TWI799582B - Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture - Google Patents
Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture Download PDFInfo
- Publication number
- TWI799582B TWI799582B TW108116804A TW108116804A TWI799582B TW I799582 B TWI799582 B TW I799582B TW 108116804 A TW108116804 A TW 108116804A TW 108116804 A TW108116804 A TW 108116804A TW I799582 B TWI799582 B TW I799582B
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- Prior art keywords
- die
- manufacture
- semiconductor device
- resin composition
- thermosetting resin
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
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- H01L23/293—Organic, e.g. plastic
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- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
- H01L2224/83204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H01L2224/93—Batch processes
- H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
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- H01L2225/1052—Wire or wire-like electrical connections
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/018765 WO2019220540A1 (en) | 2018-05-15 | 2018-05-15 | Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape |
WOPCT/JP2018/018765 | 2018-05-15 |
Publications (2)
Publication Number | Publication Date |
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TW202010788A TW202010788A (en) | 2020-03-16 |
TWI799582B true TWI799582B (en) | 2023-04-21 |
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TW108116804A TWI799582B (en) | 2018-05-15 | 2019-05-15 | Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture |
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JP (1) | JP7136200B2 (en) |
KR (1) | KR102482629B1 (en) |
CN (1) | CN112204730A (en) |
SG (1) | SG11202011196SA (en) |
TW (1) | TWI799582B (en) |
WO (1) | WO2019220540A1 (en) |
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JP7531238B2 (en) | 2020-04-28 | 2024-08-09 | アモセンス・カンパニー・リミテッド | Adhesive transfer film and method for manufacturing power module substrate using same |
JP2022115581A (en) * | 2021-01-28 | 2022-08-09 | 昭和電工マテリアルズ株式会社 | Semiconductor device and manufacturing method thereof, thermosetting resin composition, adhesive film and dicing/die bonding integrated film |
JP2022182532A (en) * | 2021-05-28 | 2022-12-08 | キオクシア株式会社 | Semiconductor device and manufacturing method for the same |
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JP2018014501A (en) * | 2017-08-07 | 2018-01-25 | 日立化成株式会社 | Film-like adhesive, and dicing and die-bonding integrated type adhesive sheet |
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JP5236134B2 (en) | 2001-01-26 | 2013-07-17 | 日立化成株式会社 | Adhesive composition, adhesive member, semiconductor mounting support member, semiconductor device, etc. |
JP2005103180A (en) | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Washing machine |
US7560821B2 (en) * | 2005-03-24 | 2009-07-14 | Sumitomo Bakelite Company, Ltd | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
JP5524465B2 (en) | 2007-10-24 | 2014-06-18 | 日立化成株式会社 | Adhesive sheet, semiconductor device using the same, and manufacturing method thereof |
JP2010118554A (en) * | 2008-11-13 | 2010-05-27 | Nec Electronics Corp | Semiconductor device and method of manufacturing the same |
JP5390209B2 (en) * | 2009-02-04 | 2014-01-15 | 日東電工株式会社 | Thermosetting die bond film |
WO2012067158A1 (en) * | 2010-11-18 | 2012-05-24 | 日立化成工業株式会社 | Film-like resin composition for sealing and filling semiconductor, method for manufacturing semiconductor device, and semiconductor device |
JP5781794B2 (en) * | 2011-03-11 | 2015-09-24 | 積水化学工業株式会社 | Semiconductor chip with adhesive layer and method for manufacturing semiconductor device |
KR102067945B1 (en) * | 2012-03-08 | 2020-01-17 | 히타치가세이가부시끼가이샤 | Adhesive sheet and method for manufacturing semiconductor device |
JP2015120836A (en) * | 2013-12-24 | 2015-07-02 | 日東電工株式会社 | Adhesive film, dicing/die-bonding film, manufacturing method of semiconductor device and semiconductor device |
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2018
- 2018-05-15 SG SG11202011196SA patent/SG11202011196SA/en unknown
- 2018-05-15 JP JP2020518855A patent/JP7136200B2/en active Active
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JP2018014501A (en) * | 2017-08-07 | 2018-01-25 | 日立化成株式会社 | Film-like adhesive, and dicing and die-bonding integrated type adhesive sheet |
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TW202010788A (en) | 2020-03-16 |
KR102482629B9 (en) | 2024-03-25 |
SG11202011196SA (en) | 2020-12-30 |
WO2019220540A1 (en) | 2019-11-21 |
CN112204730A (en) | 2021-01-08 |
JP7136200B2 (en) | 2022-09-13 |
KR20210008341A (en) | 2021-01-21 |
KR102482629B1 (en) | 2022-12-29 |
JPWO2019220540A1 (en) | 2021-07-01 |
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