JP2017092464A5 - - Google Patents

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JP2017092464A5
JP2017092464A5 JP2016214727A JP2016214727A JP2017092464A5 JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5 JP 2016214727 A JP2016214727 A JP 2016214727A JP 2016214727 A JP2016214727 A JP 2016214727A JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5
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Japan
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patent document
die
semiconductor die
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JP2016214727A
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JP6971012B2 (ja
JP2017092464A (ja
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JP2016214727A 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 Active JP6971012B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US62/250,745 2015-11-04
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods
US15/234,563 2016-08-11

Publications (3)

Publication Number Publication Date
JP2017092464A JP2017092464A (ja) 2017-05-25
JP2017092464A5 true JP2017092464A5 (enExample) 2019-11-21
JP6971012B2 JP6971012B2 (ja) 2021-11-24

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JP2016214727A Active JP6971012B2 (ja) 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法

Country Status (6)

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US (2) US10121759B2 (enExample)
JP (1) JP6971012B2 (enExample)
KR (1) KR102593242B1 (enExample)
CN (2) CN107030415B (enExample)
SG (2) SG10201608922TA (enExample)
TW (2) TWI731734B (enExample)

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* Cited by examiner, † Cited by third party
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CN109560024B (zh) * 2018-11-06 2020-11-06 武汉新芯集成电路制造有限公司 一种晶圆键合装置及其校正方法
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
WO2021202211A1 (en) * 2020-03-29 2021-10-07 Kulicke And Soffa Industries, Inc. Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
US11515284B2 (en) * 2020-07-14 2022-11-29 Semiconductor Components Industries, Llc Multi-segment wire-bond
WO2022098697A1 (en) * 2020-11-05 2022-05-12 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods
JP7612249B2 (ja) * 2021-05-25 2025-01-14 株式会社新川 ワイヤボンディングシステム、検査装置、ワイヤボンディング方法、および、プログラム

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JPS63293844A (ja) * 1987-05-27 1988-11-30 Toshiba Corp ワイヤボンデイングヘツド
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH07183321A (ja) * 1993-12-24 1995-07-21 Kaijo Corp ワイヤボンディング装置
JP2001267352A (ja) * 2000-03-16 2001-09-28 Mitsubishi Electric Corp ワイヤボンディング装置およびその制御方法
JP4547330B2 (ja) 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
JP4786500B2 (ja) * 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
US7511961B2 (en) * 2006-10-26 2009-03-31 Infineon Technologies Ag Base plate for a power semiconductor module
CN102509708B (zh) 2007-05-16 2014-09-24 库利克和索夫工业公司 金属线接合方法和接合力校准
JP4425319B1 (ja) * 2008-09-10 2010-03-03 株式会社新川 ボンディング方法、ボンディング装置及び製造方法
US7762449B2 (en) 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
KR20170024130A (ko) * 2009-10-21 2017-03-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
JP4658224B2 (ja) * 2010-01-26 2011-03-23 株式会社新川 ワイヤボンディング装置
KR20130054275A (ko) * 2010-04-23 2013-05-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
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TWI595659B (zh) * 2012-09-14 2017-08-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
TWI546911B (zh) * 2012-12-17 2016-08-21 巨擘科技股份有限公司 封裝結構及封裝方法
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JP2016092192A (ja) * 2014-11-04 2016-05-23 株式会社デンソー 電子装置の製造方法

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