SG11202011196SA - Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape - Google Patents
Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tapeInfo
- Publication number
- SG11202011196SA SG11202011196SA SG11202011196SA SG11202011196SA SG11202011196SA SG 11202011196S A SG11202011196S A SG 11202011196SA SG 11202011196S A SG11202011196S A SG 11202011196SA SG 11202011196S A SG11202011196S A SG 11202011196SA SG 11202011196S A SG11202011196S A SG 11202011196SA
- Authority
- SG
- Singapore
- Prior art keywords
- production
- semiconductor device
- resin composition
- thermosetting resin
- composition used
- Prior art date
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- H—ELECTRICITY
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- H01L23/293—Organic, e.g. plastic
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/832—Applying energy for connecting
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- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/92—Specific sequence of method steps
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- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
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PCT/JP2018/018765 WO2019220540A1 (en) | 2018-05-15 | 2018-05-15 | Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape |
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SG11202011196SA true SG11202011196SA (en) | 2020-12-30 |
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SG11202011196SA SG11202011196SA (en) | 2018-05-15 | 2018-05-15 | Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape |
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JP (1) | JP7136200B2 (en) |
KR (1) | KR102482629B1 (en) |
CN (1) | CN112204730A (en) |
SG (1) | SG11202011196SA (en) |
TW (1) | TWI799582B (en) |
WO (1) | WO2019220540A1 (en) |
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JP2022115581A (en) * | 2021-01-28 | 2022-08-09 | 昭和電工マテリアルズ株式会社 | Semiconductor device and manufacturing method thereof, thermosetting resin composition, adhesive film and dicing/die bonding integrated film |
JP2022182532A (en) * | 2021-05-28 | 2022-12-08 | キオクシア株式会社 | Semiconductor device and manufacturing method for the same |
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JP5236134B2 (en) | 2001-01-26 | 2013-07-17 | 日立化成株式会社 | Adhesive composition, adhesive member, semiconductor mounting support member, semiconductor device, etc. |
JP2005103180A (en) | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Washing machine |
US7560821B2 (en) * | 2005-03-24 | 2009-07-14 | Sumitomo Bakelite Company, Ltd | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
JP5524465B2 (en) | 2007-10-24 | 2014-06-18 | 日立化成株式会社 | Adhesive sheet, semiconductor device using the same, and manufacturing method thereof |
JP2010118554A (en) * | 2008-11-13 | 2010-05-27 | Nec Electronics Corp | Semiconductor device and method of manufacturing the same |
JP5390209B2 (en) * | 2009-02-04 | 2014-01-15 | 日東電工株式会社 | Thermosetting die bond film |
WO2012067158A1 (en) * | 2010-11-18 | 2012-05-24 | 日立化成工業株式会社 | Film-like resin composition for sealing and filling semiconductor, method for manufacturing semiconductor device, and semiconductor device |
JP5781794B2 (en) * | 2011-03-11 | 2015-09-24 | 積水化学工業株式会社 | Semiconductor chip with adhesive layer and method for manufacturing semiconductor device |
CN104169383B (en) * | 2012-03-08 | 2016-11-09 | 日立化成株式会社 | Adhesive sheet and the manufacture method of semiconductor device |
JP2015120836A (en) * | 2013-12-24 | 2015-07-02 | 日東電工株式会社 | Adhesive film, dicing/die-bonding film, manufacturing method of semiconductor device and semiconductor device |
JP6222395B1 (en) * | 2017-08-07 | 2017-11-01 | 日立化成株式会社 | Film adhesive and dicing die bonding integrated adhesive sheet |
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2019
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CN112204730A (en) | 2021-01-08 |
KR20210008341A (en) | 2021-01-21 |
KR102482629B1 (en) | 2022-12-29 |
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TWI799582B (en) | 2023-04-21 |
JP7136200B2 (en) | 2022-09-13 |
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