JP5904856B2 - プリント配線板、半導体パッケージ及びプリント回路板 - Google Patents

プリント配線板、半導体パッケージ及びプリント回路板 Download PDF

Info

Publication number
JP5904856B2
JP5904856B2 JP2012097572A JP2012097572A JP5904856B2 JP 5904856 B2 JP5904856 B2 JP 5904856B2 JP 2012097572 A JP2012097572 A JP 2012097572A JP 2012097572 A JP2012097572 A JP 2012097572A JP 5904856 B2 JP5904856 B2 JP 5904856B2
Authority
JP
Japan
Prior art keywords
pad
circuit board
printed circuit
signal
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012097572A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013225610A5 (enExample
JP2013225610A (ja
Inventor
林　靖二
靖二 林
琢也 近藤
琢也 近藤
昇司 松本
昇司 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012097572A priority Critical patent/JP5904856B2/ja
Priority to US13/862,038 priority patent/US9192044B2/en
Priority to EP13164422.1A priority patent/EP2658353A1/en
Priority to CN201310142055.1A priority patent/CN103379733B/zh
Publication of JP2013225610A publication Critical patent/JP2013225610A/ja
Publication of JP2013225610A5 publication Critical patent/JP2013225610A5/ja
Application granted granted Critical
Publication of JP5904856B2 publication Critical patent/JP5904856B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09463—Partial lands, i.e. lands or conductive rings not completely surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09636—Details of adjacent, not connected vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
JP2012097572A 2012-04-23 2012-04-23 プリント配線板、半導体パッケージ及びプリント回路板 Expired - Fee Related JP5904856B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012097572A JP5904856B2 (ja) 2012-04-23 2012-04-23 プリント配線板、半導体パッケージ及びプリント回路板
US13/862,038 US9192044B2 (en) 2012-04-23 2013-04-12 Printed wiring board, semiconductor package, and printed circuit board
EP13164422.1A EP2658353A1 (en) 2012-04-23 2013-04-19 Printed wiring board, semiconductor package, and printed circuit board with semiconductor package
CN201310142055.1A CN103379733B (zh) 2012-04-23 2013-04-23 印刷布线板、半导体封装件和印刷电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012097572A JP5904856B2 (ja) 2012-04-23 2012-04-23 プリント配線板、半導体パッケージ及びプリント回路板

Publications (3)

Publication Number Publication Date
JP2013225610A JP2013225610A (ja) 2013-10-31
JP2013225610A5 JP2013225610A5 (enExample) 2015-06-18
JP5904856B2 true JP5904856B2 (ja) 2016-04-20

Family

ID=48141810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012097572A Expired - Fee Related JP5904856B2 (ja) 2012-04-23 2012-04-23 プリント配線板、半導体パッケージ及びプリント回路板

Country Status (4)

