SG10201608922TA - On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods - Google Patents

On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods

Info

Publication number
SG10201608922TA
SG10201608922TA SG10201608922TA SG10201608922TA SG10201608922TA SG 10201608922T A SG10201608922T A SG 10201608922TA SG 10201608922T A SG10201608922T A SG 10201608922TA SG 10201608922T A SG10201608922T A SG 10201608922TA SG 10201608922T A SG10201608922T A SG 10201608922TA
Authority
SG
Singapore
Prior art keywords
wire bonding
related methods
optimization tool
overhang die
automatic overhang
Prior art date
Application number
SG10201608922TA
Other languages
English (en)
Inventor
Aashish Shah
Robert W Ellenberg
Stephen E Babinetz
Ziauddin Ahmad
Wei Qin
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of SG10201608922TA publication Critical patent/SG10201608922TA/en

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Classifications

    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
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    • H01L2924/0001—Technical content checked by a classifier
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG10201608922TA 2015-11-04 2016-10-24 On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods SG10201608922TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods

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Publication Number Publication Date
SG10201608922TA true SG10201608922TA (en) 2017-06-29

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SG10201608922TA SG10201608922TA (en) 2015-11-04 2016-10-24 On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods
SG10201907000QA SG10201907000QA (en) 2015-11-04 2016-10-24 On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods

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US (2) US10121759B2 (enExample)
JP (1) JP6971012B2 (enExample)
KR (1) KR102593242B1 (enExample)
CN (2) CN110695575B (enExample)
SG (2) SG10201608922TA (enExample)
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US20190027463A1 (en) 2019-01-24
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CN107030415A (zh) 2017-08-11
TWI731734B (zh) 2021-06-21
TWI712094B (zh) 2020-12-01
JP2017092464A (ja) 2017-05-25
US10121759B2 (en) 2018-11-06
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US10665564B2 (en) 2020-05-26
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