TWI351746B - - Google Patents

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Publication number
TWI351746B
TWI351746B TW097105367A TW97105367A TWI351746B TW I351746 B TWI351746 B TW I351746B TW 097105367 A TW097105367 A TW 097105367A TW 97105367 A TW97105367 A TW 97105367A TW I351746 B TWI351746 B TW I351746B
Authority
TW
Taiwan
Prior art keywords
base portion
semiconductor element
heat
semiconductor
granule
Prior art date
Application number
TW097105367A
Other languages
English (en)
Chinese (zh)
Other versions
TW200849519A (en
Inventor
Tsuyoshi Hasegawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200849519A publication Critical patent/TW200849519A/zh
Application granted granted Critical
Publication of TWI351746B publication Critical patent/TWI351746B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW097105367A 2007-02-15 2008-02-15 Semiconductor package TW200849519A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007035356 2007-02-15
JP2008029614A JP5112101B2 (ja) 2007-02-15 2008-02-08 半導体パッケージ

Publications (2)

Publication Number Publication Date
TW200849519A TW200849519A (en) 2008-12-16
TWI351746B true TWI351746B (ja) 2011-11-01

Family

ID=39690158

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097105367A TW200849519A (en) 2007-02-15 2008-02-15 Semiconductor package
TW097105364A TWI382507B (zh) 2007-02-15 2008-02-15 Semiconductor package

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW097105364A TWI382507B (zh) 2007-02-15 2008-02-15 Semiconductor package

Country Status (6)

Country Link
US (3) US7732916B2 (ja)
EP (2) EP2112688A4 (ja)
JP (1) JP5112101B2 (ja)
KR (2) KR101066711B1 (ja)
TW (2) TW200849519A (ja)
WO (1) WO2008099933A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JP5112101B2 (ja) 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
KR20100017414A (ko) * 2007-04-26 2010-02-16 세람텍 아게 구성 요소 또는 회로용 냉각 박스
JP5457435B2 (ja) * 2008-05-16 2014-04-02 パーカー−ハニフイン・コーポレーシヨン 気化性誘電体流体で冷却されるモジュール型高電力ドライブスタック
US9500416B2 (en) * 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
TWM371400U (en) * 2009-02-13 2009-12-21 Asia Vital Components Co Ltd Heat-dissipation device of communication box
JP5806464B2 (ja) * 2010-02-03 2015-11-10 株式会社東芝 半導体素子収納用パッケージ及びそれを用いた半導体装置
KR200465926Y1 (ko) 2010-12-23 2013-03-18 자원전자 주식회사 교차 결합구조를 갖는 피씨비 어셈블리
JP5618419B2 (ja) 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
US9255741B2 (en) * 2012-01-26 2016-02-09 Lear Corporation Cooled electric assembly
JP5970581B1 (ja) * 2015-03-30 2016-08-17 株式会社フジクラ 携帯型電子機器用熱拡散板
TWI655892B (zh) * 2016-05-31 2019-04-01 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材
TWI659828B (zh) * 2016-07-27 2019-05-21 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材

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US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US6205022B1 (en) 1997-08-27 2001-03-20 Intel Corporation Apparatus for managing heat in a computer environment or the like
JP2000281802A (ja) * 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性成形体およびその製造方法ならびに半導体装置
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US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
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JP4928749B2 (ja) 2005-06-30 2012-05-09 株式会社東芝 冷却装置
US7515415B2 (en) 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
JP2007311770A (ja) * 2006-04-17 2007-11-29 Mitsubishi Electric Corp 半導体装置
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JP5112101B2 (ja) 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
JP5025328B2 (ja) 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
JP4504401B2 (ja) 2007-08-07 2010-07-14 株式会社東芝 半導体パッケージ

Also Published As

Publication number Publication date
US7732916B2 (en) 2010-06-08
KR101017452B1 (ko) 2011-02-25
US7911794B2 (en) 2011-03-22
TW200849519A (en) 2008-12-16
US20090091891A1 (en) 2009-04-09
JP2008227473A (ja) 2008-09-25
WO2008099933A1 (ja) 2008-08-21
EP2120261A4 (en) 2016-10-12
EP2112688A1 (en) 2009-10-28
TW200901403A (en) 2009-01-01
US8049316B2 (en) 2011-11-01
EP2120261A1 (en) 2009-11-18
US20090205806A1 (en) 2009-08-20
KR20080103107A (ko) 2008-11-26
TWI382507B (zh) 2013-01-11
KR101066711B1 (ko) 2011-09-21
EP2112688A4 (en) 2011-09-21
US20080197462A1 (en) 2008-08-21
JP5112101B2 (ja) 2013-01-09
KR20090033394A (ko) 2009-04-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees