JP5035719B2 - 薬液用熱交換器及びそれを用いた薬液用温度調節装置 - Google Patents
薬液用熱交換器及びそれを用いた薬液用温度調節装置 Download PDFInfo
- Publication number
- JP5035719B2 JP5035719B2 JP2007091489A JP2007091489A JP5035719B2 JP 5035719 B2 JP5035719 B2 JP 5035719B2 JP 2007091489 A JP2007091489 A JP 2007091489A JP 2007091489 A JP2007091489 A JP 2007091489A JP 5035719 B2 JP5035719 B2 JP 5035719B2
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- chemical
- seal portion
- main body
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000126 substance Substances 0.000 title claims description 83
- 239000007788 liquid Substances 0.000 claims description 28
- 239000000243 solution Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 19
- 229920001971 elastomer Polymers 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 5
- 239000008155 medical solution Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
- F28F21/065—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material the heat-exchange apparatus employing plate-like or laminated conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Weting (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
また、本発明の他の技術的課題は、上記熱交換器の流路を流れる上記薬液の冷却又は加熱に伴って、該熱交換器本体のシール部が塑性変形するのを可及的に抑止することにより、該シール部のシール性を高めた薬液用熱交換器を提供することにある。
また、上記熱交換器における本体の流路を囲繞するリップシール部の形成部分の外周側面に、該リップシール部の背後に達する凹溝を形成するとともに、該凹溝内に耐熱性のゴム弾性材からなるシール補助部材を嵌着した構成とすることにより、上記熱交換器の流路を流れる上記薬液の冷却又は加熱に伴って、該熱交換器本体のシール部が塑性変形するのを可及的に抑止することができるので、該シール部のシール性をより一層高めることができる。
上記伝熱板8としては、例えば、グラファイト基板、炭化珪素基板、ガラス状カーボン基板、またはグラファイト基板の薬液接触面側にアモルファスカーボン層若しくは炭化珪素層を設けたものなどを適用することができ、この場合、上記シート部材16を該伝熱板8における薬液接触面側に熱溶着することにより、該伝熱板8の上記薬液に対する耐薬品性を高めることができるので、当該伝熱板8自体が腐蝕することによって、上記熱交換器本体6の流路6a,6bを流れる薬液に重金属イオン等の有害不純物が溶出するのを防止することができる。
4 薬液用熱交換器
6 熱交換器本体
6a,6b 流路
6e リップシール部
6f 凹溝
8 伝熱板
10 サーモモジュール
24 シール補助部材
Claims (2)
- サーモモジュールを密着固定した伝熱板に接触させて薬液の冷却または加熱を行う温度調節装置の熱交換器であって、
上記熱交換器を、耐薬品性樹脂からなる板状の本体の表裏両面における上記伝熱板の被着面に、薬液が流れる流路を形成するとともに、該被着面における該流路の周囲に、上記伝熱板との間のシールのための少なくとも1条の山形のリップシール部を上記本体に一体的に形成し、表面が耐薬品性をもつ上記伝熱板を該リップシール部に圧接した状態で上記本体に固定することにより構成し、
上記熱交換器における本体の流路を囲繞するリップシール部の形成部分の外周側面に、該リップシール部の背後に達する凹溝を形成するとともに、該凹溝内に、上記リップシール部に与圧力を付与するための耐熱、耐薬品性のゴム弾性材からなるシール補助部材を嵌着した、
ことを特徴とする薬液用熱交換器。 - サーモモジュールを密着固定した伝熱板に熱交換器の流路を流れる薬液を接触させて該薬液の冷却または加熱を行う温度調節装置であって、
上記熱交換器を、耐薬品性樹脂からなる板状の本体の表裏両面における上記伝熱板の被着面に、薬液が流れる流路を形成するとともに、該被着面における該流路の周囲に、上記伝熱板との間のシールのための少なくとも1条の山形のリップシール部を上記本体に一体的に形成し、表面が耐薬品性をもつ上記伝熱板を該リップシール部に圧接した状態で上記本体に固定することにより構成し、
上記熱交換器における本体の流路を囲繞するリップシール部の形成部分の外周側面に、該リップシール部の背後に達する凹溝を形成するとともに、該凹溝内に、上記リップシール部に与圧力を付与するための耐熱、耐薬品性のゴム弾性材からなるシール補助部材を嵌着し、
上記熱交換器における両伝熱板の外側面にサーモモジュールを密着させるとともに、さらに上記サーモモジュールの外側面に放熱板を密着させ、熱交換器とサーモモジュールと放熱板とを固定手段により相互に固定した、
ことを特徴とする薬液用温度調節装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007091489A JP5035719B2 (ja) | 2007-03-30 | 2007-03-30 | 薬液用熱交換器及びそれを用いた薬液用温度調節装置 |
DE102008015328A DE102008015328B4 (de) | 2007-03-30 | 2008-03-20 | Temperaturregelvorrichtung für flüssige Wirkstoffe |
US12/051,967 US8302408B2 (en) | 2007-03-30 | 2008-03-20 | Temperature control device for liquid medicines |
TW097111052A TWI395266B (zh) | 2007-03-30 | 2008-03-27 | 藥液用溫度調整裝置 |
KR1020080028212A KR100928893B1 (ko) | 2007-03-30 | 2008-03-27 | 약액용 온도 조절 장치 |