Country Link
US (1) US9192044B2 (enExample)
EP (1) EP2658353A1 (enExample)
JP (1) JP5904856B2 (enExample)
CN (1) CN103379733B (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6238567B2 (ja) 2012-08-01 2017-11-29 キヤノン株式会社 放電回路、電源装置及び画像形成装置
US9356525B2 (en) 2012-08-31 2016-05-31 Canon Kabushiki Kaisha Power supply device and image forming apparatus
US20140174812A1 (en) * 2012-12-21 2014-06-26 Raul Enriquez Shibayama Method and Apparatus for Far End Crosstalk Reduction in Single Ended Signaling
JP6036513B2 (ja) * 2013-04-19 2016-11-30 株式会社デンソー 車両用電子機器
US20150085458A1 (en) * 2013-09-26 2015-03-26 Raul Enriquez Shibayama Reducing Far End Crosstalk in Single Ended Interconnects and Buses
JP6384118B2 (ja) * 2014-05-13 2018-09-05 日立化成株式会社 半導体装置の製造方法、半導体装置及び半導体装置製造用部材
KR102198858B1 (ko) 2014-07-24 2021-01-05 삼성전자 주식회사 인터포저 기판을 갖는 반도체 패키지 적층 구조체
US9864826B2 (en) * 2014-11-03 2018-01-09 Toshiba Memory Corporation Multilayer printed board and layout method for multilayer printed board
JP6462360B2 (ja) * 2014-12-27 2019-01-30 京セラ株式会社 配線基板
US9722012B1 (en) * 2016-09-02 2017-08-01 Qualcomm Incorporated Circuits and methods providing mutual capacitance in vertical electrical connections
JP6818534B2 (ja) 2016-12-13 2021-01-20 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
US10074919B1 (en) * 2017-06-16 2018-09-11 Intel Corporation Board integrated interconnect
US20190164891A1 (en) * 2017-11-27 2019-05-30 Finisar Corporation Tunable differential via circuit
US10716211B2 (en) 2018-02-08 2020-07-14 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, electronic device, and camera
CN110364510B (zh) * 2018-04-09 2021-04-20 华为技术有限公司 芯片及通信设备
WO2020021742A1 (ja) * 2018-07-26 2020-01-30 三菱電機株式会社 プリント回路板
JP6942679B2 (ja) 2018-09-21 2021-09-29 キヤノン株式会社 伝送回路、電子機器、及び撮像装置
TWI681527B (zh) * 2019-03-21 2020-01-01 創意電子股份有限公司 線路結構及晶片封裝件
US11019719B2 (en) 2019-08-06 2021-05-25 Canon Kabushiki Kaisha Printed circuit board, printed wiring board, and electronic device
KR102762977B1 (ko) * 2020-01-30 2025-02-10 삼성전자주식회사 금속 베이스 배선 기판 및 전자소자 모듈
US11670601B2 (en) * 2020-07-17 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Stacking via structures for stress reduction
TWI770618B (zh) * 2020-09-26 2022-07-11 矽品精密工業股份有限公司 電子封裝件及其承載基板
KR102900980B1 (ko) 2020-09-28 2025-12-18 삼성전자주식회사 인터 포저 및 이를 포함하는 전자 장치
CN112818624B (zh) * 2021-01-06 2023-10-27 深圳沸石智能技术有限公司 印制线路板设计图的生成方法、印制电路板及其制作方法
JP7693344B2 (ja) 2021-03-22 2025-06-17 キヤノン株式会社 電子モジュール及び電子機器
JP7414768B2 (ja) 2021-04-01 2024-01-16 キヤノン株式会社 電気回路及び電子機器
JP2022182020A (ja) * 2021-05-27 2022-12-08 株式会社東芝 ヘッドアクチュエータおよびディスク装置
JP2023067351A (ja) 2021-11-01 2023-05-16 キヤノン株式会社 伝送モジュール、電子ユニット、及び電子機器
JP7619304B2 (ja) * 2022-02-25 2025-01-22 株式会社村田製作所 積層基板
US20220338344A1 (en) * 2022-06-30 2022-10-20 Intel Corporation Phase heterogeneous interconnects for crosstalk reduction
KR20240030265A (ko) * 2022-08-30 2024-03-07 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지
CN120380597A (zh) * 2023-04-28 2025-07-25 华为技术有限公司 基板、芯片、芯片封装结构及电子设备
JP2025011927A (ja) * 2023-07-12 2025-01-24 キヤノン株式会社 プリント配線板、プリント回路板、電子機器及びヘッドマウントディスプレイ
KR20250170310A (ko) * 2024-05-28 2025-12-05 삼성전자주식회사 회로 기판, 반도체 모듈 및 반도체 시스템

