JP4928749B2 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP4928749B2 JP4928749B2 JP2005193139A JP2005193139A JP4928749B2 JP 4928749 B2 JP4928749 B2 JP 4928749B2 JP 2005193139 A JP2005193139 A JP 2005193139A JP 2005193139 A JP2005193139 A JP 2005193139A JP 4928749 B2 JP4928749 B2 JP 4928749B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- plate member
- heat transfer
- flow path
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
フィン80は、フィン本体81と、複数のフィン部材82と、を備えている。
図5に示すように、ポンプ100の吐出口106から吐出された冷媒Lは、流路110内を、放熱部77に向かう方向Bに沿って、第2の端部113から第1の端部112に向かって流れる。まず、冷媒Lは、第3の受熱部76において第3の発熱体32の熱を奪う。
Claims (4)
- 放熱部と、受熱部と、前記受熱部で受けた熱を前記放熱部に移送する熱移送部と、を具備し、
前記熱移送部に形成される流路の内側面の両側には、互いに対向する位置に前記受熱部から前記放熱部に向かう方向に沿って傾斜して該内側面とのなす角度が鋭角となる形状の突部が設けられた
ことを特徴とする冷却装置。 - 前記熱移送部の前記流路は、内部を冷媒が循環する環状である
ことを特徴とする請求項1に記載の冷却装置。 - 前記熱移送部は、
前記熱移送部の前記流路に対応する溝が形成される第1の板部材と、
前記溝を液密に覆う第2の板部材と
を具備し、
前記受熱部は、前記第1の板部材または前記第2の板部材に形成され、
前記内側面を有する側壁は、前記溝の側壁である
ことを特徴とする請求項1に記載の冷却装置。 - 前記熱移送部は、さらに、第3の板部材を具備し、
前記第3の板部材は、前記第1の板部材と前記第2の板部材において発熱体を避けた位置の少なくとも一部に接合されるとともに、前記第1,2の板部材のうち接合される方に向かって延びて前記接合される方との間に密閉空間を規定する隔壁部を有する
ことを特徴とする請求項3に記載の冷却装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005193139A JP4928749B2 (ja) | 2005-06-30 | 2005-06-30 | 冷却装置 |
US11/473,850 US7352581B2 (en) | 2005-06-30 | 2006-06-23 | Cooling device and electronic apparatus |
CNB2006101001416A CN100496201C (zh) | 2005-06-30 | 2006-06-29 | 冷却装置和电子设备 |
US12/021,539 US20080128113A1 (en) | 2005-06-30 | 2008-01-29 | Cooling device and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005193139A JP4928749B2 (ja) | 2005-06-30 | 2005-06-30 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007010249A JP2007010249A (ja) | 2007-01-18 |
JP4928749B2 true JP4928749B2 (ja) | 2012-05-09 |
Family
ID=37589227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005193139A Active JP4928749B2 (ja) | 2005-06-30 | 2005-06-30 | 冷却装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7352581B2 (ja) |
JP (1) | JP4928749B2 (ja) |
CN (1) | CN100496201C (ja) |
Families Citing this family (39)
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JP2006295479A (ja) * | 2005-04-08 | 2006-10-26 | Matsushita Electric Ind Co Ltd | 電力線通信装置及び電力線通信方法 |
JP2007011786A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 冷却装置、電子機器 |
JP4928749B2 (ja) * | 2005-06-30 | 2012-05-09 | 株式会社東芝 | 冷却装置 |
JP2008027370A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
JP5283836B2 (ja) | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP4842040B2 (ja) * | 2006-07-25 | 2011-12-21 | 富士通株式会社 | 電子機器 |
JP4781929B2 (ja) * | 2006-07-25 | 2011-09-28 | 富士通株式会社 | 電子機器 |
JP2008027374A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5148079B2 (ja) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP5112101B2 (ja) * | 2007-02-15 | 2013-01-09 | 株式会社東芝 | 半導体パッケージ |
CN101252819A (zh) * | 2007-02-22 | 2008-08-27 | 徐达威 | 一种用于散热的合成板和形成方法 |
JP2008210007A (ja) * | 2007-02-23 | 2008-09-11 | Alps Electric Co Ltd | 液冷システム |
JP2008251687A (ja) * | 2007-03-29 | 2008-10-16 | Toshiba Corp | プリント回路板、およびこれを備えた電子機器 |
