JP2001267352A - Wire-bonding device and method for controlling the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire-bonding device and a method for controlling the same, capable of stabilizing a load to be applied to a bonding surface from a leading end of a capillary after landing and to further provide a wire bonding device and a method for controlling the same, capable of suppressing wire breakdown in scrubbing and insufficient wire bonding. SOLUTION: A Z-axis torque command pulse is generated, so as to become a reverse direction to a Z-axis feedback pulse detected after landing to suppress vibration of an ultrasonic horn after landing in the Z-axis direction. Thus, a load to be given to a bonding surface by a leading end of a capillary 1 can be stabilized. As a result, bondability of the bonding surface to a wire can be enhance. Wire breakdown and insufficient wire bonding can be suppressed, by changing the scrubbing amount of the capillary, in response to the difference of angles between the oscillating direction of the ultrasonic wave and a direction for wiring the wire.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a wire bonding apparatus used in a manufacturing process of a semiconductor device or the like and a control method thereof.

[0002]

2. Description of the Related Art FIG. 5 shows a structure of a wire bonding apparatus. The wire bonding apparatus includes a capillary 1 and an ultrasonic horn 2 supporting the capillary 1.

[0003] A wire is inserted through the capillary 1,
So-called stitch bonding is performed. The stitch bonding is a bonding method in which a part of the peripheral edge of the tip end of the capillary 1 is pressed against the wire to fix the wire to the bonding surface on the surface of the semiconductor device or the like.

[0004] The ultrasonic horn 2 generates ultrasonic waves that vibrate in the Y-axis direction (the front-rear direction shown as the direction Y in FIG. 5) when the wire is fixed. The vibration caused by the ultrasonic waves is transmitted to the capillary 1, and the wire is securely fixed to the bonding surface.

The ultrasonic horn 2 is swung in the Z-axis direction (the vertical direction indicated by the direction Z in FIG. 5) by the driving of the Z-axis motor unit 3 controlled by the load control unit 4. Thereby, the position of the tip of the capillary 1 can be moved up and down.

[0006] The ultrasonic horn 2 and the Z-axis motor unit 3 are supported by a bonding head 5. Further, the bonding head 5 can move the bonding head 5 in an XY plane (a plane including the left-right direction shown as the direction X in FIG. 5 and the direction Y orthogonal to the direction Y and the direction Z and the direction Y). It is supported by the stage 6. When the bonding head 5 moves in the XY plane, the capillary 1 is moved through the ultrasonic horn 2.
Moves in the XY plane.

FIG. 6 is a block diagram showing the internal configuration of the Z-axis motor unit 3 and the load control unit 4. As shown in FIG. 6, the Z-axis motor unit 3 is a Z-axis motor MT that swings the ultrasonic horn 2 in the Z-axis direction via a gear mechanism, a hydraulic mechanism, or the like.
And an encoder EC for counting the rotation of the Z-axis motor MT and converting the rotation into an electric signal. Note that this electric signal differs depending on the rotation direction of the Z-axis motor MT, and it is possible to distinguish whether the rotation direction is the direction in which the ultrasonic horn 2 is raised or lowered.

On the other hand, the load control unit 4 includes a Z-axis feedback pulse generation unit FB for receiving an electric signal output from the encoder EC, and a rotation of the Z-axis motor MT for applying a torque in the Z-axis direction to the ultrasonic horn 2. And a Z-axis torque command pulse generator TR for generating a Z-axis torque command pulse for controlling the operation of the motor. The Z-axis feedback pulse generation unit FB shapes the electric signal output from the encoder EC into a pulse shape, and outputs this as a Z-axis feedback pulse. The Z-axis feedback pulse is provided to a Z-axis torque command pulse generator TR. Therefore, the Z-axis torque command pulse generator TR can detect the swinging state of the ultrasonic horn 2 based on the Z-axis feedback pulse.

A case where the wire bonding apparatus is controlled by a conventional control method will be described below. FIG. 7 shows the state of the Z-axis feedback pulse and the Z-axis torque command pulse during wire bonding in the capillary 1.
The time axis is shown on the horizontal axis together with the position of the tip and the load applied to the bonding surface.

