JP5591470B2 - 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 - Google Patents
代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 Download PDFInfo
- Publication number
- JP5591470B2 JP5591470B2 JP2008529239A JP2008529239A JP5591470B2 JP 5591470 B2 JP5591470 B2 JP 5591470B2 JP 2008529239 A JP2008529239 A JP 2008529239A JP 2008529239 A JP2008529239 A JP 2008529239A JP 5591470 B2 JP5591470 B2 JP 5591470B2
- Authority
- JP
- Japan
- Prior art keywords
- boron
- ions
- reactor
- ionization
- precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H10P30/20—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H10P30/204—
-
- H10P30/21—
-
- H10P30/224—
-
- H10P30/225—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0815—Methods of ionisation
- H01J2237/082—Electron beam
Landscapes
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Chemical Vapour Deposition (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71264705P | 2005-08-30 | 2005-08-30 | |
| US60/712,647 | 2005-08-30 | ||
| PCT/US2006/033899 WO2007027798A2 (en) | 2005-08-30 | 2006-08-30 | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014000137A Division JP6234230B2 (ja) | 2005-08-30 | 2014-01-06 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009506580A JP2009506580A (ja) | 2009-02-12 |
| JP2009506580A5 JP2009506580A5 (enExample) | 2011-03-24 |
| JP5591470B2 true JP5591470B2 (ja) | 2014-09-17 |
Family
ID=37809472
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008529239A Active JP5591470B2 (ja) | 2005-08-30 | 2006-08-30 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
| JP2014000137A Active JP6234230B2 (ja) | 2005-08-30 | 2014-01-06 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
| JP2015246461A Pending JP2016042601A (ja) | 2005-08-30 | 2015-12-17 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014000137A Active JP6234230B2 (ja) | 2005-08-30 | 2014-01-06 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
| JP2015246461A Pending JP2016042601A (ja) | 2005-08-30 | 2015-12-17 | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7943204B2 (enExample) |
| EP (2) | EP1933992B1 (enExample) |
| JP (3) | JP5591470B2 (enExample) |
| KR (2) | KR101297917B1 (enExample) |
| CN (2) | CN103170447B (enExample) |
| SG (2) | SG165321A1 (enExample) |
| TW (4) | TWI450994B (enExample) |
| WO (1) | WO2007027798A2 (enExample) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI450994B (zh) * | 2005-08-30 | 2014-09-01 | 尖端科技材料股份有限公司 | 利用選擇性氟化硼前驅物之硼離子植入方法,及供植入用之大群氫化硼之形成方法 |
| US20100112795A1 (en) * | 2005-08-30 | 2010-05-06 | Advanced Technology Materials, Inc. | Method of forming ultra-shallow junctions for semiconductor devices |
| WO2008121620A1 (en) * | 2007-03-30 | 2008-10-09 | Advanced Technology Materials, Inc. | Method of forming ultra-shallow junctions for semiconductor devices |
| JP4345895B2 (ja) * | 2005-10-20 | 2009-10-14 | 日新イオン機器株式会社 | イオン源の運転方法およびイオン注入装置 |
| US20070178679A1 (en) * | 2006-01-28 | 2007-08-02 | Varian Semiconductor Equipment Associates, Inc. | Methods of implanting ions and ion sources used for same |
| US20070178678A1 (en) * | 2006-01-28 | 2007-08-02 | Varian Semiconductor Equipment Associates, Inc. | Methods of implanting ions and ion sources used for same |
| US7473606B2 (en) * | 2006-02-22 | 2009-01-06 | United Microelectronics Corp. | Method for fabricating metal-oxide semiconductor transistors |
| US7642150B2 (en) | 2006-11-08 | 2010-01-05 | Varian Semiconductor Equipment Associates, Inc. | Techniques for forming shallow junctions |
| TWI413149B (zh) * | 2008-01-22 | 2013-10-21 | 山米奎普公司 | 離子源氣體反應器及用於將氣體饋給材料轉化成不同分子或原子物種之方法 |
| US8003957B2 (en) | 2008-02-11 | 2011-08-23 | Varian Semiconductor Equipment Associates, Inc. | Ethane implantation with a dilution gas |
| JP2011512015A (ja) | 2008-02-11 | 2011-04-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 半導体処理システムにおけるイオン源の洗浄 |
| US7759657B2 (en) | 2008-06-19 | 2010-07-20 | Axcelis Technologies, Inc. | Methods for implanting B22Hx and its ionized lower mass byproducts |
| US20110021011A1 (en) | 2009-07-23 | 2011-01-27 | Advanced Technology Materials, Inc. | Carbon materials for carbon implantation |
| US8796131B2 (en) * | 2009-10-27 | 2014-08-05 | Advanced Technology Materials, Inc. | Ion implantation system and method |