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JP2001102479A (ja) * 1999-09-27 2001-04-13 Toshiba Corp 半導体集積回路装置およびその製造方法
JP2001203470A (ja) 2000-01-21 2001-07-27 Toshiba Corp 配線基板、半導体パッケージ、および半導体装置
JP3554886B2 (ja) * 2000-03-30 2004-08-18 日本特殊陶業株式会社 配線基板
JP2002290030A (ja) * 2001-03-23 2002-10-04 Ngk Spark Plug Co Ltd 配線基板
JP2004064052A (ja) * 2002-07-27 2004-02-26 Samsung Electro Mech Co Ltd ノイズ遮蔽型積層基板とその製造方法
US7583513B2 (en) * 2003-09-23 2009-09-01 Intel Corporation Apparatus for providing an integrated printed circuit board registration coupon
US7154047B2 (en) * 2004-02-27 2006-12-26 Texas Instruments Incorporated Via structure of packages for high frequency semiconductor devices
WO2005091367A1 (ja) * 2004-03-19 2005-09-29 Renesas Technology Corp. 電子回路、半導体装置及び実装基板
JP4647243B2 (ja) 2004-05-24 2011-03-09 ルネサスエレクトロニクス株式会社 半導体装置
US20070275607A1 (en) 2006-05-04 2007-11-29 Kwark Young H Compensation for far end crosstalk in data buses
JP5354949B2 (ja) * 2007-06-19 2013-11-27 キヤノン株式会社 プリント回路板
US7564695B2 (en) 2007-07-09 2009-07-21 Canon Kabushiki Kaisha Circuit connection structure and printed circuit board
KR100923928B1 (ko) 2007-10-29 2009-10-28 포항공과대학교 산학협력단 서펜타인 형태의 마이크로 스트립 전송선 구조
US7897880B1 (en) * 2007-12-07 2011-03-01 Force 10 Networks, Inc Inductance-tuned circuit board via crosstalk structures
JP5284194B2 (ja) 2008-08-07 2013-09-11 キヤノン株式会社 プリント配線板およびプリント回路板
JP5715334B2 (ja) * 2009-10-15 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置
JP5610970B2 (ja) 2010-10-19 2014-10-22 キヤノン株式会社 プリント回路板

Also Published As

Publication number Publication date
CN103379733B (zh) 2016-06-01
CN103379733A (zh) 2013-10-30
JP2013225610A (ja) 2013-10-31
US9192044B2 (en) 2015-11-17
EP2658353A1 (en) 2013-10-30
US20130279134A1 (en) 2013-10-24

Similar Documents

Publication Publication Date Title
JP2013225610A (ja) プリント配線板、半導体パッケージ及びプリント回路板
JP6449760B2 (ja) 半導体装置
TWI573229B (zh) 配線基板
JP6098285B2 (ja) 配線基板及び電子装置
CN103260339A (zh) 多层布线板和电子装置
JP2008010859A (ja) 半導体装置
JP4365166B2 (ja) キャパシタ、多層配線基板及び半導体装置
CN103260340A (zh) 多层布线基板和电子设备
US10306757B2 (en) Circuit board and electronic device
CN103889145B (zh) 线路板及电子总成
JP2008109094A (ja) 素子搭載用基板および半導体モジュール
TWI572256B (zh) 線路板及電子總成
US9565750B2 (en) Wiring board for mounting a semiconductor element
JP5460616B2 (ja) 半導体パッケージ
US8324508B2 (en) Composite circuit board
CN104966708B (zh) 半导体封装结构
JP2012033786A (ja) 配線基板
JP2010519769A (ja) 高速メモリパッケージ
TWI615933B (zh) 半導體裝置及其製造方法
JP6535788B2 (ja) 半導体装置
US20030148077A1 (en) High-performance laminate for integrated circuit interconnection
JP5855913B2 (ja) 半導体装置
JP5306551B1 (ja) 多層回路基板
JP2012174998A (ja) 半導体装置
JP2014007210A (ja) 配線基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150422

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150422

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151218

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160216

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160315

R151 Written notification of patent or utility model registration

Ref document number: 5904856

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

LAPS Cancellation because of no payment of annual fees