SG10201907000QA - On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods - Google Patents

On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods

Info

Publication number
SG10201907000QA
SG10201907000QA SG10201907000QA SG10201907000QA SG10201907000QA SG 10201907000Q A SG10201907000Q A SG 10201907000QA SG 10201907000Q A SG10201907000Q A SG 10201907000QA SG 10201907000Q A SG10201907000Q A SG 10201907000QA SG 10201907000Q A SG10201907000Q A SG 10201907000QA
Authority
SG
Singapore
Prior art keywords
bonding
wire bonding
related methods
optimization tool
determining
Prior art date
Application number
SG10201907000QA
Inventor
Aashish Shah
Robert W Ellenberg
Stephen E Babinetz
Ziauddin Ahmad
Wei Qin
Original Assignee
Kulicke And Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke And Soffa Industries Inc filed Critical Kulicke And Soffa Industries Inc
Publication of SG10201907000QA publication Critical patent/SG10201907000QA/en

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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
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    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING AND RELATED METHODS A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided. Fig. 6
SG10201907000QA 2015-11-04 2016-10-24 On-Bonder Automatic Overhang Die Optimization Tool for Wire Bonding and Related Methods SG10201907000QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods

Publications (1)

Publication Number Publication Date
SG10201907000QA true SG10201907000QA (en) 2019-09-27

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