| US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8062965B2 (en) * | 2009-10-27 | 2011-11-22 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8138071B2 (en) * | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US20110143527A1 (en) * | 2009-12-14 | 2011-06-16 | Varian Semiconductor Equipment Associates, Inc. | Techniques for generating uniform ion beam |
| CN105387340B (zh) | 2010-01-14 | 2018-09-18 | 恩特格里斯公司 | 适于容纳流体供应容器及与之耦接的流路的罩壳 |
| KR20120113265A (ko) | 2010-01-15 | 2012-10-12 | 유니버시티 오브 메디신 앤드 덴티스트리 오브 뉴 저지 | 골 치료를 촉진시키기 위한 바나듐 화합물의 용도 |
| TWI386983B (zh) * | 2010-02-26 | 2013-02-21 | 尖端科技材料股份有限公司 | 用以增進離子植入系統中之離子源的壽命及性能之方法與設備 |
| US8779383B2 (en) | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
| JP5908476B2 (ja) * | 2010-08-30 | 2016-04-26 | インテグリス・インコーポレーテッド | 固体材料から化合物又はその中間体を調製するための装置及び方法並びにそのような化合物及び中間体の使用 |
| JP5934222B2 (ja) * | 2010-09-15 | 2016-06-15 | プラクスエア・テクノロジー・インコーポレイテッド | イオン源の寿命を延長するための方法 |
| WO2012079024A2 (en) | 2010-12-10 | 2012-06-14 | University Of Medicine And Dentistry Of New Jersey | Implantable devices coated with insulin-mimetic agent composites and methods thereof |
| US20140322292A1 (en) | 2010-12-10 | 2014-10-30 | Rutgers, The State University Of New Jersey | Insulin-mimetics as therapeutic adjuncts for bone regeneration |
| WO2012129106A1 (en) * | 2011-03-18 | 2012-09-27 | University Of Medicine And Dentistry New Jersey | Boron composite surface coatings and their application on implantable device to accelerate osseous healing |
| LT5895B (lt) | 2011-05-18 | 2013-01-25 | Lietuvos Energetikos Institutas | Vandenilio gavybos iš vandens būdas |
| RU2522662C2 (ru) * | 2011-08-03 | 2014-07-20 | Федеральное государственное бюджетное учреждение "Государственный научный центр Российской Федерации - Институт Теоретической и Экспериментальной Физики" (ФГБУ "ГНЦ РФ ИТЭФ") | Способ нерпрерываемого производства пучка ионов карборана с постоянной самоочисткой ионного источника и компонент системы экстракции ионного имплантатора |
| TWI583442B (zh) | 2011-10-10 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | B2f4之製造程序 |
| KR101982903B1 (ko) | 2012-02-14 | 2019-05-27 | 엔테그리스, 아이엔씨. | 주입 용품에서 인 축적을 최소화하기 위한 대체 물질 및 혼합물 |
| EP2815424B1 (en) | 2012-02-14 | 2017-08-16 | Entegris Inc. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
| US9524849B2 (en) | 2013-07-18 | 2016-12-20 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in an implant system |
| EP3033765A4 (en) | 2013-08-16 | 2017-08-16 | Entegris, Inc. | Silicon implantation in substrates and provision of silicon precursor compositions therefor |
| CN105849869B (zh) * | 2013-11-26 | 2017-08-11 | 瓦里安半导体设备公司 | 处理工件的方法 |
| US9570271B2 (en) * | 2014-03-03 | 2017-02-14 | Praxair Technology, Inc. | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
| KR102214208B1 (ko) * | 2014-09-01 | 2021-02-08 | 엔테그리스, 아이엔씨. | 향상된 소스 기술을 이용한 인 또는 비소 이온 주입 |
| US9887067B2 (en) | 2014-12-03 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Boron implanting using a co-gas |
| EP3062329B1 (en) * | 2015-02-25 | 2016-12-14 | Fei Company | Multi-source GIS for particle-optical apparatus |
| KR20170004381A (ko) * | 2015-07-02 | 2017-01-11 | 삼성전자주식회사 | 불순물 영역을 포함하는 반도체 장치의 제조 방법 |
| WO2017172618A1 (en) * | 2016-03-28 | 2017-10-05 | Entegris, Inc. | Hydrogenated isotopically enriched boront trifluoride dopant source gas composition |
| KR20180132800A (ko) * | 2016-04-05 | 2018-12-12 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | 작업물 내로 프로세싱 종을 주입하는 방법 및 작업물 내로 도펀트를 주입하는 방법, 및 작업물을 프로세싱하기 위한 장치 |
| TWI707378B (zh) * | 2016-04-08 | 2020-10-11 | 美商瓦里安半導體設備公司 | 將加工物質植入工件中與將摻雜劑植入工件中的方法及用於加工工件的設備 |
| US10651003B2 (en) * | 2016-11-28 | 2020-05-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ion implanting method |
| RU2756481C2 (ru) * | 2016-11-29 | 2021-09-30 | Семиньюклиар, Инк. | Технология и производство низкоразмерного материала, поддерживающего как самотермализацию, так и самолокализацию |
| US11049728B2 (en) * | 2018-10-31 | 2021-06-29 | Entegris, Inc. | Boron-doped amorphous carbon hard mask and related methods |
| CN113261073B (zh) | 2018-12-15 | 2024-07-16 | 恩特格里斯公司 | 利用非钨材料的氟离子植入系统和其使用方法 |
| JP7256711B2 (ja) * | 2019-07-16 | 2023-04-12 | 住友重機械イオンテクノロジー株式会社 | イオン生成装置およびイオン注入装置 |
