JP3818932B2 - Wire bonding equipment - Google Patents

Wire bonding equipment Download PDF

Info

Publication number
JP3818932B2
JP3818932B2 JP2002057101A JP2002057101A JP3818932B2 JP 3818932 B2 JP3818932 B2 JP 3818932B2 JP 2002057101 A JP2002057101 A JP 2002057101A JP 2002057101 A JP2002057101 A JP 2002057101A JP 3818932 B2 JP3818932 B2 JP 3818932B2
Authority
JP
Japan
Prior art keywords
pressure sensor
bonding
ultrasonic
wire
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002057101A
Other languages
Japanese (ja)
Other versions
JP2003258021A (en
Inventor
剛充 安本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP2002057101A priority Critical patent/JP3818932B2/en
Publication of JP2003258021A publication Critical patent/JP2003258021A/en
Application granted granted Critical
Publication of JP3818932B2 publication Critical patent/JP3818932B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
この発明はワイヤボンディング装置、詳しくは、キャピラリィを駆動させるボンディングヘッドに圧力センサを設け、この圧力センサの検知出力に基づきキャピラリィの押付荷重、超音波振動等を制御するワイヤボンディング装置に関する。
【０００２】
【従来の技術】
ワイヤボンディング装置においては、周知のように、ヒータプレート上にリードフレームとチップ等を載置して加熱し、ボンディングヘッドのキャピラリィをリニアモータ等により上下(Ｚ軸方向)に駆動してワイヤボンディングを行う。すなわち、ボンディングに際しては、キャピラリィによりワイヤをチップ等の接合点に相当の押付荷重をもって押付、また、超音波等を印加し、ワイヤをチップの接合点に印加する。
【０００３】
【発明が解決しようとする課題】
ところが、上述したワイヤボンディング装置にあっては、キャピラリがワイヤをチップ等の接合点に押しつけたときの影響でキャピラリィとともにワイヤがＺ軸方向に振動し、ワイヤの接合端の形状(ボールボンディングにあたっては、ボールの形状やボール径等)のバラツキや接合不良の不都合を生じるという問題があった。すなわち、ボンディング時のワイヤの挙動を考察すると、ワイヤは先ずある加速をもってチップに当接（衝突）した後に一定荷重で押圧されるが、衝突の影響で後の一定荷重での押圧期間においても振動し、この振動が押圧荷重の変動を生じ、上述した不都合を招いていた。
【０００４】
そこで、従来のワイヤボンディング装置にあっては、ボンディングヘッドにキャピラリィのＺ軸方向変位を検出するセンサ、例えば、エンコーダを設け、このエンコーダの検知出力をボンディングヘッドのリニアモータの制御装置にフィードバックしてキャピラリィの駆動制御を行い、キャピラリィの振動を防止することが行われている。
【０００５】
また、ヒータプレートを有するヒータブロック内に圧力センサを搭載し、圧力センサにて押付荷重を制御することも行われている。
【０００６】
しかしながら、上述した従来のワイヤボンディング装置にあっては、エンコーダによりキャピラリィのＺ軸方向変位を検出するに過ぎないため、ワイヤの押付荷重を判定できず、上述した不都合を完全に解消することが困難であった。さらに上述したエンコーダは変位に対する分解能が限られ、キャピラリィの変位が小さい場合、すなわち、振動の振幅が小さい場合は検出不能となる。
【０００７】
また、上述のヒータブロック内に搭載した圧力センサの場合、ヒータプレート内での押圧荷重が場所によって変動し、安定した検出結果がえられないという問題がある。
【０００８】
この発明は、上記事情に鑑みてされたもので、ボンディングの際の、ワイヤの押付荷重を直接に安定して検出できるワイヤボンディング装置を提供し、ワイヤ接合端の形状のバラツキや接合不良等の不具合を解消することを目的とする。
【０００９】
また、超音波の制御に関しては電気信号の検出による制御は行われていたが接合の際、超音波ホーン自体の振動状態を検出することは不可能であった。
【００１０】
この発明は、上記事情に鑑みてされたもので、ボンディングの際の超音波振動を直接に安定して検出できるワイヤボンディング装置を提供し、ワイヤ接合端の形状のバラツキや接合不良等の不具合を解消することを目的とする。
【００１１】
【課題を解決するための手段】
本発明のボンディング装置は、支軸を中心に揺動自在に構成されたボンディングアームと、該ボンディングアームの一端に取り付けられ先端部にキャピラリィを有する超音波ホーンとを備えたビンディングヘッドを有するワイヤボンディング装置において、前記超音波ホーンの後端部に超音波振動子を取り付けるとともに、前記ボンディングアームの一端と前記超音波ホーンの後端部との間に、板状に形成され、その中央部に前記超音波振動子が貫通する穴を有し、前記キャピラリィによる押付荷重を検出する圧力センサを配置した。
【００１３】
そして、前記圧力センサの検知出力に基づき前記キャピラリィの駆動系を制御する。
さらに、前記圧力センサの検知出力に基づき前記超音波ホーンの振動を制御する。
また、前記ボンディングヘッドの超音波ホーンとボンディングアームの間に取り付けられている前記圧力センサは、圧電式の水晶センサであることを特徴とする。
【００１４】
この発明にかかるワイヤボンディング装置は、キャピラリィによりワイヤがチップ等に押し付けられると、この押付荷重が超音波ホーン等を含むボンディングヘッドに伝達されて圧力センサにより検出される。例えば、圧力センサをボンディングヘッドに設けた場合、押付荷重により、超音波ホーン、ボンディングアームの変形を生じ、この変形による力を圧力センサが検出し、押付荷重が直接検出される。このため、圧力センサの検出出力を基にキャピラリィのＺ軸方向の変位を制御することでワイヤ接合端の形状を一定にでき、また、接合不良の解消される。
【００１５】
さらに、ボンディングヘッドに圧力センサを取り付けたことにより、ＸＹ軸方向の移動をしたときでも場所による検出結果の変動をなくすことができる。
【００１６】
また、キャピラリィによりワイヤがチップ等に押し付けられ超音波振動を印加したとき、超音波振動が圧力センサにより検出される。このため、検出出力を基に超音波振動の出力を制御することでワイヤ接合端の形状を一定にでき、また、接合不良の解消される。
【００１７】
【発明の実施の形態】
以下、この発明の実施形態を，図面を参照して説明する。
【００１８】
図１は、ボンディングヘッドとヒータユニット、荷重制御を示す正面図、図２は、超音波ホーン、振動素子を含むボンディングヘッドとヒータユニット、超音波振動制御を示す正面図、図３は、圧力センサの取付部の斜視図、図４は、圧力センサの形態を示す斜視図、図５は荷重検出時の荷重伝達を示す正面図である。
【００１９】
