JP2008028331A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2008028331A JP2008028331A JP2006202283A JP2006202283A JP2008028331A JP 2008028331 A JP2008028331 A JP 2008028331A JP 2006202283 A JP2006202283 A JP 2006202283A JP 2006202283 A JP2006202283 A JP 2006202283A JP 2008028331 A JP2008028331 A JP 2008028331A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- refrigerant
- housing
- tank
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
- F28D1/024—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】電子機器11aでは、電子部品21、22の熱は受熱器81、82の伝熱板に受け渡される。伝熱板の熱は、流通路を流れる冷媒に受け渡される。電子部品21、22は冷却される。冷媒はタンク37に流れる。タンク37に冷媒および循環経路内の空気が貯蔵される。その一方で、筐体12には吸気口が形成される。吸気口から筐体12内に外気が導入される。吸気口にはタンク37が向き合わせられる。タンク37は外気に曝される。タンク37内の冷媒の熱は大気中に放出されることができる。冷媒は効率的に冷却されることができる。放熱の効率は高められる。
【選択図】図14
Description
Claims (3)
- 筐体と、筐体に収容される電子部品と、伝熱板で電子部品に受け止められて、伝熱板上に冷媒の流通路を区画する受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、循環経路内の空気を貯蔵するタンクと、筐体に形成されて、少なくともタンクに向き合わせられる吸気口とを備えることを特徴とする電子機器。
- 請求項1に記載の電子機器において、前記循環経路に組み入れられて循環経路で冷媒を循環させるポンプと、前記筐体に形成されて、ポンプに向き合わせられる吸気口とをさらに備えることを特徴とする電子機器。
- 筐体と、筐体に収容される電子部品と、伝熱板で電子部品に受け止められて、伝熱板上に冷媒の流通路を区画する受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、循環経路で冷媒を循環させるポンプと、筐体に形成されて、少なくともポンプに向き合わせられる吸気口とを備えることを特徴とする電子機器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006202283A JP4781929B2 (ja) | 2006-07-25 | 2006-07-25 | 電子機器 |
TW096126930A TWI361656B (en) | 2006-07-25 | 2007-07-24 | Electronic apparatus |
EP20070113061 EP1883003A3 (en) | 2006-07-25 | 2007-07-24 | Electronic apparatus |
CN200710139089.XA CN101115375B (zh) | 2006-07-25 | 2007-07-25 | 电子设备 |
US11/878,614 US7701715B2 (en) | 2006-07-25 | 2007-07-25 | Electronic apparatus |
KR1020070074562A KR100902323B1 (ko) | 2006-07-25 | 2007-07-25 | 전자 기기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006202283A JP4781929B2 (ja) | 2006-07-25 | 2006-07-25 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008028331A true JP2008028331A (ja) | 2008-02-07 |
JP4781929B2 JP4781929B2 (ja) | 2011-09-28 |
Family
ID=38616296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006202283A Expired - Fee Related JP4781929B2 (ja) | 2006-07-25 | 2006-07-25 | 電子機器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7701715B2 (ja) |
EP (1) | EP1883003A3 (ja) |
JP (1) | JP4781929B2 (ja) |
KR (1) | KR100902323B1 (ja) |
CN (1) | CN101115375B (ja) |
TW (1) | TWI361656B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7961464B2 (en) | 2008-03-27 | 2011-06-14 | Fujitsu Limited | Electronic device |
CN102385431A (zh) * | 2010-09-02 | 2012-03-21 | 富士通株式会社 | 散热器及具有冷却剂通道的电子装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5283836B2 (ja) * | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
US7751240B2 (en) * | 2007-01-24 | 2010-07-06 | Anobit Technologies Ltd. | Memory device with negative thresholds |
CN203327457U (zh) * | 2013-05-20 | 2013-12-04 | 中兴通讯股份有限公司 | 一种散热装置 |
EP3455878B1 (en) | 2016-05-11 | 2023-07-05 | Hypertechnologie Ciara Inc | Cpu cooling system with direct spray cooling |
CN106424910B (zh) * | 2016-10-21 | 2018-06-22 | 福安市中虹机电技术开发有限公司 | 卷料自动剪切系统 |
CN107995832A (zh) * | 2017-12-11 | 2018-05-04 | 南京邮电大学 | 一种密集散热电路板 |
US20210274689A1 (en) * | 2018-06-22 | 2021-09-02 | Vitesco Technologies GmbH | Arrangement comprising a housing and a power electronics circuit arranged therein on a housing bottom |
US11466190B2 (en) * | 2018-06-25 | 2022-10-11 | Abb Schweiz Ag | Forced air cooling system with phase change material |
US10746084B2 (en) * | 2018-12-13 | 2020-08-18 | General Electric Company | Liquid driven thermal module and thermal management system |
TWI718485B (zh) * | 2019-02-27 | 2021-02-11 | 雙鴻科技股份有限公司 | 熱交換裝置 |
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2006
- 2006-07-25 JP JP2006202283A patent/JP4781929B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-24 EP EP20070113061 patent/EP1883003A3/en not_active Ceased
- 2007-07-24 TW TW096126930A patent/TWI361656B/zh not_active IP Right Cessation
- 2007-07-25 US US11/878,614 patent/US7701715B2/en not_active Expired - Fee Related
- 2007-07-25 CN CN200710139089.XA patent/CN101115375B/zh not_active Expired - Fee Related
- 2007-07-25 KR KR1020070074562A patent/KR100902323B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003243869A (ja) * | 2002-02-22 | 2003-08-29 | Sanyo Electric Co Ltd | 電子装置 |
JP2007094648A (ja) * | 2005-09-28 | 2007-04-12 | Toshiba Corp | 電子機器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US7961464B2 (en) | 2008-03-27 | 2011-06-14 | Fujitsu Limited | Electronic device |
US8270156B2 (en) | 2008-03-27 | 2012-09-18 | Fujitsu Limited | Electronic device |
CN102385431A (zh) * | 2010-09-02 | 2012-03-21 | 富士通株式会社 | 散热器及具有冷却剂通道的电子装置 |
Also Published As
Publication number | Publication date |
---|---|
US20080024978A1 (en) | 2008-01-31 |
US7701715B2 (en) | 2010-04-20 |
EP1883003A3 (en) | 2010-12-08 |
EP1883003A2 (en) | 2008-01-30 |
CN101115375B (zh) | 2011-02-16 |
TWI361656B (en) | 2012-04-01 |
KR100902323B1 (ko) | 2009-06-12 |
JP4781929B2 (ja) | 2011-09-28 |
CN101115375A (zh) | 2008-01-30 |
KR20080010336A (ko) | 2008-01-30 |
TW200808164A (en) | 2008-02-01 |
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