| IL297179A (en) * | 2020-05-11 | 2022-12-01 | Praxair Technology Inc | Storage and delivery of antimony-containing materials to an ion implanter |
| CN115485361A (zh) | 2020-05-12 | 2022-12-16 | Pbs生物技术公司 | 材料转移装置和相关的系统和方法 |
| US20240153774A1 (en) * | 2022-11-04 | 2024-05-09 | Applied Materials, Inc. | Multiprocess substrate treatment for enhanced substrate doping |
| WO2025193877A1 (en) * | 2024-03-12 | 2025-09-18 | Entegris, Inc. | Gas mixtures for ion implantation |
Family Cites Families (173)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2874301A (en) | 1953-08-10 | 1959-02-17 | Schlumberger Well Surv Corp | Well logging apparatus |
| US3472751A (en) | 1965-06-16 | 1969-10-14 | Ion Physics Corp | Method and apparatus for forming deposits on a substrate by cathode sputtering using a focussed ion beam |
| US3625749A (en) | 1966-04-06 | 1971-12-07 | Matsushita Electronics Corp | Method for deposition of silicon dioxide films |
| DE1789021C3 (de) | 1967-09-25 | 1975-04-10 | Hitachi, Ltd., Tokio | Zenerdiode und Verfahren zu ihrer Herstellung |
| JPS4820106B1 (enExample) | 1968-03-08 | 1973-06-19 | ||
| US3658586A (en) | 1969-04-11 | 1972-04-25 | Rca Corp | Epitaxial silicon on hydrogen magnesium aluminate spinel single crystals |
| US3725749A (en) | 1971-06-30 | 1973-04-03 | Monsanto Co | GaAS{11 {11 {11 P{11 {11 ELECTROLUMINESCENT DEVICE DOPED WITH ISOELECTRONIC IMPURITIES |
| GB1399050A (en) | 1973-08-21 | 1975-06-25 | Standard Telephones Cables Ltd | Graphite tube furnace |
| DE2408829C2 (de) | 1974-02-23 | 1984-03-22 | Ibm Deutschland Gmbh, 7000 Stuttgart | Bor-Ionenquell-Material und Verfahren zu seiner Herstellung |
| JPS5183473A (en) | 1975-01-20 | 1976-07-22 | Hitachi Ltd | Fujunbutsuno doopinguhoho |
| US4128733A (en) | 1977-12-27 | 1978-12-05 | Hughes Aircraft Company | Multijunction gallium aluminum arsenide-gallium arsenide-germanium solar cell and process for fabricating same |
| US4331647A (en) | 1980-03-03 | 1982-05-25 | Goldenberg Milton David | Tumor localization and therapy with labeled antibody fragments specific to tumor-associated markers |
| US4348376A (en) | 1980-03-03 | 1982-09-07 | Goldenberg Milton David | Tumor localization and therapy with labeled anti-CEA antibody |
| JPS588071A (ja) | 1981-07-08 | 1983-01-18 | Nippon Iyakuhin Kogyo Kk | 2−ベンゾチアゾリノン−3−酢酸アミド誘導体またはその薬学的に活性な塩類の製造法 |
| US4369031A (en) | 1981-09-15 | 1983-01-18 | Thermco Products Corporation | Gas control system for chemical vapor deposition system |
| US4459427A (en) | 1981-10-31 | 1984-07-10 | The British Petroleum Company P.L.C. | Process for the conversion of an alkane to a mixture of an alcohol and a ketone |
| JPS58197775A (ja) * | 1982-05-13 | 1983-11-17 | Canon Inc | 薄膜トランジスタ |
| US4619729A (en) | 1984-02-14 | 1986-10-28 | Energy Conversion Devices, Inc. | Microwave method of making semiconductor members |
| JPS60221566A (ja) | 1984-04-18 | 1985-11-06 | Agency Of Ind Science & Technol | 薄膜形成装置 |
| US4600801A (en) | 1984-11-02 | 1986-07-15 | Sovonics Solar Systems | Fluorinated, p-doped microcrystalline silicon semiconductor alloy material |
| US4722978A (en) | 1985-08-30 | 1988-02-02 | The B. F. Goodrich Company | Allyl terminated macromolecular monomers of polyethers |
| JPS6295820A (ja) | 1985-10-23 | 1987-05-02 | Hitachi Ltd | イオン打込み方法 |
| US4680358A (en) | 1985-11-08 | 1987-07-14 | The B F Goodrich Company | Styryl terminated macromolecular monomers of polyethers |
| JPS6315228A (ja) | 1986-07-08 | 1988-01-22 | Asahi Glass Co Ltd | エレクトロクロミツク素子 |
| JP2530434B2 (ja) | 1986-08-13 | 1996-09-04 | 日本テキサス・インスツルメンツ株式会社 | イオン発生装置 |
| JPH0772167B2 (ja) | 1986-09-04 | 1995-08-02 | サントリー株式会社 | 4―アミノ―3―ヒドロキシ酪酸誘導体の製法 |
| JPS6383147A (ja) | 1986-09-26 | 1988-04-13 | Nippon Petrochem Co Ltd | 熱可塑性エラストマ− |
| US4851255A (en) * | 1986-12-29 | 1989-07-25 | Air Products And Chemicals, Inc. | Ion implant using tetrafluoroborate |
| JPS6483147A (en) | 1987-09-25 | 1989-03-28 | Olympus Optical Co | Manufacture of chemical sensitivity field effect transistor |
| JPH01225117A (ja) | 1988-03-04 | 1989-09-08 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法及びその製造装置 |
| JP2699549B2 (ja) | 1988-06-03 | 1998-01-19 | 日産化学工業株式会社 | 4―ベンゾイル―5―ヒドロキシピラゾール類の製法 |
| JP2533639B2 (ja) | 1988-10-07 | 1996-09-11 | 株式会社富士電機総合研究所 | P形炭素添加非晶質シリコンの生成方法 |
| US4987933A (en) | 1989-03-03 | 1991-01-29 | Eaton Corporation | Fluid flow control method and apparatus for minimizing particle contamination |
| JPH05254808A (ja) | 1992-03-10 | 1993-10-05 | Semiconductor Energy Lab Co Ltd | 窒化ほう素の作製方法 |
| JPH0680681A (ja) | 1992-07-15 | 1994-03-22 | Nippon Kayaku Co Ltd | ホスホニウム化合物及びそれを用いた電子写真用トナー |
| JP3250573B2 (ja) * | 1992-12-28 | 2002-01-28 | キヤノン株式会社 | 光起電力素子及びその製造方法、並びに発電システム |
| JPH07114189B2 (ja) | 1993-01-07 | 1995-12-06 | 日本電気株式会社 | 不純物添加法 |
| WO1995000977A1 (fr) | 1993-06-23 | 1995-01-05 | Toray Industries, Inc. | Electrode d'element, element secondaire utilisant cette electrode d'element et son procede de production |
| JPH0790201A (ja) | 1993-09-22 | 1995-04-04 | Hokko Chem Ind Co Ltd | 水中防汚塗料 |
| JP2889098B2 (ja) | 1993-10-13 | 1999-05-10 | 株式会社本山製作所 | 特定ガスの供給制御装置 |
| US5436180A (en) | 1994-02-28 | 1995-07-25 | Motorola, Inc. | Method for reducing base resistance in epitaxial-based bipolar transistor |
| US5443732A (en) | 1994-04-01 | 1995-08-22 | Westinghouse Electric Corporation | Boron isotope separation using continuous ion exchange chromatography |
| US6132492A (en) | 1994-10-13 | 2000-10-17 | Advanced Technology Materials, Inc. | Sorbent-based gas storage and delivery system for dispensing of high-purity gas, and apparatus and process for manufacturing semiconductor devices, products and precursor structures utilizing same |
| US6083298A (en) | 1994-10-13 | 2000-07-04 | Advanced Technology Materials, Inc. | Process for fabricating a sorbent-based gas storage and dispensing system, utilizing sorbent material pretreatment |
| US5707424A (en) | 1994-10-13 | 1998-01-13 | Advanced Technology Materials, Inc. | Process system with integrated gas storage and delivery unit |
| US5518528A (en) | 1994-10-13 | 1996-05-21 | Advanced Technology Materials, Inc. | Storage and delivery system for gaseous hydride, halide, and organometallic group V compounds |
| US6204180B1 (en) | 1997-05-16 | 2001-03-20 | Advanced Technology Materials, Inc. | Apparatus and process for manufacturing semiconductor devices, products and precursor structures utilizing sorbent-based fluid storage and dispensing system for reagent delivery |
| US5704967A (en) | 1995-10-13 | 1998-01-06 | Advanced Technology Materials, Inc. | Fluid storage and delivery system comprising high work capacity physical sorbent |
| US5497006A (en) | 1994-11-15 | 1996-03-05 | Eaton Corporation | Ion generating source for use in an ion implanter |
| US5749937A (en) | 1995-03-14 | 1998-05-12 | Lockheed Idaho Technologies Company | Fast quench reactor and method |
| US5977552A (en) | 1995-11-24 | 1999-11-02 | Applied Materials, Inc. | Boron ion sources for ion implantation apparatus |
| JPH09298166A (ja) * | 1996-05-09 | 1997-11-18 | Hitachi Ltd | 半導体製造方法および装置 |
| US5837027A (en) | 1996-05-20 | 1998-11-17 | Advanced Technology Materials, Inc. | Manufacturing process for gas source and dispensing systems |
| US5993766A (en) * | 1996-05-20 | 1999-11-30 | Advanced Technology Materials, Inc. | Gas source and dispensing system |
| US5761910A (en) | 1996-05-20 | 1998-06-09 | Advanced Technology Materials, Inc. | High capacity gas storage and dispensing system |
| US5916245A (en) | 1996-05-20 | 1999-06-29 | Advanced Technology Materials, Inc. | High capacity gas storage and dispensing system |
| JP3077591B2 (ja) | 1996-06-20 | 2000-08-14 | 日本電気株式会社 | Cvd装置及びcvd成膜方法 |
| GB2317265A (en) | 1996-09-13 | 1998-03-18 | Aea Technology Plc | Radio frequency plasma generator |
| JPH10251592A (ja) | 1997-03-07 | 1998-09-22 | Kansai Paint Co Ltd | 塗料組成物およびその塗装法 |
| US6080297A (en) | 1996-12-06 | 2000-06-27 | Electron Transfer Technologies, Inc. | Method and apparatus for constant composition delivery of hydride gases for semiconductor processing |
| US5834371A (en) | 1997-01-31 | 1998-11-10 | Tokyo Electron Limited | Method and apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof |
| US6086837A (en) | 1997-04-24 | 2000-07-11 | Bechtel Bwxt Idaho, Llc | Method of synthesizing enriched decaborane for use in generating boron neutron capture therapy pharmaceuticals |