First, at the start of wire bonding, the tip of the capillary 1 is positioned above the bonding surface. After that, the Z-axis torque command pulse generator TR generates a descending Z-axis torque command pulse, and the Z-axis motor MT receiving the pulse gives the descending torque to the ultrasonic horn 2.

The ultrasonic horn 2 to which the torque in the descending direction is applied starts descending, and the position of the tip of the capillary 1 starts to descend. At this time, the encoder EC connected to the Z-axis motor MT generates an electric signal from the rotation of the Z-axis motor MT and supplies the electric signal to the Z-axis feedback pulse generator FB. Then, the Z-axis feedback pulse generator FB
Outputs a Z-axis feedback pulse indicating a fall to the Z-axis torque command pulse generating unit TR.

The Z-axis torque command pulse generator TR
Generates a further downward Z-axis torque command pulse, and the above operation is repeated.

In the Z-axis torque command pulse generator TR, a Z-axis feedback pulse indicating a decrease is monitored, and a period from the generation of one pulse to the generation of the next pulse is calculated. When the value of the period is smaller than the predetermined value WD, it is determined that the ultrasonic horn 2 is descending, and when the value exceeds the predetermined value WD, it is determined that the tip of the capillary 1 has landed on the bonding surface. .

When it is determined that the tip of the capillary 1 has landed on the bonding surface, the Z-axis torque command pulse generator TR stops generating the Z-axis torque command pulse and causes the tip of the capillary 1 to stay at that position. . Thereafter, the Z-axis torque command pulse generator TR is in the landing mode and does not generate a Z-axis torque command pulse until the end of bonding is detected.

Then, an ultrasonic wave is generated in the ultrasonic horn 2, and the wire is securely fixed to the bonding surface. After the bonding is completed, the Z-axis torque command pulse generator TR generates an ascending Z-axis torque command pulse to return the position of the tip of the capillary 1 to the initial height. The end of the bonding is detected by a timer provided in the wire bonding apparatus measuring the elapsed time from the time when the capillary 1 lands.

When the wire is fixed to the bonding surface, ultrasonic waves are applied to the capillary 1 and X
A so-called scrub process is performed in which the capillary 1 is vibrated in the direction of connecting the wires by controlling the Y stage 6 (the direction of the straight line connecting the current bonding surface and the next bonding surface). The details of the scrub processing are described in, for example, Japanese Patent Application Laid-Open No. 4-307748.
If this scrubbing process is not performed, since the vibration direction of the ultrasonic wave is one direction as the direction Y in FIG. 5, when the wire is bridged from the current bonding surface to the next bonding surface, the wire deformation ( The phenomenon that the wire is cross-linked by being curved rather than linearly when viewed from above) is likely to occur.

FIG. 8 shows the oscillation direction Y of the ultrasonic wave.
When the scrubbing process is performed in a state where the ultrasonic horn 2 is not parallel to the bonding surface, the direction of the axial direction (the direction of the cosine component of the ultrasonic wave projected on the bonding surface) and the direction of connecting the wire The relationship between the difference and the scrub amount of the capillary 1 is shown. FIG. 9 shows XY
This shows a scrubbing operation of the capillary 1 in a plane. As shown in FIGS. 8 and 9, a constant value b is adopted as the scrub amount representing the vibration amount of the capillary 1 in the scrub process, regardless of the direction in which the wires are connected.
Note that the X axis and the Y axis in FIG. 9 respectively correspond to the directions X and Y shown in FIG. 5, and the intersection (origin) of both axes
Indicates the position of the capillary 1 before the scrub processing is performed.

[0018]

From the Z-axis feedback pulse shown in FIG. 7, it can be seen that the rising pulse and the falling pulse are output alternately after landing.
That is, in the control method of the conventional wire bonding apparatus, the ultrasonic horn 2 after landing oscillates in the Z-axis direction without being stabilized. This is the deflection of the ultrasonic horn 2 itself,
The bearing of the support of the ultrasonic horn 2 in the bonding head 5 is loose, and the ultrasonic horn 2 and the Z-axis motor MT
It is considered that looseness or the like of a mechanical element such as a gear mechanism or a hydraulic mechanism existing between the two is caused.

As described above, if the ultrasonic horn 2 after landing oscillates without stability, the load applied to the bonding surface is not stable as shown in FIG. There was a problem that can not be. Note that this vibration phenomenon occurred regardless of whether or not ultrasonic waves were generated in the ultrasonic horn 2.