図１において、１０はボンディングヘッド、２０はヒータユニットを示し。ボンディングヘッド１０が図示しないＸＹテーブル上に、ヒータユニット２０が図示しないＺテーブル上に搭載される。ボンディングヘッド１０は支軸１１に揺動自在にボンディングアーム１２を支持し、このボンディングアーム１２の一端に超音波ホーン１３を介してキャピラリィ１４が取り付けられ、またボンディングアーム１２の他端がリニアモータ１５に連結する。
【００２０】
リニアモータ１５は、制御装置と接続して制御され、ボンディングアーム１２ｑお支軸１１周りに揺動駆動してキャピラリィ１４を上下（Ｚ軸方向）に駆動する。後述するが、リニアモータ１５の制御装置１９は圧力センサが接続し、この圧力センサの検出出力等に基づきリニアモータ１５を制御する。
【００２１】
ヒータユニット２０は、ヒータブロック２２上にヒータプレート２１を取り付けてなり、ヒータブロック２２が図示しない取付台上にボルト等で固定される。ヒータプレート上面には、図示しない走行駆動機構により走行駆動されるリードフレームＨが載置され、また、半導体チップＳが図示しないロボットにより載置される。
【００２２】
超音波ホーン１３の一端（後端部）には、後述するように、図２に示すような形態で超音波振動子１６が取り付けられており、超音波ホーン１３とボンディングアーム１２との間に圧力センサー４１が収納・配置されている。圧力センサー４１は、図４に示すように、中央部に円形の穴が設けらた板状に形成され、穴の周縁部にセンサーが配置されている。超音波ホーン１６とボンディングアーム１２とを圧力センサー４１を介して取り付ける時に、超音波ホーン１３に取り付けられた超音波振動子１６は、圧力センサ４１に設けられた穴を貫通する。
【００２３】
圧力センサ４１は、圧電式の水晶センサ等が用いられ、チャージアンプ４２とフィードバック回路４３を直列に介して前述したリニアモータ１５の制御装置１９に接続される。この圧力センサ４１は、ボンディングの際にワイヤがキャピラリィ１４により半導体チップＳ等の接合点に押しつけられた時に生じる超音波ホーン１３の変形による圧力を検出し、この検知信号を、チャージアンプ４２等を介して制御装置１９に出力する。
【００２４】
この実施の形態にあたっては、ヒータプレート２１上に半導体チップＳとリードフレームＨを載置して図示しないカートリッジヒータにより加熱し、リニアモータ１５を制御装置１９により制御してボンディングアーム１２(超音波ホーン１３を含む)を駆動し、キャピラリィ１４を上下駆動させてキャピラリィ１４によりワイヤを所定の押付荷重たとえば１０ｇｆ〜２００ｇｆ程度の押付荷重で押し付ける。そして超音波を印加し、ワイヤを半導体チップＳの接合点等に融着する。
【００２５】
ここで、ワイヤが半導体チップＳの接合点に押し付けられるとこの押付加重がキャピラリィを介して超音波ホーンに１３伝達され、この超音波ホーン１３の変形により圧力センサ４１に圧力が作用し、圧力センサ４１が圧力、すなわち、押付加重を検出して検知信号を出力する。そして、制御装置１９は、圧力センサ４１の検知信号に基づきリニアモータ１５を制御、たとえば、押付加重が所定の特性(例えば、一定)になるようにキャピラリィ１４の上下動を制御する。
【００２６】
したがって、キャピラリィ１４の振動を抑制でき、押付加重を一定に保持できるため、ワイヤ接合端の形状を一定にでき、また、接合不良の発生も防止できる。すなわち、前述したようにワイヤを押した際には、ワイヤが接合点に当接したときの衝撃の影響でワイヤとともにキャピラリィ１４が振動するが、圧力センサ４１の検知信号に基づき押付荷重を一定にするようにキャピラリィ１４を制御するため、その振動を防止でき、接合不良が防止できる。また、圧力センサをボンディングヘッド１０に取り付けることにより、ＸＹ方向の場所による検知結果の誤差や、半導体チップＳ、ヒータプレート２１等の状態に関わらず安定した検知信号が得られる。
図２において、図１同様の形態を成し、超音波ホーン１３の一端に超音波素子１６が取り付けられている様子を示している。
【００２７】
キャピラリィ１４には、図示しないワイヤが配索され、超音波素子１６が発振した超音波が超音波ホーン１３を経て伝達される。超音波素子１６は超音波発信器１７から出す信号で振動する。超音波発信器１７には、フィードバック回路(超音波)４４を通して圧力センサ４１が接続し、この圧力センサにより検出された超音波振動をフィードバック回路(超音波)４４を介して超音波発信器１７にて制御する。
【００２８】
図１と同様にボンディングアーム、超音波ホーン１３間に圧力センサ４１が収納され、チャージアンプ４２とフィードバック回路(超音波)４４を直列に介して超音波発信器１７に接続される。圧力センサ４１は、ボンディングの際に印加する超音波振動を検出し、この検知信号にチャージアンプ４２等を介して超音波発信器１７に出力する。
【００２９】
ここで、超音波ホーン１３が振動することにより圧力センサが振動を検出し検出信号を出力する。そして超音波発信器１７は超音波の印加タイミングを制御する。
【００３０】
【発明の効果】
以上説明したように、この発明にかかるワイヤボンディング装置によれば、キャピラリィを駆動させるボンディングヘッドに圧力センサを取り付け、この圧力センサによりワイヤの押付(荷重)を検出するため、ワイヤの押付荷重を正確かつ速やかに判断でき、また、ワイヤがワークに接触した時期(タイミング)も速やかに判別できる。さらに、超音波の印加タイミングを正確に判断することができる。
【００３１】
特に、上述した実施の形態にあったは、圧力センサによりワイヤの押付加重を検出し、この圧力センサの検知出力に基づきワイヤの押付加重が所定の特性になるようにキャピラリィの上下動を制御するため、ワイヤ接合端の形状を一定とでき、また、超音波印加タイミングを制御することも含めて接合不良の発生も防止できる。
【００３２】
【図面の簡単な説明】
【図１】ボンディングヘッドとヒータユニット、荷重制御を示すブロック図である。
【図２】超音波ホーン、振動素子を含むボンディングアヘッドとヒータユニット、超音波振動制御を示すブロック図である。
【図３】同ワイヤボンディング装置のボンディングヘッドに圧力センサを取付た斜視図である。
【図４】（ａ）
圧力センサの４センサ平均化方式の斜視図である。
（ｂ）
圧力センサの１センサ出力方式の斜視図である。
【図５】この発明の押圧荷重検出の荷重伝達を示した正面図である。
【符号の説明】
１０ ボンディングヘッド
１２ ボンディングアーム
１３ 超音波ホーン
１４ キャピラリィ
１５ リニアモータ
１６ 振動素子
１７ 超音波発信器
１９ 制御装置
２０ ヒータユニット
２１ ヒータプレート
２２ ヒータブロック
４１ 圧力センサ
４２ チャージアンプ
４３ フィードバック回路
４４ フィードバック回路(超音波)
Ｈ リードフレーム
Ｓ 半導体チップ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonding apparatus, and more particularly, to a wire bonding apparatus in which a pressure sensor is provided in a bonding head that drives a capillary, and the pressing load, ultrasonic vibration, and the like of the capillary are controlled based on the detection output of the pressure sensor.
[0002]
[Prior art]
