JP5714575B2 - 表面処理銅箔 - Google Patents
表面処理銅箔 Download PDFInfo
- Publication number
- JP5714575B2 JP5714575B2 JP2012515832A JP2012515832A JP5714575B2 JP 5714575 B2 JP5714575 B2 JP 5714575B2 JP 2012515832 A JP2012515832 A JP 2012515832A JP 2012515832 A JP2012515832 A JP 2012515832A JP 5714575 B2 JP5714575 B2 JP 5714575B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- zinc
- layer
- treated copper
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 277
- 239000011889 copper foil Substances 0.000 title claims description 261
- 238000011282 treatment Methods 0.000 claims description 97
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 67
- 229910052725 zinc Inorganic materials 0.000 claims description 66
- 239000011701 zinc Substances 0.000 claims description 66
- 238000010438 heat treatment Methods 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 54
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 50
- 239000013078 crystal Substances 0.000 claims description 48
- 230000002265 prevention Effects 0.000 claims description 36
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 27
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 24
- 238000007788 roughening Methods 0.000 claims description 23
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 21
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 16
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 239000011593 sulfur Substances 0.000 claims description 15
- 229910052717 sulfur Inorganic materials 0.000 claims description 15
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 14
- 239000000460 chlorine Substances 0.000 claims description 14
- 229910052801 chlorine Inorganic materials 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000012298 atmosphere Substances 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 10
- 230000003746 surface roughness Effects 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 146
- 230000000052 comparative effect Effects 0.000 description 42
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000000243 solution Substances 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 239000011888 foil Substances 0.000 description 14
- 238000004381 surface treatment Methods 0.000 description 14
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 13
- 229910001416 lithium ion Inorganic materials 0.000 description 13
- 239000011573 trace mineral Substances 0.000 description 13
- 235000013619 trace mineral Nutrition 0.000 description 13
- 230000003449 preventive effect Effects 0.000 description 12
- 238000007747 plating Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000007773 negative electrode material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 5
- 238000001887 electron backscatter diffraction Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000002335 surface treatment layer Substances 0.000 description 3