Further, as described above, a constant value b is employed for the amount of scrub in the scrub process regardless of the direction in which the wires are connected. In the stitch bonding, when the oscillation direction of the ultrasonic wave and the direction in which the wires are connected match, the amount of crushing of the wires is large, and the wires are easily bonded to the bonding surface. On the other hand, when the ultrasonic wave oscillating direction is orthogonal to the direction in which the wires are connected, the amount of crushing of the wires is small, and the wires are not easily bonded to the bonding surface.

Therefore, if the amount of scrub is set based on the case where the oscillation direction of the ultrasonic waves and the direction of connecting the wires are orthogonal to each other, the oscillating direction of the ultrasonic waves and the direction of connecting the wires are the same. In such a case, there is a problem that the wire is easily broken because the wire is excessively crushed. In addition, when the scrub amount is set based on the case where the ultrasonic oscillation direction and the wire connection direction match, the scrub amount is determined when the ultrasonic oscillation direction is orthogonal to the wire connection direction. However, there was a problem that the scrubbing treatment was insufficient and the bonding of the wires was likely to be insufficient.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a wire bonding apparatus and a control method thereof capable of stabilizing a load applied to a bonding surface from a tip of a capillary after landing, and furthermore, to provide a wire bonding apparatus in a scrub process. It is an object of the present invention to provide a wire bonding apparatus and a control method for the same capable of suppressing the occurrence of wire bonding and insufficient wire bonding.

It is to be noted that a technique for controlling the load applied to the capillary by detecting the value of the current flowing through the ultrasonic vibrator and having the same effect as the present invention and changing the load according to the magnitude of the load. And JP-A-10-98
No. 064.

[0024]

According to a first aspect of the present invention, there is provided a capillary through which a wire can be inserted, a horn which holds the capillary and can swing up and down, and On the other hand, the capillary lands on the bonding surface using a wire bonding apparatus including a motor that applies torque in the vertical direction, control means for controlling the motor, and detection means for detecting vertical oscillation of the horn. If the detecting means detects that the horn is swinging upward during the period during which the horn is swinging, the control means controls the motor so as to apply a torque downward to the horn. And a method for controlling a wire bonding apparatus.

According to a second aspect of the present invention, there is provided the method for controlling a wire bonding apparatus according to the first aspect, wherein the horn swings downward while the capillary lands on the bonding surface. When the detection means detects that the horn is being operated, the control means further controls the motor so as to apply an upward torque to the horn.

According to a third aspect of the present invention, there is provided a capillary through which a wire can be inserted, a horn which holds the capillary and can swing up and down, and applies a torque to the horn up and down. And a control means for controlling the motor, and a detecting means for detecting a vertical swing of the horn, and controlled by the control method of the wire bonding apparatus according to claim 1 or 2. It is a wire bonding apparatus.

According to a fourth aspect of the present invention, there is provided the wire bonding apparatus according to the third aspect, wherein the detecting means is an encoder that counts the rotation of the motor and converts the rotation into an electric signal. .

According to a fifth aspect of the present invention, there is provided a capillary through which a wire can be inserted, an ultrasonic horn for holding the capillary and capable of generating ultrasonic waves, and a supporting portion for supporting the ultrasonic horn. And, using a table having the support portion on the surface, and a wire bonding apparatus provided,
During the period in which the capillary lands on the bonding surface, the ultrasonic wave is transmitted to the capillary, the wire is fixed to the bonding surface, and the table is vibrated along the bonding surface to cause the wire to move. A method of controlling a wire bonding apparatus, wherein a scrub process is performed in a connecting direction, and a scrub amount of the scrub process is increased as an angle between an oscillation direction of the ultrasonic wave and a direction in which the wire is connected approaches 90 °.

According to a sixth aspect of the present invention, there is provided a capillary through which a wire can be inserted, an ultrasonic horn holding the capillary and capable of generating an ultrasonic wave, and a supporting portion for supporting the ultrasonic horn. And a table having the support portion on a surface thereof, wherein the wire bonding apparatus is controlled by the method for controlling a wire bonding apparatus according to claim 5.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <Embodiment 1> This embodiment is a control method applicable to the wire bonding apparatus shown in FIG. 5, in which a load applied to a bonding surface from a tip of a capillary after landing is obtained. The following describes what can be stabilized.

