JP2008027374A - 液冷ユニット用受熱器および液冷ユニット並びに電子機器 - Google Patents
液冷ユニット用受熱器および液冷ユニット並びに電子機器 Download PDFInfo
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- JP2008027374A JP2008027374A JP2006202289A JP2006202289A JP2008027374A JP 2008027374 A JP2008027374 A JP 2008027374A JP 2006202289 A JP2006202289 A JP 2006202289A JP 2006202289 A JP2006202289 A JP 2006202289A JP 2008027374 A JP2008027374 A JP 2008027374A
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- heat
- refrigerant
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0246—Arrangements for connecting header boxes with flow lines
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】液冷ユニット用受熱器28では、筐体44は伝熱板45上に冷媒の流通路46を区画する。伝熱板45で受熱される熱は流通路46内の冷媒に受け渡される。筐体44の外側から流通路46の上流端には少なくとも2つの流入ノズル47、47が臨む。冷媒は2つの流入ノズル47、47から流通路46に流入する。こうして流通路46では2つの流れが生み出される。流通路46では冷媒の流れは大きく広がる。冷媒は流通路46内で淀みなく流れる。伝熱板45の熱は効率的に冷媒に受け渡されることができる。こうして液冷ユニット用受熱器28では効率的に熱は受熱されることができる。
【選択図】図4
Description
Claims (10)
- 平板状の伝熱板上に流通路を区画する筐体と、筐体の外側から流通路の上流端に臨み、並列に配置される少なくとも2つの流入ノズルと、筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記流通路は前記流入ノズルの延長線上に延びることを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記流入ノズルおよび前記流出ノズルは相互に向き合うことを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記流入ノズルおよび流出ノズルは同一の向きで配置されることを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記伝熱板から立ち上がりつつ冷媒の流通方向に延び、千鳥状に配置される複数枚の放熱フィンをさらに備えることを特徴とする液冷ユニット用受熱器。
- 平板状の伝熱板で電子部品に受け止められる受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、冷媒から熱を奪う熱交換器とを備え、前記受熱器は、伝熱板上に冷媒の流通路を区画する筐体と、筐体の外側から流通路の上流端に臨み、並列に配置される少なくとも2つの流入ノズルと、筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする液冷ユニット。
- 請求項6に記載の液冷ユニットにおいて、前記流入ノズルおよび前記流出ノズルは相互に向き合うことを特徴とする液冷ユニット。
- 請求項6に記載の液冷ユニットにおいて、前記流入ノズルおよび流出ノズルは同一の向きで配置されることを特徴とする液冷ユニット。
- 請求項6に記載の液冷ユニットにおいて、前記伝熱板から立ち上がりつつ冷媒の流通方向に延び、千鳥状に配置される複数枚の放熱フィンをさらに備えることを特徴とする液冷ユニット。
- 電子部品と、平板状の伝熱板で電子部品に受け止められる受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、冷媒から熱を奪う熱交換器とを備え、前記受熱器は、伝熱板上に冷媒の流通路を区画する筐体と、筐体の外側から流通路の上流端に臨み、並列に配置される少なくとも2つの流入ノズルと、筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする電子機器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006202289A JP2008027374A (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
EP07113051A EP1883287B1 (en) | 2006-07-25 | 2007-07-24 | Liquid cooling unit and heat receiver therefor |
TW096126925A TWI372968B (en) | 2006-07-25 | 2007-07-24 | Liquid cooling unit and heat receiver therefor |
CNA2007101390917A CN101115377A (zh) | 2006-07-25 | 2007-07-25 | 液体冷却单元和用于该液体冷却单元的热接收器 |
KR1020070074557A KR100892626B1 (ko) | 2006-07-25 | 2007-07-25 | 액체 냉각 유닛 및 전자 기기 |
US11/878,620 US8289701B2 (en) | 2006-07-25 | 2007-07-25 | Liquid cooling unit and heat receiver therefor |
Applications Claiming Priority (1)
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JP2006202289A JP2008027374A (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
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JP2008027374A true JP2008027374A (ja) | 2008-02-07 |
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JP2006202289A Pending JP2008027374A (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
Country Status (6)
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US (1) | US8289701B2 (ja) |
EP (1) | EP1883287B1 (ja) |
JP (1) | JP2008027374A (ja) |
KR (1) | KR100892626B1 (ja) |
CN (1) | CN101115377A (ja) |
TW (1) | TWI372968B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010073161A (ja) * | 2008-09-22 | 2010-04-02 | Fujitsu Ltd | 冷却ユニットおよび電子機器 |
JP2017199099A (ja) * | 2016-04-26 | 2017-11-02 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却装置 |
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US8616266B2 (en) | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
JP5594589B2 (ja) * | 2010-01-06 | 2014-09-24 | 株式会社リコー | 冷却装置及び画像形成装置 |
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Also Published As
Publication number | Publication date |
---|---|
TWI372968B (en) | 2012-09-21 |
US20080024988A1 (en) | 2008-01-31 |
EP1883287B1 (en) | 2011-11-02 |
EP1883287A1 (en) | 2008-01-30 |
TW200819962A (en) | 2008-05-01 |
CN101115377A (zh) | 2008-01-30 |
US8289701B2 (en) | 2012-10-16 |
KR100892626B1 (ko) | 2009-04-09 |
KR20080010331A (ko) | 2008-01-30 |
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