| US5943594A (en) | 1997-04-30 | 1999-08-24 | International Business Machines Corporation | Method for extended ion implanter source lifetime with control mechanism |
| US5851270A (en) | 1997-05-20 | 1998-12-22 | Advanced Technology Materials, Inc. | Low pressure gas source and dispensing apparatus with enhanced diffusive/extractive means |
| JPH11168221A (ja) * | 1997-10-02 | 1999-06-22 | Matsushita Electric Ind Co Ltd | トランジスタの製造方法 |
| IL136037A0 (en) | 1997-11-12 | 2001-05-20 | Nikon Corp | Exposure apparatus, apparatus for manufacturing devices, and method of manufacturing exposure apparatuses |
| US6096467A (en) | 1997-11-19 | 2000-08-01 | Mita Industrial Co., Ltd. | Positive charging color toner |
| US6406519B1 (en) | 1998-03-27 | 2002-06-18 | Advanced Technology Materials, Inc. | Gas cabinet assembly comprising sorbent-based gas storage and delivery system |
| US6660063B2 (en) | 1998-03-27 | 2003-12-09 | Advanced Technology Materials, Inc | Sorbent-based gas storage and delivery system |
| US6135128A (en) | 1998-03-27 | 2000-10-24 | Eaton Corporation | Method for in-process cleaning of an ion source |
| US6101816A (en) | 1998-04-28 | 2000-08-15 | Advanced Technology Materials, Inc. | Fluid storage and dispensing system |
| US6343476B1 (en) | 1998-04-28 | 2002-02-05 | Advanced Technology Materials, Inc. | Gas storage and dispensing system comprising regulator interiorly disposed in fluid containment vessel and adjustable in situ therein |
| US6096047A (en) * | 1998-09-03 | 2000-08-01 | Smit; Julie Ann | Gynecological cylinders which treat diseases |
| US6614082B1 (en) * | 1999-01-29 | 2003-09-02 | Micron Technology, Inc. | Fabrication of semiconductor devices with transition metal boride films as diffusion barriers |
| US6376664B1 (en) | 1999-03-17 | 2002-04-23 | The Ohio State University | Cyclic bis-benzimidazole ligands and metal complexes thereof |
| US6346452B1 (en) | 1999-05-03 | 2002-02-12 | National Semiconductor Corporation | Method for controlling an N-type dopant concentration depth profile in bipolar transistor epitaxial layers |
| US6475276B1 (en) | 1999-10-15 | 2002-11-05 | Asm Microchemistry Oy | Production of elemental thin films using a boron-containing reducing agent |
| JP4820038B2 (ja) | 1999-12-13 | 2011-11-24 | セメクイップ, インコーポレイテッド | イオン注入イオン源、システム、および方法 |
| US7838842B2 (en) | 1999-12-13 | 2010-11-23 | Semequip, Inc. | Dual mode ion source for ion implantation |
| US6772781B2 (en) | 2000-02-04 | 2004-08-10 | Air Liquide America, L.P. | Apparatus and method for mixing gases |
| DE10011274A1 (de) | 2000-03-08 | 2001-09-13 | Wolff Walsrode Ag | Plasmabehandelte bahnförmige Werkstoffe |
| WO2001075188A2 (en) | 2000-03-30 | 2001-10-11 | Tokyo Electron Limited | Method of and apparatus for gas injection |
| US6420304B1 (en) | 2000-04-20 | 2002-07-16 | China Petrochemical Development Corporation | Polymer-supported carbonylation catalyst and its use |
| JP4634569B2 (ja) * | 2000-05-25 | 2011-02-16 | 東芝モバイルディスプレイ株式会社 | イオン注入装置及び薄膜半導体装置 |
| JP2004501987A (ja) | 2000-06-19 | 2004-01-22 | キンバリー クラーク ワールドワイド インコーポレイテッド | 新規な光開始剤及びその用途 |
| JP4902088B2 (ja) | 2000-07-10 | 2012-03-21 | ティーイーエル エピオン インク. | ガスクラスターイオンビーム処理による薄膜を改良するためのシステムおよび方法 |
| KR20000072651A (ko) | 2000-08-08 | 2000-12-05 | 이관호 | 식물 신품종 쌈추 및 그 육종방법 |
| US6893907B2 (en) * | 2002-06-05 | 2005-05-17 | Applied Materials, Inc. | Fabrication of silicon-on-insulator structure using plasma immersion ion implantation |
| US7094670B2 (en) * | 2000-08-11 | 2006-08-22 | Applied Materials, Inc. | Plasma immersion ion implantation process |
| US6333272B1 (en) | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US20020058385A1 (en) * | 2000-10-26 | 2002-05-16 | Taiji Noda | Semiconductor device and method for manufacturing the same |
| MY125121A (en) | 2000-12-21 | 2006-07-31 | Petroliam Nasional Berhad | Oil filter adaptor flange |
| US6670623B2 (en) | 2001-03-07 | 2003-12-30 | Advanced Technology Materials, Inc. | Thermal regulation of an ion implantation system |
| JP2002313776A (ja) | 2001-04-19 | 2002-10-25 | Toshiba Corp | ドライエッチング方法及びドライエッチング装置 |
| JP3824058B2 (ja) * | 2001-05-23 | 2006-09-20 | 独立行政法人産業技術総合研究所 | カルボランスーパークラスターおよびその製造方法 |
| JP4353393B2 (ja) * | 2001-06-05 | 2009-10-28 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| KR100422584B1 (ko) * | 2001-06-30 | 2004-03-12 | 주식회사 하이닉스반도체 | 반도체 소자 제조방법 |