In a wire bonding apparatus, as is well known, a lead frame and a chip are placed on a heater plate and heated, and the capillary of the bonding head is driven up and down (in the Z-axis direction) by a linear motor or the like to perform wire bonding. Do. That is, in bonding, a wire is pressed by a capillary with a pressing load corresponding to a bonding point of a chip or the like, an ultrasonic wave or the like is applied, and the wire is applied to the bonding point of the chip.
[0003]
[Problems to be solved by the invention]
However, in the wire bonding apparatus described above, the wire vibrates in the Z-axis direction together with the capillary due to the influence of the capillary pressing the wire against the bonding point such as a chip, and the shape of the bonding end of the wire (in ball bonding) In other words, there are problems such as variations in ball shape, ball diameter, etc.) and inconvenience of poor bonding. In other words, considering the behavior of the wire during bonding, the wire is first pressed against the chip with a certain acceleration (collision) and then pressed with a constant load. However, due to the impact, the wire also vibrates during the subsequent pressing period with a constant load. However, this vibration causes fluctuations in the pressing load, causing the above-mentioned disadvantages.
[0004]
Therefore, in the conventional wire bonding apparatus, a sensor for detecting the displacement in the Z-axis direction of the capillary, for example, an encoder is provided in the bonding head, and the detection output of this encoder is fed back to the control apparatus for the linear motor of the bonding head. Capillary drive control is performed to prevent capillary vibration.
[0005]
In addition, a pressure sensor is mounted in a heater block having a heater plate, and the pressing load is controlled by the pressure sensor.
[0006]
However, in the above-described conventional wire bonding apparatus, only the displacement of the capillary in the Z-axis direction is detected by the encoder, so that the pressing load of the wire cannot be determined, and it is difficult to completely eliminate the inconvenience described above. Met. Furthermore, the encoder described above has limited resolution with respect to displacement, and cannot be detected when the displacement of the capillary is small, that is, when the amplitude of vibration is small.
[0007]
Further, in the case of the pressure sensor mounted in the heater block described above, there is a problem that the pressing load in the heater plate varies depending on the location, and a stable detection result cannot be obtained.
[0008]
The present invention has been made in view of the above circumstances, and provides a wire bonding apparatus capable of directly and stably detecting a pressing load of a wire at the time of bonding, such as variations in the shape of wire bonding ends and bonding defects. The purpose is to solve the problem.
[0009]
Further, regarding the control of the ultrasonic wave, the control by the detection of the electric signal has been performed, but it is impossible to detect the vibration state of the ultrasonic horn itself at the time of joining.
[0010]
The present invention has been made in view of the above circumstances, and provides a wire bonding apparatus capable of directly and stably detecting ultrasonic vibrations during bonding, and solves problems such as variations in the shape of wire bonding ends and bonding defects. The purpose is to eliminate.
[0011]
[Means for Solving the Problems]
