JP5513384B2 - 半導体製作に適した表面に改質するための組成物及び方法 - Google Patents

半導体製作に適した表面に改質するための組成物及び方法 Download PDF

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Publication number
JP5513384B2
JP5513384B2 JP2010521062A JP2010521062A JP5513384B2 JP 5513384 B2 JP5513384 B2 JP 5513384B2 JP 2010521062 A JP2010521062 A JP 2010521062A JP 2010521062 A JP2010521062 A JP 2010521062A JP 5513384 B2 JP5513384 B2 JP 5513384B2
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Prior art keywords
abrasive
wafer
article
abrasive article
binder
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Japanese (ja)
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JP2010537404A (ja
JP2010537404A5 (enExample
Inventor
ハーディ，エル．チャールズ
ケー． クランツ，ヘザー
イー． ウッド，トーマス
エー． カイサキ，デイビッド
ジェイ． ガグリアルディ，ジョン
シー． クラーク，ジョン
エム． サブ，パトリシア
ジー． クラーク，フィリップ
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010521062A 2007-08-15 2008-07-08 半導体製作に適した表面に改質するための組成物及び方法 Active JP5513384B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/839,329 US8092707B2 (en) 1997-04-30 2007-08-15 Compositions and methods for modifying a surface suited for semiconductor fabrication
US11/839,329 2007-08-15
PCT/US2008/069396 WO2009023387A2 (en) 2007-08-15 2008-07-08 Compositions and methods for modifying a surface suited for semiconductor fabrication

Publications (3)

Publication Number Publication Date
JP2010537404A JP2010537404A (ja) 2010-12-02
JP2010537404A5 JP2010537404A5 (enExample) 2011-08-04
JP5513384B2 true JP5513384B2 (ja) 2014-06-04

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JP2010521062A Active JP5513384B2 (ja) 2007-08-15 2008-07-08 半導体製作に適した表面に改質するための組成物及び方法

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US (2) US8092707B2 (enExample)
EP (1) EP2186121B1 (enExample)
JP (1) JP5513384B2 (enExample)
KR (1) KR101494034B1 (enExample)
CN (1) CN101779274B (enExample)
TW (1) TWI460261B (enExample)
WO (1) WO2009023387A2 (enExample)

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