| US6835414B2 (en) | 2001-07-27 | 2004-12-28 | Unaxis Balzers Aktiengesellschaft | Method for producing coated substrates |
| US6592653B2 (en) | 2001-11-12 | 2003-07-15 | Advanced Technology Materials, Inc. | Fluid storage and delivery system utilizing low heels carbon sorbent medium |
| AU2002364611A1 (en) | 2001-12-31 | 2003-07-24 | The Ohio State University Research Foundation | Strapped and modified bis (benzimidazole) diamides for asymmetric catalysts and other applications |
| GB2387022B (en) * | 2002-03-28 | 2005-12-21 | Applied Materials Inc | Monatomic boron ion source and method |
| US7518124B2 (en) | 2002-03-28 | 2009-04-14 | Applied Materials, Inc. | Monatomic dopant ion source and method |
| US6617175B1 (en) | 2002-05-08 | 2003-09-09 | Advanced Technology Materials, Inc. | Infrared thermopile detector system for semiconductor process monitoring and control |
| US7138768B2 (en) | 2002-05-23 | 2006-11-21 | Varian Semiconductor Equipment Associates, Inc. | Indirectly heated cathode ion source |
| JP4744141B2 (ja) * | 2002-06-26 | 2011-08-10 | セムエキップ インコーポレイテッド | N及びp型クラスターイオン及び陰イオンの注入によるcmos素子の製造方法 |
| US20040002202A1 (en) * | 2002-06-26 | 2004-01-01 | Horsky Thomas Neil | Method of manufacturing CMOS devices by the implantation of N- and P-type cluster ions |
| KR100864048B1 (ko) | 2002-06-26 | 2008-10-17 | 세미이큅, 인코포레이티드 | 이온 소스 |
| US6921062B2 (en) | 2002-07-23 | 2005-07-26 | Advanced Technology Materials, Inc. | Vaporizer delivery ampoule |
| US7300038B2 (en) | 2002-07-23 | 2007-11-27 | Advanced Technology Materials, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
| US7192486B2 (en) | 2002-08-15 | 2007-03-20 | Applied Materials, Inc. | Clog-resistant gas delivery system |
| KR100464935B1 (ko) | 2002-09-17 | 2005-01-05 | 주식회사 하이닉스반도체 | 불화붕소화합물 도핑에 의한 초박형 에피채널을 갖는반도체소자의 제조 방법 |
| US6740586B1 (en) | 2002-11-06 | 2004-05-25 | Advanced Technology Materials, Inc. | Vapor delivery system for solid precursors and method of using same |
| US20040110351A1 (en) * | 2002-12-05 | 2004-06-10 | International Business Machines Corporation | Method and structure for reduction of junction capacitance in a semiconductor device and formation of a uniformly lowered threshold voltage device |
| US6743278B1 (en) | 2002-12-10 | 2004-06-01 | Advanced Technology Materials, Inc. | Gas storage and dispensing system with monolithic carbon adsorbent |
| AU2003299614A1 (en) * | 2002-12-12 | 2004-06-30 | Epion Corporation | Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation |
| US6780896B2 (en) | 2002-12-20 | 2004-08-24 | Kimberly-Clark Worldwide, Inc. | Stabilized photoinitiators and applications thereof |
| US6868869B2 (en) | 2003-02-19 | 2005-03-22 | Advanced Technology Materials, Inc. | Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases |
| US6936505B2 (en) | 2003-05-20 | 2005-08-30 | Intel Corporation | Method of forming a shallow junction |
| JP4374487B2 (ja) | 2003-06-06 | 2009-12-02 | 株式会社Sen | イオン源装置およびそのクリーニング最適化方法 |
| WO2005001869A2 (en) | 2003-06-06 | 2005-01-06 | Ionwerks | Gold implantation/deposition of biological samples for laser desorption three dimensional depth profiling of tissues |
| US6909839B2 (en) | 2003-07-23 | 2005-06-21 | Advanced Technology Materials, Inc. | Delivery systems for efficient vaporization of precursor source material |
| US7759254B2 (en) * | 2003-08-25 | 2010-07-20 | Panasonic Corporation | Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device |
| JP2005093518A (ja) * | 2003-09-12 | 2005-04-07 | Matsushita Electric Ind Co Ltd | 不純物導入の制御方法および不純物導入装置 |
| CN1894763B (zh) * | 2003-12-12 | 2010-12-08 | 山米奎普公司 | 用于在离子植入中延长设备正常运行时间的方法及装置 |
| TWI375660B (en) | 2004-01-22 | 2012-11-01 | Semequip Inc | Isotopically-enriched boranes and methods of preparing them |
| TWI372725B (en) | 2004-01-30 | 2012-09-21 | Semequip Inc | Methods of synthesis of isotopically enriched borohydride and methods of synthesis of isotopically enriched boranes |
| US8747805B2 (en) | 2004-02-11 | 2014-06-10 | Velocys, Inc. | Process for conducting an equilibrium limited chemical reaction using microchannel technology |
| EP1723667A4 (en) * | 2004-02-14 | 2009-09-09 | Tel Epion Inc | METHOD FOR THE PRODUCTION OF DOTED AND UNDOTIZED SUSTAINED SEMICONDUCTOR FILMS AND SEMICONDUCTOR FILMS BY GAS CLUSTER ION RADIATION |
