JP4439441B2 - 熱交換器 - Google Patents
熱交換器 Download PDFInfo
- Publication number
- JP4439441B2 JP4439441B2 JP2005194110A JP2005194110A JP4439441B2 JP 4439441 B2 JP4439441 B2 JP 4439441B2 JP 2005194110 A JP2005194110 A JP 2005194110A JP 2005194110 A JP2005194110 A JP 2005194110A JP 4439441 B2 JP4439441 B2 JP 4439441B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heat
- bag
- radiator
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Description
10 袋
101 流入口
102 流出口
20 熱交換板
30,31,31b,33 押さえ板
2 放熱器
11,13 ラミネートパック
21,21b、21c、21d 放熱板
3,3b 吸熱器
Claims (4)
- 冷却液が内部を流れる熱交換器であって、
冷却液の流入口および流出口をもつ袋と、
前記袋と重なり合う熱交換板と、
前記袋を前記熱交換板に押さえ付ける押さえ板と、
前記押さえ板の内面に設けられ、前記流入口と流出口とを結ぶ流路を画定する複数の凹凸と、を備え、
前記熱交換板は、前記袋に対向する部分に、前記複数の凹凸にわたり形成された平面部を含み、
前記袋は、前記熱交換板の側に位置する第1のシートと、前記押さえ板の側に位置する、可撓性を有しかつ材質が前記第1のシートとは異なる第2のシートとを含む
ことを特徴とする熱交換器。 - 前記押さえ板に設けられた凹凸は、凹部と凸部との高低差が緩やかに変化する起伏である
請求項1記載の熱交換器。 - 前記第1のシートは、前記第2のシートよりも熱伝導性が良好である
請求項1または請求項2記載の熱交換器。 - 冷却液が内部を流れる放熱器であって、
冷却液の流入口および流出口をもつ袋と、
前記袋と重なり合う放熱板と、
前記袋を前記放熱板に押さえ付ける押さえ板と、
前記押さえ板の内面に設けられ、前記流入口と流出口とを結ぶ流路を画定する複数の凹凸と、を備え、
前記放熱板は、前記袋に対向する部分に、前記複数の凹凸にわたり形成された平面部を含み、
前記袋は、前記放熱板の側に位置する第1のシートと、前記押さえ板の側に位置する、可撓性を有しかつ材質が前記第1のシートとは異なる第2のシートとを含む
ことを特徴とする放熱器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194110A JP4439441B2 (ja) | 2005-07-01 | 2005-07-01 | 熱交換器 |
CNB2005101136620A CN100463151C (zh) | 2005-07-01 | 2005-10-14 | 液冷用的热交换器 |
US11/255,952 US20070000655A1 (en) | 2005-07-01 | 2005-10-24 | Heat exchanger for liquid cooling |
KR1020050102066A KR100678535B1 (ko) | 2005-07-01 | 2005-10-28 | 액체 냉각용의 열 교환기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194110A JP4439441B2 (ja) | 2005-07-01 | 2005-07-01 | 熱交換器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007010277A JP2007010277A (ja) | 2007-01-18 |
JP4439441B2 true JP4439441B2 (ja) | 2010-03-24 |
Family
ID=37588124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005194110A Expired - Fee Related JP4439441B2 (ja) | 2005-07-01 | 2005-07-01 | 熱交換器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070000655A1 (ja) |
JP (1) | JP4439441B2 (ja) |
KR (1) | KR100678535B1 (ja) |
CN (1) | CN100463151C (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060065002A1 (en) * | 2004-09-27 | 2006-03-30 | Humano, Ltd. | System and method for extracting potable water from atmosphere |
JP4617209B2 (ja) * | 2005-07-07 | 2011-01-19 | 株式会社豊田自動織機 | 放熱装置 |
EP2234153B1 (en) * | 2007-11-26 | 2019-07-03 | Showa Denko K.K. | Liquid-cooled type cooling device |
JP2010161184A (ja) | 2009-01-08 | 2010-07-22 | Hitachi Ltd | 半導体装置 |
JP5572985B2 (ja) * | 2009-04-15 | 2014-08-20 | 富士通株式会社 | フィルム配管、フィルム配管を備えた冷却モジュール、及びフィルム配管の製造方法 |