FIG. 1 shows the state of wire bonding of the Z-axis feedback pulse and the Z-axis torque command pulse along with the horizontal axis along with the position of the tip of the capillary 1 and the load applied to the bonding surface, similarly to FIG. It is shown. FIG. 2 shows a flowchart of a control method of the wire bonding apparatus according to the present embodiment.

First, at the start of wire bonding, since the tip of the capillary 1 is positioned above the bonding surface, the Z-axis torque command pulse generator TR generates a descending Z-axis torque command pulse similarly to the conventional control method. And gives it to the Z-axis motor MT. Then, the Z-axis motor MT receives the Z-axis torque command pulse and applies a downward torque to the ultrasonic horn 2.

The ultrasonic horn 2 to which the torque in the descending direction is applied starts descending, and the position of the tip of the capillary 1 starts to descend. At this time, the encoder EC connected to the Z-axis motor MT generates an electric signal from the rotation of the Z-axis motor MT and supplies the electric signal to the Z-axis feedback pulse generator FB. Then, the Z-axis feedback pulse generator FB
Outputs a Z-axis feedback pulse indicating a fall to the Z-axis torque command pulse generating unit TR.

The Z-axis torque command pulse generator TR
Generates a further Z-axis torque command pulse in the descending direction, and the above operation is repeated (step ST1).

In the Z-axis torque command pulse generator TR, a Z-axis feedback pulse indicating a decrease is monitored.
A period from the generation of one pulse to the generation of the next pulse is calculated. Then, the value of the period is a predetermined value WD.
If the value is smaller than the predetermined value WD, it is determined that the ultrasonic horn 2 is descending.
Is determined to have landed on the bonding surface (step ST2).

In this embodiment, when it is determined that the tip of the capillary 1 has landed on the bonding surface, unlike the conventional technique, the Z-axis torque command pulse generator TR stops the Z-axis torque command pulse. Never. That is, in the landing mode, the Z of the ultrasonic horn 2 after the landing is set.
A Z-axis torque command pulse is generated so as to suppress axial vibration.

The vibration of the ultrasonic horn 2 in the Z-axis direction appears in the Z-axis feedback pulse after landing. Therefore, the Z-axis torque command pulse generator TR continues to monitor the Z-axis feedback pulse even after landing (step ST3), and when a Z-axis feedback pulse in the ascending direction appears (“Yes” from step ST4), A downward Z-axis torque command pulse is given to the Z-axis motor MT (step ST5),
If a descending Z-axis feedback pulse appears ("No" from step ST4), a Z-axis torque command pulse in the ascending direction may be given to the Z-axis motor MT (step ST6). Thus, torque is transmitted from the Z-axis motor MT to the capillary 1 via the ultrasonic horn 2, and the load applied to the bonding surface by the tip of the capillary 1 can be stabilized. As described above, when the tip of the capillary 1 after landing stabilizes the load applied to the bonding surface, the variation in the oscillation of the ultrasonic wave is reduced, and as a result, the bondability between the bonding surface and the wire can be improved. it can.

In order to generate a Z-axis torque command pulse corresponding to the Z-axis feedback pulse after landing in the Z-axis torque command pulse generating section TR, for example, as shown in FIG. It is sufficient to generate one reverse Z-axis torque command pulse immediately after the generation of the pulse. Then, torque is applied to the Z-axis motor MT in a pulsed manner, and the vibration of the ultrasonic horn 2 in the Z-axis direction can be appropriately suppressed.

Then, an ultrasonic wave is generated in the ultrasonic horn 2, and the wire is securely fixed to the bonding surface. When the wire is fixed to the bonding surface, ultrasonic waves may be applied to the capillary 1 and scrubbing may be performed. Since the scrub processing is performed on the XY plane, control in the Z-axis direction orthogonal to the scrub processing is hardly affected.

When the bonding is completed (step ST7), the Z-axis torque command pulse generator TR generates a rising Z-axis torque command pulse to return the position of the tip of the capillary 1 to the initial height. (Step ST
8).

If the control method of the wire bonding apparatus according to the present embodiment is used, a Z-axis torque command pulse is generated so as to suppress the vibration of the ultrasonic horn 2 in the Z-axis direction after landing. The load applied by the tip to the bonding surface can be stabilized. As a result, the bondability between the bonding surface and the wire can be improved.

