KR100678535B1 - 액체 냉각용의 열 교환기 - Google Patents
액체 냉각용의 열 교환기 Download PDFInfo
- Publication number
- KR100678535B1 KR100678535B1 KR1020050102066A KR20050102066A KR100678535B1 KR 100678535 B1 KR100678535 B1 KR 100678535B1 KR 1020050102066 A KR1020050102066 A KR 1020050102066A KR 20050102066 A KR20050102066 A KR 20050102066A KR 100678535 B1 KR100678535 B1 KR 100678535B1
- Authority
- KR
- South Korea
- Prior art keywords
- plate
- heat
- bag
- heat exchanger
- flow path
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 239000007788 liquid Substances 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 239000002826 coolant Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000000379 polymerizing effect Effects 0.000 claims abstract 3
- 239000000110 cooling liquid Substances 0.000 claims description 14
- 238000005192 partition Methods 0.000 description 15
- 125000006850 spacer group Chemical group 0.000 description 15
- 239000006096 absorbing agent Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
Claims (5)
- 냉각액이 내부를 흐르는 액체 냉각용의 열 교환기이며,냉각액의 유입구 및 유출구를 갖는 내수성 시트로 이루어지는 주머니와,상기 주머니와 중합하는 열 교환판과,상기 주머니를 상기 열 교환판에 압박하는 압박판을 구비하고,상기 열 교환판 및 압박판 중 적어도 어느 한 쪽의 내측에, 상기 유입구와 유출구를 연결하는 유로를 획정하는 요철이 형성된 것을 특징으로 하는 액체 냉각용의 열 교환기.
- 제1항에 있어서, 상기 열 교환판의 내측에 상기 유입구와 유출구를 연결하는 유로를 획정하는 요철이 형성되고,상기 압박판의 내측에 상기 열 교환판의 요철과 같은 패턴의 요철이 형성된 액체 냉각용의 열 교환기.
- 제1항 또는 제2항에 있어서, 상기 열 교환판 또는 압박판에 형성되는 요철은 오목부와 볼록부와의 고저 차이가 완만하게 변화되는 기복인 액체 냉각용의 열 교환기.
- 냉각액이 내부를 흐르는 액체 냉각용의 방열기이며,냉각액의 유입구 및 유출구를 갖는 라미네이트 백과,상기 라미네이트 백과 중합하는 방열판과,상기 라미네이트 백을 상기 방열판에 압박하는 압박판을 구비하고,상기 방열판 및 압박판 중 적어도 어느 한 쪽의 내측에 상기 유입구와 유출구를 연결하는 유로를 획정하는 요철이 형성된 것을 특징으로 하는 액체 냉각용의 방열기.
- 냉각액이 내부를 흐르는 액체 냉각용의 흡열기이며,냉각액의 유입구 및 유출구를 갖는 라미네이트 백과,상기 라미네이트 백과 중합하는 수열판과,상기 라미네이트 백을 상기 수열판에 압박하는 압박판을 구비하고,상기 수열판 및 압박판 중 적어도 어느 한 쪽의 내측에 상기 유입구와 유출구를 연결하는 유로를 획정하는 요철이 형성된 것을 특징으로 하는 액체 냉각용의 흡열기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00194110 | 2005-07-01 | ||
JP2005194110A JP4439441B2 (ja) | 2005-07-01 | 2005-07-01 | 熱交換器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070003509A KR20070003509A (ko) | 2007-01-05 |
KR100678535B1 true KR100678535B1 (ko) | 2007-02-05 |
Family
ID=37588124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050102066A KR100678535B1 (ko) | 2005-07-01 | 2005-10-28 | 액체 냉각용의 열 교환기 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070000655A1 (ko) |
JP (1) | JP4439441B2 (ko) |
KR (1) | KR100678535B1 (ko) |
CN (1) | CN100463151C (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060065002A1 (en) * | 2004-09-27 | 2006-03-30 | Humano, Ltd. | System and method for extracting potable water from atmosphere |
JP4617209B2 (ja) * | 2005-07-07 | 2011-01-19 | 株式会社豊田自動織機 | 放熱装置 |
KR101496493B1 (ko) * | 2007-11-26 | 2015-02-26 | 가부시키가이샤 도요다 지도숏키 | 액냉식 냉각 장치 |
JP2010161184A (ja) | 2009-01-08 | 2010-07-22 | Hitachi Ltd | 半導体装置 |
JP5572985B2 (ja) * | 2009-04-15 | 2014-08-20 | 富士通株式会社 | フィルム配管、フィルム配管を備えた冷却モジュール、及びフィルム配管の製造方法 |
US20110232877A1 (en) * | 2010-03-23 | 2011-09-29 | Celsia Technologies Taiwan, Inc. | Compact vapor chamber and heat-dissipating module having the same |
US8368208B2 (en) * | 2010-10-01 | 2013-02-05 | Raytheon Company | Semiconductor cooling apparatus |
TW201241603A (en) * | 2011-04-08 | 2012-10-16 | Asustek Comp Inc | Motherboard |
US9553038B2 (en) | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
JP5939102B2 (ja) * | 2012-09-18 | 2016-06-22 | 富士通株式会社 | 電子機器 |
JP6121854B2 (ja) * | 2013-09-18 | 2017-04-26 | 東芝ホームテクノ株式会社 | シート型ヒートパイプまたは携帯情報端末 |
JP6504705B2 (ja) * | 2015-07-27 | 2019-04-24 | 藤森工業株式会社 | 温度調節機能付き容器 |
CN105972479B (zh) * | 2016-05-18 | 2018-07-27 | 东莞市闻誉实业有限公司 | 照明装置 |
CN105972478B (zh) * | 2016-05-18 | 2018-05-04 | 东莞市闻誉实业有限公司 | 散热灯具 |
CN105955434A (zh) * | 2016-06-30 | 2016-09-21 | 华为技术有限公司 | 一种柔性换热单元、液冷散热装置及液冷散热系统 |
CN109413929B (zh) * | 2017-08-16 | 2020-11-24 | 鹏鼎控股(深圳)股份有限公司 | 散热板及其制造方法 |
CN110112502B (zh) * | 2019-05-07 | 2021-03-02 | 奇瑞新能源汽车股份有限公司 | 一种电动汽车动力电池调温装置、冷却系统以及电动汽车 |
CN110848822A (zh) * | 2019-11-21 | 2020-02-28 | 青岛海尔空调器有限总公司 | 散热构件、散热器和空调器 |
CN115696843A (zh) * | 2021-07-27 | 2023-02-03 | 华为技术有限公司 | 液冷板、液冷系统及电子设备 |
WO2024022563A1 (de) * | 2022-07-27 | 2024-02-01 | Continental Autonomous Mobility Germany GmbH | Kühlanordnung, assistenzsystem sowie herstellungsverfahren |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485245A (en) * | 1967-06-21 | 1969-12-23 | Ibm | Portable fluid heater |
US4594862A (en) * | 1984-01-21 | 1986-06-17 | British Aerospace Public Limited Company | Heat transfer arrangement |
US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
US6241005B1 (en) * | 1999-03-30 | 2001-06-05 | Veeco Instruments, Inc. | Thermal interface member |
JP3376346B2 (ja) * | 2000-09-25 | 2003-02-10 | 株式会社東芝 | 冷却装置、この冷却装置を有する回路モジュールおよび電子機器 |
US20030178174A1 (en) * | 2002-03-21 | 2003-09-25 | Belady Christian L. | Thermal pouch interface |
US7167366B2 (en) * | 2002-09-11 | 2007-01-23 | Kioan Cheon | Soft cooling jacket for electronic device |
JP2005072216A (ja) * | 2003-08-25 | 2005-03-17 | Hitachi Ltd | 液冷システムおよびこれを用いた電子機器 |
US7063127B2 (en) * | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
-
2005
- 2005-07-01 JP JP2005194110A patent/JP4439441B2/ja not_active Expired - Fee Related
- 2005-10-14 CN CNB2005101136620A patent/CN100463151C/zh not_active Expired - Fee Related
- 2005-10-24 US US11/255,952 patent/US20070000655A1/en not_active Abandoned
- 2005-10-28 KR KR1020050102066A patent/KR100678535B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4439441B2 (ja) | 2010-03-24 |
JP2007010277A (ja) | 2007-01-18 |
US20070000655A1 (en) | 2007-01-04 |
CN100463151C (zh) | 2009-02-18 |
CN1893042A (zh) | 2007-01-10 |
KR20070003509A (ko) | 2007-01-05 |
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