JP4746361B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4746361B2 JP4746361B2 JP2005192673A JP2005192673A JP4746361B2 JP 4746361 B2 JP4746361 B2 JP 4746361B2 JP 2005192673 A JP2005192673 A JP 2005192673A JP 2005192673 A JP2005192673 A JP 2005192673A JP 4746361 B2 JP4746361 B2 JP 4746361B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- plate member
- refrigerant
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
設けられる。
フィン80は、フィン本体81と、複数のフィン部材82と、を備えている。
図5に示すように、ポンプ100の吐出口106から吐出された冷媒Lは、流路110内を、放熱部77に向かう方向Bに沿って、第2の端部113から第1の端部112に向かって流れる。まず、冷媒Lは、第3の受熱部76において第3の発熱体32の熱を奪う。
Claims (3)
- 筐体と、
前記筐体内に収容された発熱体と、
前記筐体内において前記発熱体と異なる位置に設けられた放熱部と、
前記発熱体に熱的に接続された受熱部を備えるとともに、前記受熱部で受けた熱を前記放熱部に移送する熱移送手段と
を具備し、
前記熱移送手段の内面には、前記発熱体から前記放熱部に向かう方向に沿って傾斜する突部が複数設けられ、
前記突部と前記内面との間には、前記突部と前記内面とがなす角度が鋭角となる隙間が設けられる
ことを特徴とする電子機器。 - 前記熱移送手段の流路は、内部を冷媒が循環する環状である
ことを特徴とする請求項1に記載の電子機器。 - 前記熱移送手段は、
前記熱移送手段の流路に対応する溝が形成される第1の板部材と、
前記溝を液密に覆う第2の板部材と
を具備し、
前記受熱部は、前記第1の板部材または前記第2の板部材に形成され、
前記内面は、前記溝の内面である
ことを特徴とする請求項1に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192673A JP4746361B2 (ja) | 2005-06-30 | 2005-06-30 | 電子機器 |
US11/473,777 US7372697B2 (en) | 2005-06-30 | 2006-06-23 | Cooling device and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192673A JP4746361B2 (ja) | 2005-06-30 | 2005-06-30 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012924A JP2007012924A (ja) | 2007-01-18 |
JP4746361B2 true JP4746361B2 (ja) | 2011-08-10 |
Family
ID=37589226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005192673A Active JP4746361B2 (ja) | 2005-06-30 | 2005-06-30 | 電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7372697B2 (ja) |
JP (1) | JP4746361B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007011786A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 冷却装置、電子機器 |
JP4928749B2 (ja) * | 2005-06-30 | 2012-05-09 | 株式会社東芝 | 冷却装置 |
US20070277962A1 (en) * | 2006-06-01 | 2007-12-06 | Abb Research Ltd. | Two-phase cooling system for cooling power electronic components |
JP2008210007A (ja) * | 2007-02-23 | 2008-09-11 | Alps Electric Co Ltd | 液冷システム |
US7764493B2 (en) * | 2008-01-04 | 2010-07-27 | Apple Inc. | Systems and methods for cooling electronic devices using airflow dividers |
JP4399013B2 (ja) * | 2008-02-28 | 2010-01-13 | 株式会社東芝 | 電子機器、およびヒートパイプ |
JP4352091B2 (ja) * | 2008-03-27 | 2009-10-28 | 株式会社東芝 | 電子機器、冷却装置 |
CN101636067B (zh) * | 2008-07-25 | 2012-08-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101674717B (zh) * | 2008-09-11 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8297343B2 (en) * | 2008-10-15 | 2012-10-30 | Tai-Her Yang | Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids |
US8081478B1 (en) * | 2008-12-09 | 2011-12-20 | Lockheed Martin Corporation | Fluid cooled electronics module cover |
EP2433480B1 (en) * | 2009-05-18 | 2013-05-01 | Huawei Technologies Co., Ltd. | Heat spreading device and method therefore |
DK2259310T3 (da) * | 2009-06-05 | 2020-06-22 | Siemens Gamesa Renewable Energy As | Integreret varmeveksler |
JP6233125B2 (ja) * | 2014-03-20 | 2017-11-22 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
DE112017007720T5 (de) * | 2017-07-03 | 2020-03-19 | Mitsubishi Electric Corporation | Kühlkörper |
AT522831B1 (de) * | 2019-08-08 | 2023-05-15 | Dau Gmbh & Co Kg | Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau |
JP6934093B1 (ja) * | 2020-07-13 | 2021-09-08 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
JP7273116B2 (ja) * | 2021-08-27 | 2023-05-12 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01127895A (ja) * | 1987-11-04 | 1989-05-19 | Akutoronikusu Kk | 閉ループ管型熱伝達装置 |
JPH01189496A (ja) * | 1988-01-21 | 1989-07-28 | Akutoronikusu Kk | ループ管型熱伝達装置 |
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
JP2000193385A (ja) | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
US6859364B2 (en) * | 2000-06-06 | 2005-02-22 | Matsushita Refrigeration Company | Portable information appliance |
TW535486B (en) * | 2001-03-05 | 2003-06-01 | Chin Tsung Shune | An active heat exchanger with built-in pump and flexible coolant conduits |
DE10125636B4 (de) * | 2001-05-25 | 2004-03-25 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Kühler für elektrische und/oder elektronische Bauteile |
CN1220028C (zh) * | 2001-06-22 | 2005-09-21 | 李嘉豪 | 环路型热管热交换组件 |
US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
US6827128B2 (en) * | 2002-05-20 | 2004-12-07 | The Board Of Trustees Of The University Of Illinois | Flexible microchannel heat exchanger |
JP3730968B2 (ja) * | 2003-03-26 | 2006-01-05 | Tdk株式会社 | スイッチング電源 |
JP4380209B2 (ja) * | 2003-04-21 | 2009-12-09 | ソニー株式会社 | 冷却装置の製造方法 |
US7184265B2 (en) * | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
JP4124033B2 (ja) | 2003-06-20 | 2008-07-23 | 日立電線株式会社 | 多穴管の製造方法 |
US7483261B2 (en) * | 2003-06-27 | 2009-01-27 | Nec Corporation | Cooling device for an electronic equipment |
TW591984B (en) * | 2003-07-04 | 2004-06-11 | Sentelic Corp | Micro-circulating flow channel system and its manufacturing method |
JP2006207881A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 冷却装置及びそれを備えた電子機器 |
-
2005
- 2005-06-30 JP JP2005192673A patent/JP4746361B2/ja active Active
-
2006
- 2006-06-23 US US11/473,777 patent/US7372697B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7372697B2 (en) | 2008-05-13 |
JP2007012924A (ja) | 2007-01-18 |
US20070002537A1 (en) | 2007-01-04 |
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