A bonding apparatus according to the present invention is a wire bonding having a binding head including a bonding arm configured to be swingable about a support shaft, and an ultrasonic horn attached to one end of the bonding arm and having a capillary at a tip. In the apparatus, an ultrasonic transducer is attached to a rear end portion of the ultrasonic horn, and is formed in a plate shape between one end of the bonding arm and a rear end portion of the ultrasonic horn, A pressure sensor that has a hole through which the ultrasonic transducer penetrates and detects a pressing load by the capillary was disposed.
[0013]
The capillary drive system is controlled based on the detection output of the pressure sensor.
Furthermore, the vibration of the ultrasonic horn is controlled based on the detection output of the pressure sensor.
The pressure sensor attached between the ultrasonic horn of the bonding head and the bonding arm is a piezoelectric crystal sensor.
[0014]
In the wire bonding apparatus according to the present invention, when a wire is pressed against a chip or the like by a capillary, the pressing load is transmitted to a bonding head including an ultrasonic horn and detected by a pressure sensor. For example, when the pressure sensor is provided in the bonding head, the ultrasonic horn and the bonding arm are deformed by the pressing load, the pressure sensor detects the force due to the deformation, and the pressing load is directly detected. For this reason, by controlling the displacement of the capillary in the Z-axis direction based on the detection output of the pressure sensor, the shape of the wire bonding end can be made constant, and the bonding failure can be eliminated.
[0015]
Furthermore, by attaching a pressure sensor to the bonding head, it is possible to eliminate fluctuations in detection results depending on the location even when moving in the XY axis direction.
[0016]
Further, when ultrasonic vibration is applied by pressing the wire against the chip or the like by the capillary, the ultrasonic vibration is detected by the pressure sensor. For this reason, by controlling the output of the ultrasonic vibration based on the detection output, the shape of the wire bonding end can be made constant, and the bonding failure can be eliminated.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0018]
1 is a front view showing a bonding head and a heater unit and load control, FIG. 2 is a front view showing an ultrasonic horn and a vibration unit including a bonding head and a heater unit, and FIG. 3 is a pressure sensor. FIG. 4 is a perspective view showing a form of a pressure sensor, and FIG. 5 is a front view showing load transmission at the time of load detection.
[0019]
In FIG. 1, 10 is a bonding head, and 20 is a heater unit. The bonding head 10 is mounted on an XY table (not shown), and the heater unit 20 is mounted on a Z table (not shown). The bonding head 10 supports a bonding arm 12 swingably on a support shaft 11. A capillary 14 is attached to one end of the bonding arm 12 via an ultrasonic horn 13, and the other end of the bonding arm 12 is a linear motor 15. Connect to
[0020]
Linear motor 15 is controlled by connecting a control unit to drive the capillary 14 and swung to the bonding arm 12q Contact support shaft 11 around the vertical (Z-axis direction). As will be described later, the control device 19 of the linear motor 15 is connected to a pressure sensor, and controls the linear motor 15 based on the detection output of the pressure sensor.
[0021]