US20110232877A1 (en) * | 2010-03-23 | 2011-09-29 | Celsia Technologies Taiwan, Inc. | Compact vapor chamber and heat-dissipating module having the same |
US8368208B2 (en) * | 2010-10-01 | 2013-02-05 | Raytheon Company | Semiconductor cooling apparatus |
TW201241603A (en) * | 2011-04-08 | 2012-10-16 | Asustek Comp Inc | Motherboard |
US9553038B2 (en) | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
JP5939102B2 (ja) * | 2012-09-18 | 2016-06-22 | 富士通株式会社 | 電子機器 |
JP6121854B2 (ja) * | 2013-09-18 | 2017-04-26 | 東芝ホームテクノ株式会社 | シート型ヒートパイプまたは携帯情報端末 |
JP6504705B2 (ja) * | 2015-07-27 | 2019-04-24 | 藤森工業株式会社 | 温度調節機能付き容器 |
CN105972478B (zh) * | 2016-05-18 | 2018-05-04 | 东莞市闻誉实业有限公司 | 散热灯具 |
CN105972479B (zh) * | 2016-05-18 | 2018-07-27 | 东莞市闻誉实业有限公司 | 照明装置 |
CN105955434A (zh) * | 2016-06-30 | 2016-09-21 | 华为技术有限公司 | 一种柔性换热单元、液冷散热装置及液冷散热系统 |
CN109413929B (zh) * | 2017-08-16 | 2020-11-24 | 鹏鼎控股(深圳)股份有限公司 | 散热板及其制造方法 |
CN110112502B (zh) * | 2019-05-07 | 2021-03-02 | 奇瑞新能源汽车股份有限公司 | 一种电动汽车动力电池调温装置、冷却系统以及电动汽车 |
CN110848822A (zh) * | 2019-11-21 | 2020-02-28 | 青岛海尔空调器有限总公司 | 散热构件、散热器和空调器 |
WO2024022563A1 (de) * | 2022-07-27 | 2024-02-01 | Continental Autonomous Mobility Germany GmbH | Kühlanordnung, assistenzsystem sowie herstellungsverfahren |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485245A (en) * | 1967-06-21 | 1969-12-23 | Ibm | Portable fluid heater |
US4594862A (en) * | 1984-01-21 | 1986-06-17 | British Aerospace Public Limited Company | Heat transfer arrangement |
US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
US6241005B1 (en) * | 1999-03-30 | 2001-06-05 | Veeco Instruments, Inc. | Thermal interface member |
JP3376346B2 (ja) * | 2000-09-25 | 2003-02-10 | 株式会社東芝 | 冷却装置、この冷却装置を有する回路モジュールおよび電子機器 |
US20030178174A1 (en) * | 2002-03-21 | 2003-09-25 | Belady Christian L. | Thermal pouch interface |
US7167366B2 (en) * | 2002-09-11 | 2007-01-23 | Kioan Cheon | Soft cooling jacket for electronic device |
JP2005072216A (ja) * | 2003-08-25 | 2005-03-17 | Hitachi Ltd | 液冷システムおよびこれを用いた電子機器 |
US7063127B2 (en) * | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
-
2005
- 2005-07-01 JP JP2005194110A patent/JP4439441B2/ja not_active Expired - Fee Related
- 2005-10-14 CN CNB2005101136620A patent/CN100463151C/zh not_active Expired - Fee Related
- 2005-10-24 US US11/255,952 patent/US20070000655A1/en not_active Abandoned
- 2005-10-28 KR KR1020050102066A patent/KR100678535B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007010277A (ja) | 2007-01-18 |
US20070000655A1 (en) | 2007-01-04 |
KR20070003509A (ko) | 2007-01-05 |
KR100678535B1 (ko) | 2007-02-05 |
CN1893042A (zh) | 2007-01-10 |
CN100463151C (zh) | 2009-02-18 |
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