CN105710760A - 一种铝合金碱性研磨液 - Google Patents
一种铝合金碱性研磨液 Download PDFInfo
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- CN105710760A CN105710760A CN201610257378.9A CN201610257378A CN105710760A CN 105710760 A CN105710760 A CN 105710760A CN 201610257378 A CN201610257378 A CN 201610257378A CN 105710760 A CN105710760 A CN 105710760A
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- Prior art keywords
- aluminium alloy
- sodium
- acid
- alloy alkaline
- grinding
- Prior art date
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Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 32
- 239000012530 fluid Substances 0.000 title abstract 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000314 lubricant Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003112 inhibitor Substances 0.000 claims abstract description 5
- 239000002002 slurry Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 14
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- -1 Methylene phosphonic acid Chemical compound 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 7
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 150000007530 organic bases Chemical class 0.000 claims description 7
- 229910052708 sodium Inorganic materials 0.000 claims description 7
- 239000011734 sodium Substances 0.000 claims description 7
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000004115 Sodium Silicate Substances 0.000 claims description 6
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- 239000004141 Sodium laurylsulphate Substances 0.000 claims description 5
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 5
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 5
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 4
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 4
- 229920000053 polysorbate 80 Polymers 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical compound [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- 239000004471 Glycine Substances 0.000 claims description 3
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 3
- 239000004317 sodium nitrate Substances 0.000 claims description 3
- 235000010344 sodium nitrate Nutrition 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 claims description 3
- BPSYZMLXRKCSJY-UHFFFAOYSA-N 1,3,2-dioxaphosphepan-2-ium 2-oxide Chemical compound O=[P+]1OCCCCO1 BPSYZMLXRKCSJY-UHFFFAOYSA-N 0.000 claims description 2
- QILXPCHTWXAUHE-UHFFFAOYSA-N [Na].NCCN Chemical compound [Na].NCCN QILXPCHTWXAUHE-UHFFFAOYSA-N 0.000 claims description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 2
- 235000015393 sodium molybdate Nutrition 0.000 claims description 2
- 239000011684 sodium molybdate Substances 0.000 claims description 2
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 2
- 235000009508 confectionery Nutrition 0.000 claims 1
- 230000018044 dehydration Effects 0.000 claims 1
- 238000006297 dehydration reaction Methods 0.000 claims 1
- 239000003599 detergent Substances 0.000 claims 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 claims 1
- 229940031098 ethanolamine Drugs 0.000 claims 1
- 239000000244 polyoxyethylene sorbitan monooleate Substances 0.000 claims 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 239000008367 deionised water Substances 0.000 abstract description 4
- 229910021641 deionized water Inorganic materials 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000002738 chelating agent Substances 0.000 abstract description 3
- 239000003513 alkali Substances 0.000 abstract description 2
- 239000007900 aqueous suspension Substances 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000012752 auxiliary agent Substances 0.000 abstract 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 159000000000 sodium salts Chemical class 0.000 abstract 1