| US7015108B2 (en) | 2004-02-26 | 2006-03-21 | Intel Corporation | Implanting carbon to form P-type drain extensions |
| US20050260354A1 (en) | 2004-05-20 | 2005-11-24 | Varian Semiconductor Equipment Associates, Inc. | In-situ process chamber preparation methods for plasma ion implantation systems |
| US7648682B2 (en) | 2004-07-08 | 2010-01-19 | Air Products And Chemicals, Inc. | Wick systems for complexed gas technology |
| US7397048B2 (en) | 2004-09-17 | 2008-07-08 | Varian Semiconductor Equipment Associates, Inc. | Technique for boron implantation |
| US7819981B2 (en) | 2004-10-26 | 2010-10-26 | Advanced Technology Materials, Inc. | Methods for cleaning ion implanter components |
| US7687025B2 (en) | 2004-11-12 | 2010-03-30 | The Boeing Company | Isotopic lightening |
| US20060104851A1 (en) | 2004-11-12 | 2006-05-18 | Tillotson Brian J | Isotopic densification of propellant |
| EP1787321A4 (en) * | 2004-12-03 | 2008-12-03 | Tel Epion Inc | TRAINING OF ULTRASONIC TRANSITIONS THROUGH GASCLUSTER ION RADIATION |
| US6998626B1 (en) | 2004-12-20 | 2006-02-14 | Applied Materials, Inc. | Method of producing a dopant gas species |
| US7438079B2 (en) | 2005-02-04 | 2008-10-21 | Air Products And Chemicals, Inc. | In-line gas purity monitoring and control system |
| WO2006095086A2 (fr) | 2005-03-07 | 2006-09-14 | Laurence Faure | Traçabilite des anomalies du cycle cellulaire ciblant l'oncologie et la neurodegenerescence. |
| US20100224264A1 (en) | 2005-06-22 | 2010-09-09 | Advanced Technology Materials, Inc. | Apparatus and process for integrated gas blending |
| US20070278417A1 (en) | 2005-07-01 | 2007-12-06 | Horsky Thomas N | Ion implantation ion source, system and method |
| TWI450994B (zh) | 2005-08-30 | 2014-09-01 | 尖端科技材料股份有限公司 | 利用選擇性氟化硼前驅物之硼離子植入方法,及供植入用之大群氫化硼之形成方法 |
| US20100112795A1 (en) | 2005-08-30 | 2010-05-06 | Advanced Technology Materials, Inc. | Method of forming ultra-shallow junctions for semiconductor devices |
| DE102005054218B4 (de) * | 2005-11-14 | 2011-06-09 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterelements und Halbleiterelement |
| CN101313395B (zh) | 2005-12-09 | 2013-03-27 | 山米奎普公司 | 通过植入碳团簇制造半导体装置的系统和方法 |
| US20070178679A1 (en) | 2006-01-28 | 2007-08-02 | Varian Semiconductor Equipment Associates, Inc. | Methods of implanting ions and ion sources used for same |
| US7473606B2 (en) * | 2006-02-22 | 2009-01-06 | United Microelectronics Corp. | Method for fabricating metal-oxide semiconductor transistors |
| KR101467585B1 (ko) | 2006-04-26 | 2014-12-01 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 반도체 공정 시스템의 세정 |
| WO2007134183A2 (en) | 2006-05-13 | 2007-11-22 | Advanced Technology Materials, Inc. | Chemical reagent delivery system utilizing ionic liquid storage medium |
| US8013312B2 (en) | 2006-11-22 | 2011-09-06 | Semequip, Inc. | Vapor delivery system useful with ion sources and vaporizer for use in such system |
| US7919402B2 (en) | 2006-12-06 | 2011-04-05 | Semequip, Inc. | Cluster ion implantation for defect engineering |
| US7732309B2 (en) | 2006-12-08 | 2010-06-08 | Applied Materials, Inc. | Plasma immersed ion implantation process |
| US7887634B2 (en) * | 2006-12-22 | 2011-02-15 | Infineon Technologies Ag | Method of producing a semiconductor element and semiconductor element |
| US7833886B2 (en) * | 2007-05-14 | 2010-11-16 | Infineon Technologies Ag | Method of producing a semiconductor element in a substrate |
| US20080305598A1 (en) | 2007-06-07 | 2008-12-11 | Horsky Thomas N | Ion implantation device and a method of semiconductor manufacturing by the implantation of ions derived from carborane molecular species |
| CN103922359A (zh) | 2007-11-02 | 2014-07-16 | 塞门库普公司 | 簇硼的制造方法 |
| EP2283509A1 (en) * | 2008-05-30 | 2011-02-16 | Axcelis Technologies, Inc. | Control of particles on semiconductor wafers when implanting boron hydrides |
| US7759657B2 (en) * | 2008-06-19 | 2010-07-20 | Axcelis Technologies, Inc. | Methods for implanting B22Hx and its ionized lower mass byproducts |
| US7947582B2 (en) | 2009-02-27 | 2011-05-24 | Tel Epion Inc. | Material infusion in a trap layer structure using gas cluster ion beam processing |