Further, since the vibration of the ultrasonic horn 2 is detected based on the electric signal output from the encoder EC, a special device for detecting the vibration of the ultrasonic horn 2 is not required, and the current wire It is only necessary to change the control method of the bonding apparatus. That is, the control method described above is easily implemented as a wire bonding apparatus by replacing the items related to bonding in the control program in the Z-axis torque command pulse generator TR of the current wire bonding apparatus as in steps ST1 to ST8. it can.

<Embodiment 2> This embodiment is a control method applicable to the wire bonding apparatus shown in FIG. 5, and suppresses the occurrence of broken wires and the occurrence of insufficient wire bonding in a scrub process. It describes what can be done.

FIG. 3 shows, similarly to FIG. 8, the Y-axis direction which is the ultrasonic wave oscillating direction (when scrubbing is performed in a state where the ultrasonic horn 2 is not parallel to the bonding surface, the ultrasonic wave is projected onto the bonding surface. Direction of cosine component of ultrasonic oscillation)
FIG. 6 shows a relationship between a difference between an angle between a wire and a direction in which a wire is connected and a scrub amount of the capillary 1. FIG.
9 shows the scrubbing operation of the capillary 1 in the XY plane as in FIG. The X axis and the Y axis in FIG. 4 correspond to the directions X and Y shown in FIG. 5, respectively, and the intersection (origin) of both axes indicates the position of the capillary 1 before performing the scrub process.

As can be seen from FIGS. 3 and 4, in the present embodiment, unlike the prior art, the scrubbing of the capillary 1 is performed in accordance with the angle difference between the direction of ultrasonic wave oscillation and the direction of wire connection. The amount is changing. More specifically, the difference between the angle between the ultrasonic oscillation direction and the direction in which the wires are connected approaches 0 ° or 180 ° (that is, the case where the ultrasonic oscillation direction matches the direction in which the wires are connected). Reduces the amount of scrub, while the angle difference is 90 °
The scrub amount is increased as approaching (i.e., when the direction of ultrasonic wave oscillation and the direction of wire connection are orthogonal). In FIGS. 3 and 4, the amount of scrub when the angle difference is 0 ° or 180 ° is a, and the amount of scrub when the angle difference is 90 ° is b, which is the same as in the related art.

As described above, the scrub amount decreases as the oscillation direction of the ultrasonic wave and the direction of connecting the wires decrease, and the scrub amount decreases as the oscillation direction of the ultrasonic wave and the direction of connecting the wires approach each other. By increasing, it is possible to suppress the occurrence of wire breakage and the occurrence of insufficient wire bonding.

In FIG. 3, the change in the scrub amount is, for example, between 0 ° and 90 ° and between 90 ° and 180 °.
Although it is changed linearly up to, it is not limited to this. By performing experiments and simulations, the change characteristics of the amount of scrub may be set as appropriate.

When the control method of the wire bonding apparatus according to the present embodiment is used, the amount of scrub of the capillary 1 is changed according to the angle difference between the ultrasonic wave oscillating direction and the wire connecting direction. And insufficient wire bonding can be suppressed.

In the above control method, the setting of the scrub amount in the control program in the XY stage of the current wire bonding apparatus is changed so as to have the change characteristic as described above, so that the wire bonding apparatus can be easily realized. Can be embodied.

<Modification> In the first embodiment, the vibration of the ultrasonic horn 2 in the Z-axis direction is detected from the output of the encoder EC of the Z-axis motor MT. But,
In addition to using the output of the encoder EC of the Z-axis motor MT, for example, providing a camera for monitoring the ultrasonic horn 2, attaching a distortion sensor to the ultrasonic horn 2, and monitoring the output of the distortion sensor, etc. Accordingly, the vibration of the ultrasonic horn 2 in the Z-axis direction can be detected. Further, these other methods may be used in combination with the output of the encoder EC.

[0051]

According to the first aspect of the present invention, the control means controls the motor so as to suppress the upward swing of the ultrasonic horn after landing, so that the tip of the capillary is positioned with respect to the bonding surface. The applied load can be stabilized. As a result, the bondability between the bonding surface and the wire can be improved.

