TW303487B - - Google Patents

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Publication number
TW303487B
TW303487B TW085105672A TW85105672A TW303487B TW 303487 B TW303487 B TW 303487B TW 085105672 A TW085105672 A TW 085105672A TW 85105672 A TW85105672 A TW 85105672A TW 303487 B TW303487 B TW 303487B
Authority
TW
Taiwan
Prior art keywords
polishing
wafer
crystal
peripheral
rod
Prior art date
Application number
TW085105672A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shinetsu Handotai Co Ltd
Naoetsu Denshi Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Co Ltd, Naoetsu Denshi Kogyo Kk filed Critical Shinetsu Handotai Co Ltd
Application granted granted Critical
Publication of TW303487B publication Critical patent/TW303487B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW085105672A 1995-05-29 1996-05-14 TW303487B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15381395 1995-05-29

Publications (1)

Publication Number Publication Date
TW303487B true TW303487B (enExample) 1997-04-21

Family

ID=15570671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105672A TW303487B (enExample) 1995-05-29 1996-05-14

Country Status (4)

Country Link
EP (1) EP0745456B1 (enExample)
KR (1) KR960043006A (enExample)
DE (1) DE69615273T2 (enExample)
TW (1) TW303487B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
JP2001007064A (ja) * 1999-06-17 2001-01-12 Sumitomo Metal Ind Ltd 半導体ウエーハの研削方法
JP4034096B2 (ja) * 2002-03-19 2008-01-16 日本碍子株式会社 半導体支持装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer
JP3027882B2 (ja) * 1992-07-31 2000-04-04 信越半導体株式会社 ウエーハ面取部研磨装置
JP2798347B2 (ja) * 1993-07-08 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP2832138B2 (ja) * 1993-09-30 1998-12-02 信越半導体株式会社 ウェーハ外周部の研磨装置
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
JPH07171749A (ja) * 1993-12-20 1995-07-11 Shin Etsu Handotai Co Ltd ウェーハ外周部の研磨装置
JPH08168946A (ja) * 1994-12-13 1996-07-02 Shin Etsu Handotai Co Ltd ウェーハ外周部の研磨装置

Also Published As

Publication number Publication date
DE69615273D1 (de) 2001-10-25
EP0745456B1 (en) 2001-09-19
DE69615273T2 (de) 2002-06-27
EP0745456A1 (en) 1996-12-04
KR960043006A (ko) 1996-12-21

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