- -1 3-aminopropoxy Chemical group 0.000 description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- VFUKWRRIFIOBJI-UHFFFAOYSA-J copper zinc phosphonato phosphate Chemical compound [O-]P([O-])(=O)OP(=O)([O-])[O-].[Cu+2].[Zn+2] VFUKWRRIFIOBJI-UHFFFAOYSA-J 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 239000011255 nonaqueous electrolyte Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
- ZDWPBMJZDNXTPG-UHFFFAOYSA-N 2h-benzotriazol-4-amine Chemical compound NC1=CC=CC2=C1NN=N2 ZDWPBMJZDNXTPG-UHFFFAOYSA-N 0.000 description 1
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- KFSRINVVFGTVOA-UHFFFAOYSA-N 3-[butoxy(dimethoxy)silyl]propan-1-amine Chemical compound CCCCO[Si](OC)(OC)CCCN KFSRINVVFGTVOA-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- ZGDWHDKHJKZZIQ-UHFFFAOYSA-N cobalt nickel Chemical compound [Co].[Ni].[Ni].[Ni] ZGDWHDKHJKZZIQ-UHFFFAOYSA-N 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- DCLHJMYSBFUUQV-UHFFFAOYSA-J copper;zinc;disulfate Chemical compound [Cu+2].[Zn+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DCLHJMYSBFUUQV-UHFFFAOYSA-J 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- VMYXFDVIMUEKNP-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-yl)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCC1CO1 VMYXFDVIMUEKNP-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/324—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
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- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
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- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12785—Group IIB metal-base component
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Description
本件発明に係る表面処理銅箔は、銅箔の両面に防錆処理層を備える表面処理銅箔であって、当該防錆処理層は、亜鉛合金で構成し、且つ、いずれの面の亜鉛量も20mg/m2〜1000mg/m2の亜鉛合金層であり、当該銅箔は、炭素、硫黄、塩素、窒素から選ばれる1種又は2種以上の微量成分を含有し、これらの総含有量が100ppm以上であることを特徴とするものである。
本件発明に係る表面処理銅箔は、図1に模式的に示すように、銅箔の両面に防錆処理層を備える表面処理銅箔である。この図1には、銅箔2の片面側には、「防錆処理層3/クロメート処理層4/有機剤処理層5」の3層構成の表面処理層があり、反対面には「粗化処理層6/防錆処理層3/クロメート処理層4/有機剤処理層5」の4層構成の表面処理層がある状態を典型例として示している。なお、このときの粗化処理層は、微細銅粒子の集合体として示している。そして、図1における、粗化処理層6、クロメート処理層4及び有機剤処理層5は、要求特性に応じて設ける任意の表面処理層である。よって、層構成として多くのバリエーションが、本件発明に含まれることになる。なお、図面において、模式的に示した各層及び粗化状態は、説明を容易にするためのものであり、現実の製品の厚さ及び粗化状態を反映したものでないことを明記しておく。以下、本件発明に係る表面処理銅箔の構成が理解できるように、各項目毎に説明する。
本件発明に係る表面処理銅箔の製造方法は、上述に記載の表面処理銅箔の製造方法であって、銅箔の表面に対して、防錆処理層として「亜鉛合金層」を設ける防錆処理工程の他、必要に応じて、粗化処理及びその他の各種表面処理を施し、所定の条件で加熱する乾燥工程を備える。以下、工程毎に説明する。
銅箔: ここでは、箔中の微量元素の合計量が100ppm以上の電解銅箔として、三井金属鉱業株式会社製のVLP銅箔の製造に用いる厚さ12μmの表面処理の施されていない電解銅箔を用いた。この銅箔は、箔中に炭素を44ppm、硫黄を14ppm、塩素を52ppm、窒素を11ppm含有し、これら微量元素の総含有量が121ppmであった。また、結晶粒径が0.60μmであり、常態引張強さの値が54.4kgf/mm2であった。
以下、評価項目及びその測定方法に関して述べる。この実施例に係る実施試料1〜実施試料9の評価結果は、以下に述べる比較例に係る比較試料と対比可能なように表1に示す。
この比較例1は、実施例で用いた銅箔に防錆処理を施すことなく、実施例と同様の手順で表面処理銅箔を製造し、これを比較試料1とした。