The heater unit 20 has a heater plate 21 mounted on a heater block 22, and the heater block 22 is fixed on a mounting base (not shown) with bolts or the like. On the upper surface of the heater plate, a lead frame H that is driven by a travel drive mechanism (not shown) is placed, and a semiconductor chip S is placed by a robot (not shown).
[0022]
As will be described later, an ultrasonic transducer 16 is attached to one end (rear end portion) of the ultrasonic horn 13 in the form shown in FIG. 2, and between the ultrasonic horn 13 and the bonding arm 12. A pressure sensor 41 is stored and arranged. As shown in FIG. 4, the pressure sensor 41 is formed in a plate shape with a circular hole provided at the center, and the sensor is disposed at the peripheral edge of the hole. When the ultrasonic horn 16 and the bonding arm 12 are attached via the pressure sensor 41, the ultrasonic transducer 16 attached to the ultrasonic horn 13 passes through a hole provided in the pressure sensor 41.
[0023]
The pressure sensor 41 is a piezoelectric crystal sensor or the like, and is connected to the control device 19 of the linear motor 15 described above via a charge amplifier 42 and a feedback circuit 43 in series. The pressure sensor 41 detects the pressure due to the deformation of the ultrasonic horn 13 that is generated when the wire is pressed against the bonding point of the semiconductor chip S or the like by the capillary 14 during bonding, and this detection signal is sent to the charge amplifier 42 or the like. To the control device 19.
[0024]
In this embodiment, the semiconductor chip S and the lead frame H are placed on the heater plate 21 and heated by a cartridge heater (not shown), and the linear motor 15 is controlled by the control device 19 to control the bonding arm 12 (ultrasonic horn). 13), the capillary 14 is driven up and down, and the wire is pressed by the capillary 14 with a predetermined pressing load, for example, a pressing load of about 10 gf to 200 gf. Then, an ultrasonic wave is applied, and the wire is fused to the junction point of the semiconductor chip S or the like.
[0025]
Here, when the wire is pressed against the junction point of the semiconductor chip S, this additional weight is transmitted to the ultrasonic horn 13 via the capillary, and pressure is applied to the pressure sensor 41 due to the deformation of the ultrasonic horn 13. 41 detects the pressure, that is, the pressing weight, and outputs a detection signal. Then, the control device 19 controls the linear motor 15 based on the detection signal of the pressure sensor 41, for example, controls the vertical movement of the capillary 14 so that the pressing and adding weight has a predetermined characteristic (for example, constant).
[0026]
Therefore, the vibration of the capillary 14 can be suppressed, and the pressing and adding weight can be kept constant, so that the shape of the wire joining end can be made constant, and the occurrence of bonding failure can be prevented. That is, when the wire is pushed as described above, the capillary 14 vibrates together with the wire due to the impact when the wire comes into contact with the joining point, but the pressing load is made constant based on the detection signal of the pressure sensor 41. Thus, since the capillary 14 is controlled, the vibration can be prevented and the bonding failure can be prevented. Further, by attaching the pressure sensor to the bonding head 10, a stable detection signal can be obtained regardless of the detection result error due to the location in the XY direction, the state of the semiconductor chip S, the heater plate 21, and the like.
In FIG. 2, a state similar to that of FIG. 1 is shown, and an ultrasonic element 16 is attached to one end of the ultrasonic horn 13.
[0027]
A wire (not shown) is routed in the capillary 14, and the ultrasonic wave oscillated by the ultrasonic element 16 is transmitted through the ultrasonic horn 13. The ultrasonic element 16 vibrates with a signal output from the ultrasonic transmitter 17. A pressure sensor 41 is connected to the ultrasonic transmitter 17 through a feedback circuit (ultrasonic wave) 44, and ultrasonic vibration detected by the pressure sensor is transmitted to the ultrasonic transmitter 17 through the feedback circuit (ultrasonic wave) 44. Control.
[0028]
As in FIG. 1, a pressure sensor 41 is accommodated between the bonding arm and the ultrasonic horn 13 and connected to the ultrasonic transmitter 17 via a charge amplifier 42 and a feedback circuit (ultrasonic wave) 44 in series. The pressure sensor 41 detects ultrasonic vibration applied during bonding, and outputs this detection signal to the ultrasonic transmitter 17 via the charge amplifier 42 and the like.
[0029]
Here, when the ultrasonic horn 13 vibrates, the pressure sensor detects the vibration and outputs a detection signal. The ultrasonic transmitter 17 controls the application timing of ultrasonic waves.
[0030]
【The invention's effect】
As described above, according to the wire bonding apparatus according to the present invention, a pressure sensor is attached to a bonding head that drives a capillary, and the pressure (load) of the wire is detected by the pressure sensor. In addition, it is possible to quickly determine the timing (timing) when the wire contacts the workpiece. Furthermore, it is possible to accurately determine the application timing of ultrasonic waves.
[0031]
In particular, according to the above-described embodiment, the pressing force of the wire is detected by the pressure sensor, and the vertical movement of the capillary is controlled based on the detection output of the pressure sensor so that the pressing force of the wire has a predetermined characteristic. Therefore, the shape of the wire bonding end can be made constant, and the occurrence of bonding failure can be prevented including controlling the timing of applying ultrasonic waves.
[0032]
[Brief description of the drawings]
FIG. 1 is a block diagram showing a bonding head, a heater unit, and load control.
FIG. 2 is a block diagram showing an ultrasonic horn, a bonding ahead including a vibration element, a heater unit, and ultrasonic vibration control.
FIG. 3 is a perspective view in which a pressure sensor is attached to the bonding head of the wire bonding apparatus.
FIG. 4 (a)
It is a perspective view of the 4-sensor averaging system of a pressure sensor.
(B)
It is a perspective view of 1 sensor output system of a pressure sensor.
FIG. 5 is a front view showing load transmission for detecting a pressing load according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Bonding head 12 Bonding arm 13 Ultrasonic horn 14 Capillary 15 Linear motor 16 Vibrating element 17 Ultrasonic transmitter 19 Controller 20 Heater unit 21 Heater plate 22 Heater block 41 Pressure sensor 42 Charge amplifier 43 Feedback circuit 44 Feedback circuit (ultrasonic wave) )
H Lead frame S Semiconductor chip

Claims (4)

支軸を中心に揺動自在に構成されたボンディングアームと、該ボンディングアームの一端に取り付けられ先端部にキャピラリィを有する超音波ホーンとを備えたボンディングヘッドを有するワイヤボンディング装置において、前記超音波ホーンの後端部に超音波振動子を取り付けるとともに、前記ボンディングアームの一端と前記超音波ホーンの後端部との間に、板状に形成され、その中央部に前記超音波振動子が貫通する穴を有し、前記キャピラリィによる押付荷重を検出する圧力センサを配置したことを特徴とするワイヤボンディング装置。In the wire bonding apparatus having a bonding head comprising a bonding arm configured to be swingable about a support shaft, and an ultrasonic horn attached to one end of the bonding arm and having a capillary at a tip, the ultrasonic horn An ultrasonic transducer is attached to the rear end of the ultrasonic transducer, and is formed in a plate shape between one end of the bonding arm and the rear end of the ultrasonic horn, and the ultrasonic transducer penetrates through the center of the plate. A wire bonding apparatus having a hole and a pressure sensor for detecting a pressing load by the capillary. 前記圧力センサの検知出力に基づき前記キャピラリィの駆動系を制御する請求項１に記載のワイヤボンディング装置。The wire bonding apparatus according to claim 1, wherein a drive system of the capillary is controlled based on a detection output of the pressure sensor. 前記圧力センサの検知出力に基づき前記超音波ホーンの超音波振動を制御する請求項１に記載のワイヤボンディング装置。The wire bonding apparatus of Claim 1 which controls the ultrasonic vibration of the said ultrasonic horn based on the detection output of the said pressure sensor. 前記圧力センサは、圧電式の水晶センサであることを特徴とする請求項１、２、３のいずれか１項に記載のワイヤボンディング装置。The wire bonding apparatus according to claim 1, wherein the pressure sensor is a piezoelectric crystal sensor .
JP2002057101A 2002-03-04 2002-03-04 Wire bonding equipment Expired - Lifetime JP3818932B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002057101A JP3818932B2 (en) 2002-03-04 2002-03-04 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002057101A JP3818932B2 (en) 2002-03-04 2002-03-04 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JP2003258021A JP2003258021A (en) 2003-09-12
JP3818932B2 true JP3818932B2 (en) 2006-09-06

Family

ID=28667455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002057101A Expired - Lifetime JP3818932B2 (en) 2002-03-04 2002-03-04 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP3818932B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679454B2 (en) 2006-07-13 2011-04-27 株式会社新川 Wire bonding equipment
JP4762934B2 (en) 2007-02-28 2011-08-31 株式会社新川 Horn mounting arm
CH700729B1 (en) * 2008-02-29 2010-10-15 Oerlikon Assembly Equipment Ag Wire Bonder.
JP4314313B1 (en) * 2008-06-30 2009-08-12 株式会社新川 Bonding equipment
JP4275724B1 (en) 2008-07-16 2009-06-10 株式会社新川 Bonding quality determination method, bonding quality determination device, and bonding apparatus
CN112967976B (en) * 2020-06-19 2022-09-27 重庆康佳光电技术研究院有限公司 Mass transfer device and transfer method

Also Published As

Publication number Publication date
JP2003258021A (en) 2003-09-12

Similar Documents

Publication Publication Date Title
US8800843B2 (en) Bonding apparatus
JP3276421B2 (en) Control system
JP4469503B2 (en) Bump bonding determination apparatus and method, and semiconductor component manufacturing apparatus and method
WO2018038113A1 (en) Wire bonding method and wire bonding device
JP2014205350A (en) Ultrasonic press using servo motor with delayed motion
JP3818932B2 (en) Wire bonding equipment
US5607096A (en) Apparatus and method for ultrasonic bonding lead frames and bonding wires in semiconductor packaging applications
JP5038989B2 (en) Ultrasonic metal bonding machine
JP2877771B2 (en) Wire bonding equipment
JP4722117B2 (en) Wire bonding equipment
JP3724875B2 (en) A wire bonding method, a semiconductor mounting method using the wire bonding method, a wire bonding apparatus, and a semiconductor mounting apparatus including the wire bonding apparatus.
JP3528643B2 (en) Wire bonding equipment
JP4431020B2 (en) Ultrasonic vibration bonding method and apparatus
JP3567884B2 (en) Ultrasonic bonding method
GB2565191A (en) Punch riveting device with counter-vibration coupling
JPH0732174B2 (en) Ultrasonic wire bonding method and device
JPH10256320A (en) Semiconductor manufacturing equipment
JP4337042B2 (en) Joining method
JP3389919B2 (en) Wire bonding apparatus and servo adjustment method used therefor
JP3399679B2 (en) Wire bonding apparatus and wire bonding method
JPH08330366A (en) Device and method for wire bonding
JP2023113279A (en) Ultrasonic joining device
JP4665339B2 (en) Ultrasonic bonding equipment
JP2531735B2 (en) Wire bonding equipment
JP3013630B2 (en) Ground detector for wire bonder

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050209

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050422

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060222

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060328

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060418

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060516

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060613

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3818932

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100623

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110623

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110623

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120623

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130623

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140623

Year of fee payment: 8

EXPY Cancellation because of completion of term