JPS6483147A - Manufacture of chemical sensitivity field effect transistor - Google Patents
Manufacture of chemical sensitivity field effect transistorInfo
- Publication number
- JPS6483147A JPS6483147A JP24228387A JP24228387A JPS6483147A JP S6483147 A JPS6483147 A JP S6483147A JP 24228387 A JP24228387 A JP 24228387A JP 24228387 A JP24228387 A JP 24228387A JP S6483147 A JPS6483147 A JP S6483147A
- Authority
- JP
- Japan
- Prior art keywords
- film
- isfet
- field effect
- effect transistor
- permeate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To obtain a chemical sensitivity field effect transistor (ISFET) having excellent dielectric strength and stability, by a method wherein a hydrophobic organic macromolecular film not allowing a charge such as an ion to permeate and having excellent water resistance is formed in a destructed part of a protection film. CONSTITUTION:The whole surfaces of a source region 2 and a drain region 3 formed by phosphorus diffusion on a P-type silicon substrate 1 processed minutely by anisotropic etching are covered, except lead contact parts 2a and 3a, with a silicon oxide film 4 as an insulation film not allowing an ion to permeate and with a silicon nitride film 5 as a protection film. Then, a lead wire is connected to a source contact part of ISFET, and this ISFET is made to operate as a working electrode, with a platinum used as the opposite electrode, in an electrolytic polymerization solution (e.g. a solution prepared by dissolving a styrene monomer and tetraethylammonium tetrafluoroboron in a mixed solvent of acetonitrile and toluene). Thereby an electrolytically polymerized film 9 is formed in a destructed corner part of the insulation film 4, so as to improve the dielectric strength.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24228387A JPS6483147A (en) | 1987-09-25 | 1987-09-25 | Manufacture of chemical sensitivity field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24228387A JPS6483147A (en) | 1987-09-25 | 1987-09-25 | Manufacture of chemical sensitivity field effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6483147A true JPS6483147A (en) | 1989-03-28 |
Family
ID=17086954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24228387A Pending JPS6483147A (en) | 1987-09-25 | 1987-09-25 | Manufacture of chemical sensitivity field effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6483147A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138251A (en) * | 1989-10-04 | 1992-08-11 | Olympus Optical Co., Ltd. | Fet sensor apparatus of flow-cell adaptive type and method of manufacturing the same |
WO2005012896A1 (en) * | 2003-07-30 | 2005-02-10 | Micronas Gmbh | Capacitively controlled field effect transistor gas sensor comprising a hydrophobic layer |
US8138071B2 (en) | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US8779383B2 (en) | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
US9012874B2 (en) | 2010-02-26 | 2015-04-21 | Entegris, Inc. | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
US9205392B2 (en) | 2010-08-30 | 2015-12-08 | Entegris, Inc. | Apparatus and method for preparation of compounds or intermediates thereof from a solid material, and using such compounds and intermediates |
US9455147B2 (en) | 2005-08-30 | 2016-09-27 | Entegris, Inc. | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
US9938156B2 (en) | 2011-10-10 | 2018-04-10 | Entegris, Inc. | B2F4 manufacturing process |
US9960042B2 (en) | 2012-02-14 | 2018-05-01 | Entegris Inc. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
US10497569B2 (en) | 2009-07-23 | 2019-12-03 | Entegris, Inc. | Carbon materials for carbon implantation |
US11062906B2 (en) | 2013-08-16 | 2021-07-13 | Entegris, Inc. | Silicon implantation in substrates and provision of silicon precursor compositions therefor |
-
1987
- 1987-09-25 JP JP24228387A patent/JPS6483147A/en active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138251A (en) * | 1989-10-04 | 1992-08-11 | Olympus Optical Co., Ltd. | Fet sensor apparatus of flow-cell adaptive type and method of manufacturing the same |
WO2005012896A1 (en) * | 2003-07-30 | 2005-02-10 | Micronas Gmbh | Capacitively controlled field effect transistor gas sensor comprising a hydrophobic layer |
US9455147B2 (en) | 2005-08-30 | 2016-09-27 | Entegris, Inc. | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
US10497569B2 (en) | 2009-07-23 | 2019-12-03 | Entegris, Inc. | Carbon materials for carbon implantation |
US8138071B2 (en) | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US9142387B2 (en) | 2009-10-27 | 2015-09-22 | Entegris, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US9685304B2 (en) | 2009-10-27 | 2017-06-20 | Entegris, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
US8779383B2 (en) | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
US9012874B2 (en) | 2010-02-26 | 2015-04-21 | Entegris, Inc. | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
US9171725B2 (en) | 2010-02-26 | 2015-10-27 | Entegris, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
US9754786B2 (en) | 2010-02-26 | 2017-09-05 | Entegris, Inc. | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
US9205392B2 (en) | 2010-08-30 | 2015-12-08 | Entegris, Inc. | Apparatus and method for preparation of compounds or intermediates thereof from a solid material, and using such compounds and intermediates |
US9764298B2 (en) | 2010-08-30 | 2017-09-19 | Entegris, Inc. | Apparatus and method for preparation of compounds or intermediates thereof from a solid material, and using such compounds and intermediates |
US9938156B2 (en) | 2011-10-10 | 2018-04-10 | Entegris, Inc. | B2F4 manufacturing process |
US9960042B2 (en) | 2012-02-14 | 2018-05-01 | Entegris Inc. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
US10354877B2 (en) | 2012-02-14 | 2019-07-16 | Entegris, Inc. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
US11062906B2 (en) | 2013-08-16 | 2021-07-13 | Entegris, Inc. | Silicon implantation in substrates and provision of silicon precursor compositions therefor |
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