2 (ja) * 2021-05-20 2026-03-24 クリック アンド ソッファ インダストリーズ、インク． ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置
US12489003B2 (en) * 2021-05-25 2025-12-02 Yamaha Robotics Co., Ltd. Wire bonding system, inspection device, wire bonding method, and recording medium
KR20260035274A (ko) * 2023-07-11 2026-03-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 반도체 요소에서 크랙을 검출하는 방법, 및 관련 와이어 본딩 시스템

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293844A (ja) * 1987-05-27 1988-11-30 Toshiba Corp ワイヤボンデイングヘツド
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH07183321A (ja) * 1993-12-24 1995-07-21 Kaijo Corp ワイヤボンディング装置
JP2001267352A (ja) * 2000-03-16 2001-09-28 Mitsubishi Electric Corp ワイヤボンディング装置およびその制御方法
JP4547330B2 (ja) 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US7511961B2 (en) * 2006-10-26 2009-03-31 Infineon Technologies Ag Base plate for a power semiconductor module
JP4786500B2 (ja) * 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
WO2008140541A1 (en) 2007-05-16 2008-11-20 Kulicke And Soffa Industries, Inc. Wire bonding methods and bonding force calibration
JP4425319B1 (ja) * 2008-09-10 2010-03-03 株式会社新川 ボンディング方法、ボンディング装置及び製造方法
US7762449B2 (en) 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
KR101291488B1 (ko) * 2009-10-21 2013-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP4658224B2 (ja) * 2010-01-26 2011-03-23 株式会社新川 ワイヤボンディング装置
WO2011132548A1 (en) * 2010-04-23 2011-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20120007426A1 (en) * 2010-07-08 2012-01-12 Thompson Steve A Multiple DC power generation systems common load coupler
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
JP2012186416A (ja) * 2011-03-08 2012-09-27 Toshiba Corp 半導体装置の製造方法
JP2014007363A (ja) * 2012-06-27 2014-01-16 Renesas Electronics Corp 半導体装置の製造方法および半導体装置
WO2014024808A1 (en) * 2012-08-10 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI799011B (zh) * 2012-09-14 2023-04-11 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
TWI546911B (zh) * 2012-12-17 2016-08-21 巨擘科技股份有限公司 封裝結構及封裝方法
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
CN109616408B (zh) * 2013-05-29 2023-07-25 Ev 集团 E·索尔纳有限责任公司 用以接合衬底的装置及方法
US10510576B2 (en) * 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
JP2015153907A (ja) * 2014-02-14 2015-08-24 株式会社新川 半導体装置の製造方法及びワイヤボンディング装置
JP2016092192A (ja) * 2014-11-04 2016-05-23 株式会社デンソー 電子装置の製造方法

Similar Documents

Publication Publication Date Title
EP4163956A3 (en) Integrated circuit package having wire-bonded multi-die stack
CN111684605A (zh) 半导体装置及其制造方法
CN105280600B (zh) 半导体装置
WO2018056694A3 (ko) 로직 반도체 소자
JP2013522887A5 (enExample)
JP2018010929A5 (enExample)
JP2015213164A5 (ja) 半導体装置
JP2017045949A5 (enExample)
WO2013016264A3 (en) Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
JP2015135959A5 (ja) トランジスタ
SG158823A1 (en) Packaging structural member
EP3154083A3 (en) Fan-out package structure having embedded package substrate
JP2015029087A5 (enExample)
EP2763196A3 (en) Semiconductor light emitting device and method for manufacturing the same
JP2019528225A5 (enExample)
JP2015533258A5 (enExample)
KR20180084588A (ko) 반도체 패키지의 제조 방법
PH12017501998A1 (en) Lead carrier structure and packages formed therefrom without die attach pads
EP4195257A3 (en) A package including multiple semiconductor devices
US20160093559A1 (en) Semiconductor package with small gate clip and assembly method
JP2016018931A5 (enExample)
BR112012020055A2 (pt) estrutura de pacote de pastilha semicondutora.
MY186080A (en) Non-planar i/o and logic semiconductor devices having different workfunction on common substrate
JP2014170940A5 (enExample)
TW200715521A (en) Semiconductor stacked die/wafer configuration and packaging and method thereof