JP2013522887A5 - - Google Patents

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Publication number
JP2013522887A5
JP2013522887A5 JP2012557360A JP2012557360A JP2013522887A5 JP 2013522887 A5 JP2013522887 A5 JP 2013522887A5 JP 2012557360 A JP2012557360 A JP 2012557360A JP 2012557360 A JP2012557360 A JP 2012557360A JP 2013522887 A5 JP2013522887 A5 JP 2013522887A5
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JP
Japan
Prior art keywords
die
dies
substrate
group
oriented
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Application number
JP2012557360A
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English (en)
Japanese (ja)
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JP2013522887A (ja
JP5579879B2 (ja
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Priority claimed from PCT/CA2011/000253 external-priority patent/WO2011113136A1/en
Publication of JP2013522887A publication Critical patent/JP2013522887A/ja
Publication of JP2013522887A5 publication Critical patent/JP2013522887A5/ja
Application granted granted Critical
Publication of JP5579879B2 publication Critical patent/JP5579879B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012557360A 2010-03-18 2011-03-08 オフセットダイスタッキングを用いたマルチチップパッケージ Expired - Fee Related JP5579879B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31511110P 2010-03-18 2010-03-18
US61/315,111 2010-03-18
PCT/CA2011/000253 WO2011113136A1 (en) 2010-03-18 2011-03-08 Multi-chip package with offset die stacking and method of making same

Publications (3)

Publication Number Publication Date
JP2013522887A JP2013522887A (ja) 2013-06-13
JP2013522887A5 true JP2013522887A5 (enExample) 2014-02-20
JP5579879B2 JP5579879B2 (ja) 2014-08-27

Family

ID=44648377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012557360A Expired - Fee Related JP5579879B2 (ja) 2010-03-18 2011-03-08 オフセットダイスタッキングを用いたマルチチップパッケージ

Country Status (6)

Country Link
US (2) US8502368B2 (enExample)
EP (1) EP2548226A4 (enExample)
JP (1) JP5579879B2 (enExample)
KR (1) KR20130007602A (enExample)
CN (1) CN103098206A (enExample)
WO (1) WO2011113136A1 (enExample)

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WO2014103855A1 (ja) * 2012-12-25 2014-07-03 ピーエスフォー ルクスコ エスエイアールエル 半導体装置およびその製造方法
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GB2518476B (en) 2013-09-20 2015-11-04 Silicon Lab Inc Multi-chip modules having stacked television demodulators
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JP6761180B2 (ja) * 2016-12-28 2020-09-23 株式会社バッファロー 半導体装置
CN108389849A (zh) * 2018-02-05 2018-08-10 奥肯思（北京）科技有限公司 一种交错堆叠存储器封装
KR20200028562A (ko) * 2018-09-06 2020-03-17 에스케이하이닉스 주식회사 반도체패키지
US11139283B2 (en) * 2018-12-22 2021-10-05 Xcelsis Corporation Abstracted NAND logic in stacks
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JP2021145084A (ja) * 2020-03-13 2021-09-24 キオクシア株式会社 半導体装置
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KR102847506B1 (ko) * 2020-07-29 2025-08-20 에스케이하이닉스 주식회사 다이 위치 검사부들을 포함하는 반도체 패키지
US12136607B2 (en) * 2021-09-01 2024-11-05 Micron Technology, Inc. Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods
KR20230106410A (ko) * 2022-01-06 2023-07-13 삼성전자주식회사 반도체 패키지
KR20230143497A (ko) * 2022-04-05 2023-10-12 삼성전자주식회사 반도체 패키지 및 그의 제조 방법
CN119208284A (zh) * 2023-06-14 2024-12-27 长鑫存储技术有限公司 一种半导体封装结构

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