TWI351746B - - Google Patents

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Publication number
TWI351746B
TWI351746B TW097105367A TW97105367A TWI351746B TW I351746 B TWI351746 B TW I351746B TW 097105367 A TW097105367 A TW 097105367A TW 97105367 A TW97105367 A TW 97105367A TW I351746 B TWI351746 B TW I351746B
Authority
TW
Taiwan
Prior art keywords
base portion
semiconductor element
heat
semiconductor
granule
Prior art date
Application number
TW097105367A
Other languages
English (en)
Chinese (zh)
Other versions
TW200849519A (en
Inventor
Tsuyoshi Hasegawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200849519A publication Critical patent/TW200849519A/zh
Application granted granted Critical
Publication of TWI351746B publication Critical patent/TWI351746B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW097105367A 2007-02-15 2008-02-15 Semiconductor package TW200849519A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007035356 2007-02-15
JP2008029614A JP5112101B2 (ja) 2007-02-15 2008-02-08 半導体パッケージ

Publications (2)

Publication Number Publication Date
TW200849519A TW200849519A (en) 2008-12-16
TWI351746B true TWI351746B (ja) 2011-11-01

Family

ID=39690158

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097105364A TWI382507B (zh) 2007-02-15 2008-02-15 Semiconductor package
TW097105367A TW200849519A (en) 2007-02-15 2008-02-15 Semiconductor package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW097105364A TWI382507B (zh) 2007-02-15 2008-02-15 Semiconductor package

Country Status (6)

Country Link
US (3) US7732916B2 (ja)
EP (2) EP2112688A4 (ja)
JP (1) JP5112101B2 (ja)
KR (2) KR101017452B1 (ja)
TW (2) TWI382507B (ja)
WO (1) WO2008099933A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JP5112101B2 (ja) 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
EP2535928A3 (de) * 2007-04-26 2014-08-20 CeramTec GmbH Kühldose für Bauelemente oder Schaltungen
EP2277365B1 (en) * 2008-05-16 2011-11-02 Parker-Hannifin Corporation Modular high-power drive stack cooled with vaporizable dielectric fluid
US9500416B2 (en) * 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (ja) * 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
TWM371400U (en) * 2009-02-13 2009-12-21 Asia Vital Components Co Ltd Heat-dissipation device of communication box
JP5806464B2 (ja) * 2010-02-03 2015-11-10 株式会社東芝 半導体素子収納用パッケージ及びそれを用いた半導体装置
KR200465926Y1 (ko) 2010-12-23 2013-03-18 자원전자 주식회사 교차 결합구조를 갖는 피씨비 어셈블리
JP5618419B2 (ja) 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
US9255741B2 (en) * 2012-01-26 2016-02-09 Lear Corporation Cooled electric assembly
JP5970581B1 (ja) * 2015-03-30 2016-08-17 株式会社フジクラ 携帯型電子機器用熱拡散板
TWI655892B (zh) * 2016-05-31 2019-04-01 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材
TWI659828B (zh) * 2016-07-27 2019-05-21 日商Ｊｘ金屬股份有限公司 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材

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EP0529837B1 (en) * 1991-08-26 1996-05-29 Sun Microsystems, Inc. Method and apparatus for cooling multi-chip modules using integral heatpipe technology
US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US6205022B1 (en) 1997-08-27 2001-03-20 Intel Corporation Apparatus for managing heat in a computer environment or the like
JP2000281802A (ja) * 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性成形体およびその製造方法ならびに半導体装置
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KR20050026133A (ko) * 2003-09-09 2005-03-15 엘지.필립스 엘시디 주식회사 액정표시소자 제조방법 및 그 제조장치
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JP4714434B2 (ja) 2004-07-20 2011-06-29 古河スカイ株式会社 ヒートパイプヒートシンク
US7168152B1 (en) 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
US7401340B2 (en) * 2004-10-21 2008-07-15 Oracle International Corporation Supporting cross-component references in an object-oriented programming system
US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
JP4610414B2 (ja) * 2005-03-22 2011-01-12 京セラ株式会社 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造
JP4928749B2 (ja) 2005-06-30 2012-05-09 株式会社東芝 冷却装置
US7515415B2 (en) 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
JP2007311770A (ja) * 2006-04-17 2007-11-29 Mitsubishi Electric Corp 半導体装置
JP4760585B2 (ja) * 2006-07-18 2011-08-31 三菱電機株式会社 電力用半導体装置
JP5112101B2 (ja) 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
JP5025328B2 (ja) 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
JP4558012B2 (ja) 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
JP4504401B2 (ja) 2007-08-07 2010-07-14 株式会社東芝 半導体パッケージ

Also Published As

Publication number Publication date
WO2008099933A1 (ja) 2008-08-21
EP2120261A1 (en) 2009-11-18
US20080197462A1 (en) 2008-08-21
EP2112688A4 (en) 2011-09-21
TWI382507B (zh) 2013-01-11
US7911794B2 (en) 2011-03-22
TW200849519A (en) 2008-12-16
EP2120261A4 (en) 2016-10-12
EP2112688A1 (en) 2009-10-28
US20090091891A1 (en) 2009-04-09
JP5112101B2 (ja) 2013-01-09
KR101066711B1 (ko) 2011-09-21
US8049316B2 (en) 2011-11-01
KR101017452B1 (ko) 2011-02-25
US7732916B2 (en) 2010-06-08
TW200901403A (en) 2009-01-01
JP2008227473A (ja) 2008-09-25
US20090205806A1 (en) 2009-08-20
KR20090033394A (ko) 2009-04-02
KR20080103107A (ko) 2008-11-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees