WO2008099933A1 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
WO2008099933A1
WO2008099933A1 PCT/JP2008/052571 JP2008052571W WO2008099933A1 WO 2008099933 A1 WO2008099933 A1 WO 2008099933A1 JP 2008052571 W JP2008052571 W JP 2008052571W WO 2008099933 A1 WO2008099933 A1 WO 2008099933A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor package
base section
adhering
corresponds
extend
Prior art date
Application number
PCT/JP2008/052571
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi Hasegawa
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to EP08711401A priority Critical patent/EP2112688A4/en
Publication of WO2008099933A1 publication Critical patent/WO2008099933A1/ja
Priority to US12/252,072 priority patent/US7911794B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　本発明は、ベース部（１０）の一表面に半導体素子（１６）が設けられた半導体パッケージに関し、前記ベース部が複数枚の薄板（１２，１４）を相互に密着させて一体的に接合することにより構成されており、前記ベース部中に発熱部位対応位置から外側の位置まで延出して配置されているヒートパイプ（３６）が少なくとも１つ含まれていることを特徴とする。
PCT/JP2008/052571 2007-02-15 2008-02-15 半導体パッケージ WO2008099933A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08711401A EP2112688A4 (en) 2007-02-15 2008-02-15 SEMICONDUCTOR HOUSING
US12/252,072 US7911794B2 (en) 2007-02-15 2008-10-15 Semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-035356 2007-02-15
JP2007035356 2007-02-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/252,072 Continuation US7911794B2 (en) 2007-02-15 2008-10-15 Semiconductor package

Publications (1)

Publication Number Publication Date
WO2008099933A1 true WO2008099933A1 (ja) 2008-08-21

Family

ID=39690158

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052571 WO2008099933A1 (ja) 2007-02-15 2008-02-15 半導体パッケージ

Country Status (6)

Country Link
US (3) US7732916B2 (ja)
EP (2) EP2112688A4 (ja)
JP (1) JP5112101B2 (ja)
KR (2) KR101017452B1 (ja)
TW (2) TW200849519A (ja)
WO (1) WO2008099933A1 (ja)

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JP5112101B2 (ja) * 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
EP2143139B1 (de) * 2007-04-26 2019-06-19 CeramTec GmbH Kühldose für bauelemente oder schaltungen
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US9500416B2 (en) * 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
TWM371400U (en) * 2009-02-13 2009-12-21 Asia Vital Components Co Ltd Heat-dissipation device of communication box
JP5806464B2 (ja) * 2010-02-03 2015-11-10 株式会社東芝 半導体素子収納用パッケージ及びそれを用いた半導体装置
KR200465926Y1 (ko) 2010-12-23 2013-03-18 자원전자 주식회사 교차 결합구조를 갖는 피씨비 어셈블리
JP5618419B2 (ja) 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
US9255741B2 (en) * 2012-01-26 2016-02-09 Lear Corporation Cooled electric assembly
JP5970581B1 (ja) * 2015-03-30 2016-08-17 株式会社フジクラ 携帯型電子機器用熱拡散板
TWI655892B (zh) * 2016-05-31 2019-04-01 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材
TWI659828B (zh) * 2016-07-27 2019-05-21 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材

Citations (3)

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JP2003037196A (ja) * 2001-07-25 2003-02-07 Kyocera Corp 光半導体素子収納用パッケージ
JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
JP2006032798A (ja) * 2004-07-20 2006-02-02 Furukawa Sky Kk ヒートパイプヒートシンク

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JP2000281802A (ja) * 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性成形体およびその製造方法ならびに半導体装置
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DE10101086B4 (de) * 2000-01-12 2007-11-08 International Rectifier Corp., El Segundo Leistungs-Moduleinheit
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JP2004288949A (ja) 2002-11-26 2004-10-14 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
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JP4210908B2 (ja) * 2003-02-19 2009-01-21 株式会社デンソー 半導体モジュール
JP2004249589A (ja) 2003-02-20 2004-09-09 Toshiba Corp 銅−モリブデン複合材料およびそれを用いたヒートシンク
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JP5112101B2 (ja) 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
JP5025328B2 (ja) 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037196A (ja) * 2001-07-25 2003-02-07 Kyocera Corp 光半導体素子収納用パッケージ
JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
JP2006032798A (ja) * 2004-07-20 2006-02-02 Furukawa Sky Kk ヒートパイプヒートシンク

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2112688A4 *

Also Published As

Publication number Publication date
TWI382507B (zh) 2013-01-11
KR20080103107A (ko) 2008-11-26
US7732916B2 (en) 2010-06-08
US7911794B2 (en) 2011-03-22
US8049316B2 (en) 2011-11-01
EP2112688A4 (en) 2011-09-21
TW200901403A (en) 2009-01-01
TW200849519A (en) 2008-12-16
JP2008227473A (ja) 2008-09-25
EP2112688A1 (en) 2009-10-28
KR20090033394A (ko) 2009-04-02
EP2120261A4 (en) 2016-10-12
JP5112101B2 (ja) 2013-01-09
US20090205806A1 (en) 2009-08-20
TWI351746B (ja) 2011-11-01
EP2120261A1 (en) 2009-11-18
KR101017452B1 (ko) 2011-02-25
US20090091891A1 (en) 2009-04-09
KR101066711B1 (ko) 2011-09-21
US20080197462A1 (en) 2008-08-21

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