According to the second aspect of the present invention, the control means further controls the motor so as to suppress the downward swing of the ultrasonic horn after landing, so that the tip of the capillary is positioned with respect to the bonding surface. The applied load can be stabilized. As a result, the bondability between the bonding surface and the wire can be improved.

According to the invention of claim 3, according to claim 1,
Alternatively, there is an effect similar to that of the second aspect of the present invention.

According to the fourth aspect of the invention, since the swing of the horn after landing is detected based on the electric signal output from the encoder, it is only necessary to change the current control method of the wire bonding apparatus. No special device is required to detect horn vibration.

According to the fifth aspect of the present invention, the scrubbing amount of the scrubbing process is increased as the angle between the ultrasonic wave oscillating direction and the direction in which the wires are connected is closer to 90 °. Further, occurrence of insufficient wire bonding can be suppressed.

According to the invention of claim 6, according to claim 5,
Has the same effect as the invention described in (1).

[Brief description of the drawings]

FIG. 1 is a diagram showing a control method of a wire bonding apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a view illustrating a flowchart of a control method of the wire bonding apparatus according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a control method of a wire bonding apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a control method of a wire bonding apparatus according to Embodiment 2 of the present invention.

FIG. 5 is a view showing a wire bonding apparatus.

FIG. 6 is a diagram showing a configuration of a load control unit and a Z-axis motor unit in the wire bonding apparatus.

FIG. 7 is a diagram illustrating a control method of a conventional wire bonding apparatus.

FIG. 8 is a diagram illustrating a control method of a conventional wire bonding apparatus.

FIG. 9 is a diagram illustrating a control method of a conventional wire bonding apparatus.

[Explanation of symbols]

1 Capillary, 2 ultrasonic horn, 3 Z axis motor section, 4 load control section, 5 bonding head, 6 XY
Table, MT Z-axis motor, EC encoder, FB
Z-axis feedback pulse generator, TR Z-axis torque command pulse generator.

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Masayuki Hiroki 2-6-1 Otemachi, Chiyoda-ku, Tokyo F-term (reference) 5F044 BB01 BB06 in Mitsubishi Electric Engineering Co., Ltd.

Claims (6)

[Claims] 1. A capillary through which a wire can be inserted, a horn that holds the capillary and can swing up and down, a motor that applies a torque to the horn in a vertical direction, and a motor that Using a wire bonding apparatus including a control unit that controls and a detection unit that detects vertical swing of the horn, during a period in which the capillary lands on the bonding surface, the horn moves upward. A control method for a wire bonding apparatus, wherein when the detecting means detects the swing, the control means controls the motor so as to apply a downward torque to the horn. 2. The method for controlling a wire bonding apparatus according to claim 1, wherein the horn swings downward while the capillary lands on the bonding surface. The control method of the wire bonding apparatus, wherein the control means further controls the motor so as to apply an upward torque to the horn when the means detects the horn. 3. A capillary through which a wire can be inserted, a horn that holds the capillary and can swing vertically, a motor that applies a torque to the horn in a vertical direction, and a motor that A wire bonding apparatus controlled by the control method of the wire bonding apparatus according to claim 1, further comprising: control means for controlling; and detecting means for detecting swinging of the horn in a vertical direction. 4. The wire bonding apparatus according to claim 3, wherein the detection unit is an encoder that counts rotation of the motor and converts the rotation into an electric signal. 5. A capillary through which a wire can be inserted, an ultrasonic horn holding the capillary and capable of generating ultrasonic waves, a support portion supporting the ultrasonic horn, and a surface facing the support portion. Using a wire bonding apparatus comprising: a table having, during the period in which the capillary lands on the bonding surface, transmitting the ultrasonic waves to the capillary to fix the wire to the bonding surface; A scrub process is performed in a direction in which the wires are connected by vibrating the table along the bonding surface. The scrub process is performed as the angle between the oscillation direction of the ultrasonic waves and the direction in which the wires are connected approaches 90 °. A method for controlling a wire bonding apparatus, which increases the amount of scrubbing. 6. A capillary through which a wire can be inserted, an ultrasonic horn that holds the capillary and can generate ultrasonic waves, a support that supports the ultrasonic horn, and a surface that faces the support. A wire bonding apparatus controlled by the method for controlling a wire bonding apparatus according to claim 5.