この比較例1は、実施例の防錆処理層に用いた亜鉛−スズ合金層を用いているが、その亜鉛−スズ合金層中の亜鉛量が20mg/m2未満(亜鉛付着量:12mg/m2、スズ付着量:2mg/m2)となるようにして比較試料2を得た。その他の工程及び評価に関しては、実施例と同様であるため記載を省略する。
この比較例3は、防錆処理層を構成する亜鉛合金中の亜鉛防錆量が20mg/m2未満で、且つ、亜鉛含有量が40質量%未満の「亜鉛−ニッケル合金(亜鉛付着量:12mg/m2、ニッケル付着量:20mg/m2)」に置き換えたものである。その他の工程及び評価に関しては、実施例と同様であるため記載を省略し、防錆処理工程に関してのみ述べる。
この比較例4では、「箔中の微量元素の合計量が100ppm以下」で、且つ、「結晶粒径が1.0μmより大きい」という条件を満たす電解銅箔を選択して用いた。
ここでの実施例と比較例との対比は、以下の表1を参照して行う。
以上の対比結果から、表面処理銅箔は、「炭素、硫黄、塩素、窒素から選ばれる1種又は2種以上の微量成分を含有し、これらの総含有量が100ppm以上の銅箔」を用いることを前提として、この銅箔の両面にある防錆処理層は、亜鉛合金層として「亜鉛含有量が40質量%以上の亜鉛−銅合金層」又は「亜鉛−スズ合金層」を採用し、且つ、「その亜鉛合金層が含有する亜鉛量が20mg/m2〜1000mg/m2」の条件を満たすことが、高温負荷を受けたときの耐軟化性能を向上させるためには必須である。これらの条件を満たすことで、防錆処理層として亜鉛合金層を備える表面処理銅箔が「350℃×60分間の加熱処理を行った後の引張強さが40kgf/mm2以上」、「400℃×60分間の加熱処理を行った後の引張強さが35kgf/mm2以上」という良好な耐軟化性能を備えることが理解できる。
2 銅箔層
3 防錆処理層(亜鉛合金層)
4 クロメート処理層
5 有機剤処理層
6 粗化処理層(微細銅粒)
Claims (12)
- 銅箔の両面に防錆処理層を備える表面処理銅箔であって、
当該防錆処理層は、亜鉛合金で構成し、且つ、いずれの面の亜鉛量も20mg/m2〜1000mg/m2の亜鉛合金層であり、
当該銅箔は、炭素、硫黄、塩素、窒素から選ばれる1種又は2種以上の微量成分を含有し、これらの総含有量が100ppm以上であることを特徴とする表面処理銅箔。 - 前記銅箔の両面に配した亜鉛合金層を構成する総亜鉛量が40mg/m2〜2000mg/m2である請求項1に記載の表面処理銅箔。
- 前記防錆処理層としての亜鉛合金層は、亜鉛含有量が40質量%以上の亜鉛−銅合金又は亜鉛−スズ合金で構成したものである請求項1又は請求項2に記載の表面処理銅箔。
- 前記亜鉛合金層の構成に亜鉛−スズ合金を用いる場合において、前記亜鉛合金層に含まれるスズ含有量は、1mg/m2〜200mg/m2である請求項3に記載の表面処理銅箔。
- 前記銅箔は、常態の結晶粒径が1.0μm以下である電解銅箔である請求項1〜請求項4のいずれかに記載の表面処理銅箔。
- 前記銅箔は、常態の引張強さが50kgf/mm2以上の電解銅箔である請求項1〜請求項5のいずれかに記載の表面処理銅箔。
- 前記銅箔は、片面側又は両面側を粗化処理したものである請求項1〜請求項6のいずれかに記載の表面処理銅箔。
- 前記防錆処理層の表面に、クロメート処理層、有機剤処理層のいずれか一方又は双方を備える請求項1〜請求項7のいずれかに記載の表面処理銅箔。
- 前記有機剤処理層は、シランカップリング剤処理層、有機防錆処理層のいずれか一方又は双方からなるものである請求項8に記載の表面処理銅箔。
- 当該表面処理銅箔の表面粗さ(Ra)が、0.1μm〜0.7μmである請求項1〜請求項9のいずれかに記載の表面処理銅箔。
- 不活性ガス雰囲気において、350℃×60分間の加熱処理を行った後の引張強さが40kgf/mm2以上である請求項1〜請求項10のいずれかに記載の表面処理銅箔。
- 不活性ガス雰囲気において、400℃×60分間の加熱処理を行った後の引張強さが35kgf/mm2以上である請求項1〜請求項11のいずれかに記載の表面処理銅箔。
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MY162358A (en) | 2017-06-15 |
CN103221584A (zh) | 2013-07-24 |
TW201231733A (en) | 2012-08-01 |
KR20140140649A (ko) | 2014-12-09 |
TWI432610B (zh) | 2014-04-01 |
KR101593282B1 (ko) | 2016-02-11 |
KR101482898B1 (ko) | 2015-01-15 |
CN103221583A (zh) | 2013-07-24 |
EP2644754B1 (en) | 2016-05-11 |
TW201228818A (en) | 2012-07-16 |
US20130302635A1 (en) | 2013-11-14 |
US9138964B2 (en) | 2015-09-22 |
KR20130131379A (ko) | 2013-12-03 |
WO2012070589A1 (ja) | 2012-05-31 |
CN103221584B (zh) | 2016-01-06 |
EP2644753A1 (en) | 2013-10-02 |
TWI560047B (en) | 2016-12-01 |
US20130295407A1 (en) | 2013-11-07 |
CN103221583B (zh) | 2015-05-13 |
JPWO2012070589A1 (ja) | 2014-05-19 |
CN104651836B (zh) | 2018-11-02 |
EP2644754A1 (en) | 2013-10-02 |
EP2644753B1 (en) | 2016-05-11 |
EP2644753A4 (en) | 2014-08-06 |
MY163882A (en) | 2017-11-15 |
JPWO2012070591A1 (ja) | 2014-05-19 |
KR20130121880A (ko) | 2013-11-06 |
WO2012070591A1 (ja) | 2012-05-31 |
EP2644754A4 (en) | 2014-08-06 |
JP5400960B2 (ja) | 2014-01-29 |
CN104651836A (zh) | 2015-05-27 |
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