| US9627180B2 (en) | 2009-10-01 | 2017-04-18 | Praxair Technology, Inc. | Method for ion source component cleaning |
| US8237136B2 (en) | 2009-10-08 | 2012-08-07 | Tel Epion Inc. | Method and system for tilting a substrate during gas cluster ion beam processing |
| US8138071B2 (en) * | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8598022B2 (en) * | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8796131B2 (en) * | 2009-10-27 | 2014-08-05 | Advanced Technology Materials, Inc. | Ion implantation system and method |
| US8062965B2 (en) * | 2009-10-27 | 2011-11-22 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8187971B2 (en) | 2009-11-16 | 2012-05-29 | Tel Epion Inc. | Method to alter silicide properties using GCIB treatment |
| US20110143527A1 (en) | 2009-12-14 | 2011-06-16 | Varian Semiconductor Equipment Associates, Inc. | Techniques for generating uniform ion beam |
| JP5714831B2 (ja) | 2010-03-18 | 2015-05-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5908476B2 (ja) | 2010-08-30 | 2016-04-26 | インテグリス・インコーポレーテッド | 固体材料から化合物又はその中間体を調製するための装置及び方法並びにそのような化合物及び中間体の使用 |
| US9984855B2 (en) | 2010-11-17 | 2018-05-29 | Axcelis Technologies, Inc. | Implementation of co-gases for germanium and boron ion implants |
| TWI583442B (zh) * | 2011-10-10 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | B2f4之製造程序 |
| EP2815424B1 (en) * | 2012-02-14 | 2017-08-16 | Entegris Inc. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
| US9831063B2 (en) * | 2013-03-05 | 2017-11-28 | Entegris, Inc. | Ion implantation compositions, systems, and methods |
-
2006
- 2006-08-30 TW TW100104820A patent/TWI450994B/zh active
- 2006-08-30 KR KR1020087007729A patent/KR101297917B1/ko active Active
- 2006-08-30 US US12/065,503 patent/US7943204B2/en active Active
- 2006-08-30 SG SG201006261-0A patent/SG165321A1/en unknown
- 2006-08-30 CN CN201310020125.6A patent/CN103170447B/zh active Active
- 2006-08-30 TW TW104130806A patent/TWI603916B/zh active
- 2006-08-30 CN CN2006800386227A patent/CN101291742B/zh active Active
- 2006-08-30 KR KR1020127004010A patent/KR101297964B1/ko active Active
- 2006-08-30 SG SG2014011944A patent/SG2014011944A/en unknown
- 2006-08-30 EP EP06813979.9A patent/EP1933992B1/en not_active Not-in-force
- 2006-08-30 TW TW095131950A patent/TWI476292B/zh not_active IP Right Cessation
- 2006-08-30 WO PCT/US2006/033899 patent/WO2007027798A2/en not_active Ceased
- 2006-08-30 EP EP14179325.7A patent/EP2813294A1/en not_active Withdrawn
- 2006-08-30 JP JP2008529239A patent/JP5591470B2/ja active Active
- 2006-08-30 TW TW103126617A patent/TWI520905B/zh not_active IP Right Cessation
-
2010
- 2010-10-27 US US12/913,757 patent/US8389068B2/en active Active
-
2012
- 2012-12-26 US US13/726,826 patent/US9455147B2/en active Active
-
2014
- 2014-01-06 JP JP2014000137A patent/JP6234230B2/ja active Active
-
2015
- 2015-12-17 JP JP2015246461A patent/JP2016042601A/ja active Pending
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5591470B2 (ja) | 代替フッ化ホウ素前駆体を使用するホウ素イオン注入および注入のための大きな水素化ホウ素の形成 | |
| JP6204438B2 (ja) | 同位体濃縮ホウ素含有化合物、およびその製造方法と使用方法 | |
| US9685304B2 (en) | Isotopically-enriched boron-containing compounds, and methods of making and using same | |
| CN107578972A (zh) | 用于提高离子注入系统中的离子源的寿命和性能的方法和设备 | |
| KR20140102173A (ko) | 자가세척 기능을 갖는 다원자성 붕소 분자 이온 빔의 연속적인 생산방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090831 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090831 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090928 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110204 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120711 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120724 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121002 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121010 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130122 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131203 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131210 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140106 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140701 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140730 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5591470 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |