TWI731734B - 用於引線接合的接合機上的自動懸伸晶粒優化工具及相關方法 - Google Patents

用於引線接合的接合機上的自動懸伸晶粒優化工具及相關方法 Download PDF

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TWI731734B
TWI731734B TW109122367A TW109122367A TWI731734B TW I731734 B TWI731734 B TW I731734B TW 109122367 A TW109122367 A TW 109122367A TW 109122367 A TW109122367 A TW 109122367A TW I731734 B TWI731734 B TW I731734B
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bonding
axis
maximum
force
wire bonding
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TW109122367A
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Chinese (zh)
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TW202040716A (zh
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阿希什 沙
羅伯特 W. 艾倫伯格
史蒂芬 E. 巴貝尼斯
齊亞烏丁 艾哈邁德
偉 秦
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美商庫利克和索夫工業公司
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    • H01L24/745—Apparatus for manufacturing wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW109122367A 2015-11-04 2016-10-12 用於引線接合的接合機上的自動懸伸晶粒優化工具及相關方法 TWI731734B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562250745P 2015-11-04 2015-11-04
US62/250,745 2015-11-04
US15/234,563 2016-08-11
US15/234,563 US10121759B2 (en) 2015-11-04 2016-08-11 On-bonder automatic overhang die optimization tool for wire bonding and related methods

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TW202040716A TW202040716A (zh) 2020-11-01
TWI731734B true TWI731734B (zh) 2021-06-21

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