JP5584754B2 - 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ） - Google Patents

磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ） Download PDF

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JP5584754B2
JP5584754B2 JP2012506175A JP2012506175A JP5584754B2 JP 5584754 B2 JP5584754 B2 JP 5584754B2 JP 2012506175 A JP2012506175 A JP 2012506175A JP 2012506175 A JP2012506175 A JP 2012506175A JP 5584754 B2 JP5584754 B2 JP 5584754B2
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layer
pinned layer
mtj
electrode
pinned
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JP2012524415A (ja
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シャオチュン・ジュウ
マシュー・ノワック
シア・リ
スン・エイチ・カン
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クアルコム，インコーポレイテッド
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1659—Cell access
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
JP2012506175A 2009-04-14 2010-04-14 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ） Expired - Fee Related JP5584754B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/423,298 2009-04-14
US12/423,298 US8344433B2 (en) 2009-04-14 2009-04-14 Magnetic tunnel junction (MTJ) and methods, and magnetic random access memory (MRAM) employing same
PCT/US2010/031080 WO2010120918A2 (en) 2009-04-14 2010-04-14 Magnetic tunnel junction (mtj) and methods, and magnetic random access memory (mram) employing same

Related Child Applications (1)

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JP2014085714A Division JP5710821B2 (ja) 2009-04-14 2014-04-17 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ）

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JP2012524415A JP2012524415A (ja) 2012-10-11
JP5584754B2 true JP5584754B2 (ja) 2014-09-03

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JP2012506175A Expired - Fee Related JP5584754B2 (ja) 2009-04-14 2010-04-14 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ）
JP2014085714A Expired - Fee Related JP5710821B2 (ja) 2009-04-14 2014-04-17 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ）
JP2015042183A Expired - Fee Related JP6196250B2 (ja) 2009-04-14 2015-03-04 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ）

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JP2015042183A Expired - Fee Related JP6196250B2 (ja) 2009-04-14 2015-03-04 磁気トンネル接合（ｍｔｊ）および方法、およびこれらを使用する磁気ランダムアクセスメモリ（ｍｒａｍ）

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US (2) US8344433B2 (enExample)
EP (1) EP2419933B1 (enExample)
JP (3) JP5584754B2 (enExample)
KR (1) KR101390940B1 (enExample)
CN (2) CN107093449B (enExample)
BR (1) BRPI1013772B1 (enExample)
ES (1) ES2487627T3 (enExample)
TW (1) TWI474472B (enExample)
WO (1) WO2010120918A2 (enExample)

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Publication number Publication date
EP2419933B1 (en) 2014-06-18
US20100258887A1 (en) 2010-10-14
BRPI1013772A2 (pt) 2016-04-05
KR101390940B1 (ko) 2014-05-02
CN107093449B (zh) 2021-04-09
JP6196250B2 (ja) 2017-09-13
JP2012524415A (ja) 2012-10-11
TW201106468A (en) 2011-02-16
CN102388454A (zh) 2012-03-21
EP2419933A4 (en) 2013-04-03
ES2487627T3 (es) 2014-08-22
JP2014146840A (ja) 2014-08-14
CN107093449A (zh) 2017-08-25
JP2015109480A (ja) 2015-06-11
JP5710821B2 (ja) 2015-04-30
TWI474472B (zh) 2015-02-21
US20130134533A1 (en) 2013-05-30
CN102388454B (zh) 2016-11-02
US8889431B2 (en) 2014-11-18
EP2419933A2 (en) 2012-02-22
KR20120006056A (ko) 2012-01-17
BRPI1013772B1 (pt) 2019-10-29
WO2010120918A3 (en) 2011-01-20
WO2010120918A2 (en) 2010-10-21
US8344433B2 (en) 2013-01-01

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