CN2008100894051A CN101275776B (zh) | 2007-03-30 | 2008-03-28 | 药液用温度调节装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007091489A JP5035719B2 (ja) | 2007-03-30 | 2007-03-30 | 薬液用熱交換器及びそれを用いた薬液用温度調節装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008251843A JP2008251843A (ja) | 2008-10-16 |
JP5035719B2 true JP5035719B2 (ja) | 2012-09-26 |
Family
ID=39736402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007091489A Active JP5035719B2 (ja) | 2007-03-30 | 2007-03-30 | 薬液用熱交換器及びそれを用いた薬液用温度調節装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8302408B2 (ja) |
JP (1) | JP5035719B2 (ja) |
KR (1) | KR100928893B1 (ja) |
CN (1) | CN101275776B (ja) |
DE (1) | DE102008015328B4 (ja) |
TW (1) | TWI395266B (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008027370A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
JP2008027374A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP4842040B2 (ja) * | 2006-07-25 | 2011-12-21 | 富士通株式会社 | 電子機器 |
JP4781929B2 (ja) * | 2006-07-25 | 2011-09-28 | 富士通株式会社 | 電子機器 |
JP5283836B2 (ja) * | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5148079B2 (ja) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
GB0919856D0 (en) * | 2009-11-13 | 2009-12-30 | Topmaster In Tech Ltd | Water heating apparatus |
US8897013B2 (en) * | 2011-02-17 | 2014-11-25 | Lear Corporation | Sealed battery charger housing |
KR20120107716A (ko) * | 2011-03-22 | 2012-10-04 | 삼성테크윈 주식회사 | 시료 보관용 온도 제어 장치 |
TWI447337B (zh) * | 2011-08-23 | 2014-08-01 | Ind Tech Res Inst | 飲水機 |
JP5715969B2 (ja) * | 2012-01-24 | 2015-05-13 | 株式会社堀場エステック | 流体抵抗デバイス |
US20140049908A1 (en) * | 2012-08-20 | 2014-02-20 | André Sloth Eriksen | Thermal management system |
US9538692B2 (en) * | 2013-07-18 | 2017-01-03 | Bae Systems Information And Electronic Systems Integration Inc. | Integrated heat exchanger and power delivery system for high powered electronic modules |
CN107525424B (zh) * | 2016-06-21 | 2020-11-20 | 株式会社西部技研 | 热交换器及其制造方法 |
JP6452871B1 (ja) * | 2018-02-23 | 2019-01-16 | 三菱電機株式会社 | 電子部品収容構造体 |
JP7236846B2 (ja) | 2018-11-15 | 2023-03-10 | 株式会社Kelk | 温調装置及び温調装置の製造方法 |
JP7236845B2 (ja) * | 2018-11-15 | 2023-03-10 | 株式会社Kelk | 温調装置 |
KR20200134492A (ko) * | 2019-05-22 | 2020-12-02 | 현대자동차주식회사 | 열전모듈이 구비된 열교환기 및 이를 포함하는 배터리 열관리 시스템 |
WO2020245876A1 (ja) * | 2019-06-03 | 2020-12-10 | 三菱電機株式会社 | プレート式熱交換器及び伝熱装置 |
KR102082243B1 (ko) * | 2019-07-22 | 2020-02-27 | 주식회사 성하에너지 | 열전소자 열교환 모듈 |
KR102413795B1 (ko) * | 2020-07-20 | 2022-06-28 | 글로벌라이트 주식회사 | 반도체 처리액 온도 유지 장치 |
WO2022026172A1 (en) * | 2020-07-27 | 2022-02-03 | Repligen Corporation | High-temperature short-time treatment device, system, and method |
JP2022132806A (ja) * | 2021-03-01 | 2022-09-13 | 株式会社Kelk | 処理液温調装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04362374A (ja) * | 1991-06-05 | 1992-12-15 | Komatsu Electron Kk | シールリング |
JPH09105596A (ja) * | 1995-10-04 | 1997-04-22 | Orion Mach Co Ltd | 耐薬品性熱交換器 |
JP2890249B2 (ja) * | 1996-04-16 | 1999-05-10 | オリオン機械株式会社 | 耐薬品性熱交換器 |
JPH1167717A (ja) * | 1997-08-19 | 1999-03-09 | Komatsu Electron Kk | 半導体処理液用冷却加熱装置 |
JP3724763B2 (ja) * | 1997-08-19 | 2005-12-07 | 小松エレクトロニクス株式会社 | 半導体処理液用冷却加熱装置 |
JP3968610B2 (ja) * | 1998-05-27 | 2007-08-29 | Smc株式会社 | 半導体処理液用冷却加熱装置 |