US20080307817A1 (en) * | 2007-06-18 | 2008-12-18 | General Electric Company | System for integrated thermal management and method for the same |
KR101239975B1 (ko) * | 2007-08-28 | 2013-03-06 | 삼성전자주식회사 | 정보처리장치 |
US7764493B2 (en) * | 2008-01-04 | 2010-07-27 | Apple Inc. | Systems and methods for cooling electronic devices using airflow dividers |
ES2426586T3 (es) | 2008-04-29 | 2013-10-24 | Agie Charmilles Sa | Refrigeración híbrida |
US20120087088A1 (en) * | 2008-08-05 | 2012-04-12 | Pipeline Micro, Inc. | Microscale heat transfer systems |
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JP4473925B1 (ja) * | 2008-12-16 | 2010-06-02 | 株式会社東芝 | ループヒートパイプおよび電子機器 |
JP5005788B2 (ja) * | 2010-03-17 | 2012-08-22 | 株式会社ソニー・コンピュータエンタテインメント | 冷却装置、及び、それを備えた電子機器 |
US8797741B2 (en) * | 2010-10-21 | 2014-08-05 | Raytheon Company | Maintaining thermal uniformity in micro-channel cold plates with two-phase flows |
US8358505B2 (en) * | 2010-10-28 | 2013-01-22 | Asetek A/S | Integrated liquid cooling system |
EP2532890A4 (en) | 2011-04-05 | 2013-06-19 | Mitsubishi Heavy Ind Ltd | DEVICE FOR GENERATING ELECTRICITY FROM REGENERATED ENERGY |
CN102859188A (zh) | 2011-08-10 | 2013-01-02 | 三菱重工业株式会社 | 再生能型发电装置 |
CN103052797A (zh) | 2011-08-10 | 2013-04-17 | 三菱重工业株式会社 | 风力发电装置 |
JP6485075B2 (ja) * | 2015-01-29 | 2019-03-20 | 富士通株式会社 | ループヒートパイプ及びループヒートパイプの製造方法 |
JP2016156584A (ja) * | 2015-02-25 | 2016-09-01 | 株式会社フジクラ | 薄板ヒートパイプ型熱拡散板 |
US10455735B2 (en) * | 2016-03-03 | 2019-10-22 | Coolanyp, LLC | Self-organizing thermodynamic system |
CN108231708B (zh) * | 2016-12-14 | 2023-08-04 | 达纳加拿大公司 | 用于双面冷却电子模块的换热器 |
JP6462737B2 (ja) * | 2017-01-24 | 2019-01-30 | 三菱電機株式会社 | ヒートシンク |
JP6885126B2 (ja) * | 2017-03-22 | 2021-06-09 | 富士電機株式会社 | インバータ装置 |
CN109960382A (zh) * | 2017-12-26 | 2019-07-02 | 技嘉科技股份有限公司 | 可分区散热的散热装置及具散热装置的主机板 |
US11467637B2 (en) | 2018-07-31 | 2022-10-11 | Wuxi Kalannipu Thermal Management Technology Co., Ltd. | Modular computer cooling system |
JP7153515B2 (ja) * | 2018-09-25 | 2022-10-14 | 新光電気工業株式会社 | ループ型ヒートパイプ |
DE102018216708A1 (de) | 2018-09-28 | 2020-04-02 | Robert Bosch Gmbh | Kühlplatte zur Temperierung zumindest einer Batteriezelle und Batteriesystem |
JP6934093B1 (ja) * | 2020-07-13 | 2021-09-08 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
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-
2005
- 2005-06-30 JP JP2005193139A patent/JP4928749B2/ja active Active
-
2006
- 2006-06-23 US US11/473,850 patent/US7352581B2/en active Active
- 2006-06-29 CN CNB2006101001416A patent/CN100496201C/zh active Active
-
2008
- 2008-01-29 US US12/021,539 patent/US20080128113A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1893807A (zh) | 2007-01-10 |
US20070002538A1 (en) | 2007-01-04 |
US7352581B2 (en) | 2008-04-01 |
JP2007010249A (ja) | 2007-01-18 |
US20080128113A1 (en) | 2008-06-05 |
CN100496201C (zh) | 2009-06-03 |
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Free format text: JAPANESE INTERMEDIATE CODE: R350 |