JP2017092464A5 - - Google Patents
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- JP2017092464A5 JP2017092464A5 JP2016214727A JP2016214727A JP2017092464A5 JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5 JP 2016214727 A JP2016214727 A JP 2016214727A JP 2016214727 A JP2016214727 A JP 2016214727A JP 2017092464 A5 JP2017092464 A5 JP 2017092464A5
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- JP
- Japan
- Prior art keywords
- patent document
- die
- semiconductor die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562250745P | 2015-11-04 | 2015-11-04 | |
| US62/250,745 | 2015-11-04 | ||
| US15/234,563 US10121759B2 (en) | 2015-11-04 | 2016-08-11 | On-bonder automatic overhang die optimization tool for wire bonding and related methods |
| US15/234,563 | 2016-08-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017092464A JP2017092464A (ja) | 2017-05-25 |
| JP2017092464A5 true JP2017092464A5 (enExample) | 2019-11-21 |
| JP6971012B2 JP6971012B2 (ja) | 2021-11-24 |
Family
ID=58635709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016214727A Active JP6971012B2 (ja) | 2015-11-04 | 2016-11-02 | ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10121759B2 (enExample) |
| JP (1) | JP6971012B2 (enExample) |
| KR (1) | KR102593242B1 (enExample) |
| CN (2) | CN107030415B (enExample) |
| SG (2) | SG10201608922TA (enExample) |
| TW (2) | TWI712094B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109560024B (zh) * | 2018-11-06 | 2020-11-06 | 武汉新芯集成电路制造有限公司 | 一种晶圆键合装置及其校正方法 |
| US11581285B2 (en) * | 2019-06-04 | 2023-02-14 | Kulicke And Soffa Industries, Inc. | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine |
| KR20220160553A (ko) * | 2020-03-29 | 2022-12-06 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 와이어 본딩 머신 상의 지지 구조에 대한 반도체 소자의 클램핑 최적화 방법, 및 관련된 방법 |
| US11515284B2 (en) * | 2020-07-14 | 2022-11-29 | Semiconductor Components Industries, Llc | Multi-segment wire-bond |
| WO2022098697A1 (en) * | 2020-11-05 | 2022-05-12 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods |
| CN116888715A (zh) * | 2021-05-25 | 2023-10-13 | 株式会社新川 | 打线接合系统、检查装置、打线接合方法以及程序 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63293844A (ja) * | 1987-05-27 | 1988-11-30 | Toshiba Corp | ワイヤボンデイングヘツド |
| JP3178567B2 (ja) * | 1993-07-16 | 2001-06-18 | 株式会社カイジョー | ワイヤボンディング装置及びその方法 |
| JPH07183321A (ja) * | 1993-12-24 | 1995-07-21 | Kaijo Corp | ワイヤボンディング装置 |
| JP2001267352A (ja) * | 2000-03-16 | 2001-09-28 | Mitsubishi Electric Corp | ワイヤボンディング装置およびその制御方法 |
| JP4547330B2 (ja) | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
| US7511961B2 (en) * | 2006-10-26 | 2009-03-31 | Infineon Technologies Ag | Base plate for a power semiconductor module |
| JP4786500B2 (ja) * | 2006-10-26 | 2011-10-05 | 株式会社東芝 | ワイヤボンディング装置及びワイヤボンディング方法 |
| WO2008140541A1 (en) | 2007-05-16 | 2008-11-20 | Kulicke And Soffa Industries, Inc. | Wire bonding methods and bonding force calibration |
| JP4425319B1 (ja) * | 2008-09-10 | 2010-03-03 | 株式会社新川 | ボンディング方法、ボンディング装置及び製造方法 |
| US7762449B2 (en) | 2008-11-21 | 2010-07-27 | Asm Assembly Automation Ltd | Bond head for heavy wire bonder |
| KR20170024130A (ko) * | 2009-10-21 | 2017-03-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| JP4658224B2 (ja) * | 2010-01-26 | 2011-03-23 | 株式会社新川 | ワイヤボンディング装置 |
| CN105390402B (zh) * | 2010-04-23 | 2018-09-07 | 株式会社半导体能源研究所 | 半导体装置及半导体装置的制造方法 |
| US20120007426A1 (en) * | 2010-07-08 | 2012-01-12 | Thompson Steve A | Multiple DC power generation systems common load coupler |
| US20120074206A1 (en) * | 2010-09-27 | 2012-03-29 | Kulicke And Soffa Industries, Inc. | Methods of forming wire bonds for wire loops and conductive bumps |
| JP2012186416A (ja) * | 2011-03-08 | 2012-09-27 | Toshiba Corp | 半導体装置の製造方法 |
| JP2014007363A (ja) * | 2012-06-27 | 2014-01-16 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
| JP6211843B2 (ja) * | 2012-08-10 | 2017-10-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102211215B1 (ko) * | 2012-09-14 | 2021-02-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| TWI546911B (zh) * | 2012-12-17 | 2016-08-21 | 巨擘科技股份有限公司 | 封裝結構及封裝方法 |
| US8899469B2 (en) * | 2013-03-04 | 2014-12-02 | Kulicke And Soffa Industries, Inc. | Automatic rework processes for non-stick conditions in wire bonding operations |
| CN109461649B (zh) * | 2013-05-29 | 2023-07-18 | Ev 集团 E·索尔纳有限责任公司 | 用以接合衬底的装置及方法 |
| US10510576B2 (en) * | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| US9165902B2 (en) * | 2013-12-17 | 2015-10-20 | Kulicke And Soffa Industries, Inc. | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines |
| JP2015153907A (ja) * | 2014-02-14 | 2015-08-24 | 株式会社新川 | 半導体装置の製造方法及びワイヤボンディング装置 |
| JP2016092192A (ja) * | 2014-11-04 | 2016-05-23 | 株式会社デンソー | 電子装置の製造方法 |
-
2016
- 2016-08-11 US US15/234,563 patent/US10121759B2/en active Active
- 2016-10-12 TW TW105132890A patent/TWI712094B/zh active
- 2016-10-12 TW TW109122367A patent/TWI731734B/zh active
- 2016-10-24 SG SG10201608922TA patent/SG10201608922TA/en unknown
- 2016-10-24 SG SG10201907000QA patent/SG10201907000QA/en unknown
- 2016-10-31 KR KR1020160143605A patent/KR102593242B1/ko active Active
- 2016-11-02 JP JP2016214727A patent/JP6971012B2/ja active Active
- 2016-11-03 CN CN201610959217.4A patent/CN107030415B/zh active Active
- 2016-11-03 CN CN201910986731.0A patent/CN110695575B/zh active Active
-
2018
- 2018-09-26 US US16/142,662 patent/US10665564B2/en active Active
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