JP3025966B1 (ja) * | 1999-03-18 | 2000-03-27 | 龍夫 紺谷 | 電子温調装置 |
US6446442B1 (en) * | 1999-10-07 | 2002-09-10 | Hydrocool Pty Limited | Heat exchanger for an electronic heat pump |
JP2001133105A (ja) | 1999-11-02 | 2001-05-18 | Smc Corp | パイプクーラ及び該パイプクーラを用いた小型温調器 |
JP3479477B2 (ja) * | 1999-12-16 | 2003-12-15 | Smc株式会社 | 温調装置用熱交換装置 |
JP3510831B2 (ja) * | 1999-12-22 | 2004-03-29 | 株式会社小松製作所 | 熱交換器 |
CN2524769Y (zh) * | 2001-12-20 | 2002-12-11 | 朱长宏 | 医用输液恒温器 |
JP3863116B2 (ja) * | 2002-03-14 | 2006-12-27 | 株式会社小松製作所 | 流体温度調節装置 |
US6666031B2 (en) * | 2002-03-14 | 2003-12-23 | Komatsu, Ltd. | Fluid temperature control apparatus |
-
2007
- 2007-03-30 JP JP2007091489A patent/JP5035719B2/ja active Active
-
2008
- 2008-03-20 US US12/051,967 patent/US8302408B2/en active Active
- 2008-03-20 DE DE102008015328A patent/DE102008015328B4/de active Active
- 2008-03-27 TW TW097111052A patent/TWI395266B/zh active
- 2008-03-27 KR KR1020080028212A patent/KR100928893B1/ko active IP Right Grant
- 2008-03-28 CN CN2008100894051A patent/CN101275776B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20080236805A1 (en) | 2008-10-02 |
KR20080089216A (ko) | 2008-10-06 |
KR100928893B1 (ko) | 2009-11-30 |
DE102008015328B4 (de) | 2010-08-05 |
TW200903623A (en) | 2009-01-16 |
DE102008015328A1 (de) | 2008-10-09 |
JP2008251843A (ja) | 2008-10-16 |
CN101275776B (zh) | 2012-10-10 |
US8302408B2 (en) | 2012-11-06 |
TWI395266B (zh) | 2013-05-01 |
CN101275776A (zh) | 2008-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5035719B2 (ja) | 薬液用熱交換器及びそれを用いた薬液用温度調節装置 | |
US20160195341A1 (en) | Flat heat exchange tube, and heat carrier-heating device and air conditioner for vehicle using same | |
WO2011055430A1 (ja) | 伝熱装置 | |
US20200029466A1 (en) | Liquid-heat-transmission device | |
JP5490257B2 (ja) | 加熱装置 | |
US20180335231A1 (en) | Dual heat pipe thermoelectric cooler | |
US6347661B2 (en) | Cooling/heating apparatus for semiconductor processing liquid | |
KR100965446B1 (ko) | 유체 온도조절장치 | |
KR20190076470A (ko) | 3d 프린터 제조형 열교환 플레이트 | |
JP2009019805A (ja) | 流体温調装置 | |
TWI688306B (zh) | 加熱裝置及使用該加熱裝置的被加熱體的加熱方法 | |
JP2011069552A (ja) | 熱交換器 | |
JP2010159939A (ja) | 熱交換器のシール構造 | |
JP2008064383A (ja) | 薬液用熱交換装置 | |
KR20180102700A (ko) | 히터 및 열교환기 장치 | |
JP2012154579A (ja) | 熱媒体加熱装置 | |
JP6357629B2 (ja) | 薬液用温度調整装置 | |
JP2010019481A (ja) | 蓄熱装置 | |
JP7280674B2 (ja) | 冷却構造体および冷却構造体を備える発熱回収システム | |
JP5218175B2 (ja) | 蓄熱装置及びそれを備えた給湯機 | |
JP2006038303A (ja) | 熱交換器および冷暖房装置 | |
JP2009264719A (ja) | 熱交換器 | |
JP2023084242A (ja) | 温調容器 | |
TW202317925A (zh) | 冷凝結構 | |
JP2890074B2 (ja) | 熱交換装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100113 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100422 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120427 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120522 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120622 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150713 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5035719 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R255 | Notification that request for automated payment was rejected |
Free format text: JAPANESE INTERMEDIATE CODE: R2525 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |