JP6971012B2 - ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 - Google Patents

ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 Download PDF

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JP6971012B2
JP6971012B2 JP2016214727A JP2016214727A JP6971012B2 JP 6971012 B2 JP6971012 B2 JP 6971012B2 JP 2016214727 A JP2016214727 A JP 2016214727A JP 2016214727 A JP2016214727 A JP 2016214727A JP 6971012 B2 JP6971012 B2 JP 6971012B2
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bonding
axis
profile
wire
force
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JP2017092464A5 (enExample
JP2017092464A (ja
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シャー、アシシュ
エレンバーグ、ロバート、ウィリアム
バビネッツ、スティーブン
アハマッド、ジアウディン
チン、ウェイ
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クリック アンド ソッファ インダストリーズ、インク．
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    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2016214727A 2015-11-04 2016-11-02 ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法 Active JP6971012B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US62/250,745 2015-11-04
US15/234,563 2016-08-11
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods

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TWI712094B (zh) 2020-12-01
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