- 230000002195 synergetic effect Effects 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- 229940120146 EDTMP Drugs 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- JHJUUEHSAZXEEO-UHFFFAOYSA-M sodium;4-dodecylbenzenesulfonate Chemical group [Na+].CCCCCCCCCCCCC1=CC=C(S([O-])(=O)=O)C=C1 JHJUUEHSAZXEEO-UHFFFAOYSA-M 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 description 1
- HLLSOEKIMZEGFV-UHFFFAOYSA-N 4-(dibutylsulfamoyl)benzoic acid Chemical compound CCCCN(CCCC)S(=O)(=O)C1=CC=C(C(O)=O)C=C1 HLLSOEKIMZEGFV-UHFFFAOYSA-N 0.000 description 1
- 229920002907 Guar gum Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- MOFINMJRLYEONQ-UHFFFAOYSA-N [N].C=1C=CNC=1 Chemical class [N].C=1C=CNC=1 MOFINMJRLYEONQ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- WMGSQTMJHBYJMQ-UHFFFAOYSA-N aluminum;magnesium;silicate Chemical compound [Mg+2].[Al+3].[O-][Si]([O-])([O-])[O-] WMGSQTMJHBYJMQ-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000010668 complexation reaction Methods 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000665 guar gum Substances 0.000 description 1
- 235000010417 guar gum Nutrition 0.000 description 1
- 229960002154 guar gum Drugs 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- CYRABWNJVURXFA-UHFFFAOYSA-N methylphosphonic acid;sodium Chemical compound [Na].CP(O)(O)=O CYRABWNJVURXFA-UHFFFAOYSA-N 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004302 potassium sorbate Substances 0.000 description 1
- 235000010241 potassium sorbate Nutrition 0.000 description 1
- 229940069338 potassium sorbate Drugs 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Lubricants (AREA)
Abstract
本发明涉及一种铝合金碱性研磨液,其中研磨液为水悬浮液,包括如下质量百分比的组分:氧化铝5~25%;螯合剂0.25~2%;金属缓蚀剂0.1~1%;分散剂0.01~0.5%;润滑剂0.05~2%;研磨助剂0.1~1%;有机碱调节剂,其pH值为8.5?10;余量为去离子水。本发明采用有机膦酸及其钠盐作为研磨助剂,它与普通螯合剂复配使用时,可表现理想的协同效果,同时它也可以作为缓蚀剂,在增强研磨速率的同时又保证了铝合金的表面质量。本发明的研磨组合物,特别适用于铝合金外壳的研磨,它具备切削力大、研磨后表面质量好、平整度高、易清洗等优点。
Description
技术领域
本发明属于材料技术领域,具体涉及一种铝合金碱性研磨液。
背景技术
目前铝合金已成为3C产品最主要外壳材料之一,它具备强度高、导热性好、易加工成型及电磁屏蔽等优点,可以满足3C产品发展要求。虽然铝合金作为外壳材料能源消耗较大,但其造成的环境污染及材料再回收利用等方面均优于塑料外壳。特别是近年来,铝合金材料已大量应用于手机外壳。
铝合金外壳要获得超光滑无损伤的表面,通常采用化学机械抛光(CMP)的方法,即化学作用与机械作用相结合的方法。CMP研磨液可分为酸性、碱性两种。目前工业生产中,多采用酸性研磨液,但酸性研磨液易造成环境污染,且研磨后清洗困难,还会腐蚀设备,所以碱性研磨液是目前发展的一大趋势。本发明采用有机碱调节pH值,不但能够防止由于无机碱调节带来的金属离子污染,而且它还可以与金属离子发生络合反应生成大分子量的胺盐,随着机械作用脱离铝合金表面,从而增强去除速率。而现有的碱性研磨液中往往需要加入氧化剂来提高去除速率,而在碱性条件下,常用的氧化剂(双氧水)极不稳定,易分解,导致研磨液品质下降。本产品无需添加氧化剂,采用普通螯合剂与有机膦酸复配,其中有机膦酸不但对金属离子有着优异的螯合能力,同时它也是一种缓蚀剂,在增加去除速率的同时又保证了金属的表面质量,而且复配使用时可表现出理想的协同作用。
铝合金外壳超精密加工一般采用两步或多步,即研磨-抛光-精抛。本发明适用于研磨工序,研磨主要是为了去除铝合金表面的较深的刀纹和表面缺陷。
发明内容
本发明所要解决的技术问题在于,提供一种铝合金表面加工专用碱性研磨液,以解决现有技术中存在的不足,如磨削力不够、表面质量差(损伤、化学腐蚀、划痕)、环境污染严重等缺点。
本发明解决上述技术问题的技术方案为:提供一种铝合金碱性研磨液,所述研磨液为水悬浮液,包括如下质量百分比的组分:
本发明中所述氧化铝粉颗粒大小为4~6μm。
本发明中所述螯合剂为柠檬酸、酒石酸、丁二酸、乙二胺四乙酸、葡萄糖酸、甘氨酸,羟乙基乙二胺三乙酸其中一种。螯合剂能与配位金属离子形成环状结构,金属离子取代配位原子上的氢(或钠)而进入螯合环中,形成络合物,络合后中心金属离子即失去其原有游离金属离子性质,在机械作用下,进入研磨液中,随着研磨液的流动离开金属表面,达到去除的效果。
本发明中所述金属缓蚀剂为六次甲基四胺、硅酸钠、苯并三氮唑、偏硅酸钠、硫脲、钼酸钠、钨酸钠、十二烷基硫酸钠、硝酸钠其中至少一种。缓蚀剂主要作用是减缓有机碱对铝合金表面的腐蚀(防止过度腐蚀),同时还可以保持铝合金原有的物理机械性能。
本发明中所述分散剂为十二烷基苯磺酸钠、十二烷基硫酸钠、辛基酚聚氧乙烯醚、六偏磷酸钠、聚丙烯酸铵、三聚磷酸钠等其中至少一种。分散剂可以促进氧化铝颗粒均匀分散于去离子水中,形成稳定悬浮液,防止磨料团聚。而且有些分散剂在研磨的过程中,可以在金属表面形成一层薄膜,有效的“隔离”了磨料与工件的直接接触,便于后阶段清洗。
本发明中所述润滑剂为甘油、聚乙二醇400及吐温-80其中一种。润滑剂主要是防止在研磨过程中机械作用过大,工件出现损伤。可与分散剂复配使用,效果更佳。
本发明中所述有机碱调节剂为乙醇胺、三乙醇胺、乙二胺、羟乙基乙二胺、四甲基氢氧化铵其中一种,研磨液pH值为8.5-10。采用有机碱调节pH值,不但能够防止由无机碱调节带来的金属离子污染,还能与金属离子发生络合反应生成大分子量的胺盐,随着机械作用脱离铝合金表面,从而增强研磨速率。
本发明中所述研磨助剂为乙二胺四亚甲基膦酸、乙二胺四亚甲基膦酸钠、羟基乙叉二膦酸、羟基乙叉二膦酸二钠、氨基三亚甲基膦酸、氨基三亚甲基膦酸四钠其中一种。采用有机磷酸及其盐类作为螯合剂辅助剂有以下优点:第一,它能与多种金属离子形成稳定的络合物,可以溶解金属表面的氧化物;第二,它具有一定的悬浮分散能力,有助于氧化铝颗粒更好的分散于去离子水中,第三,它同时也是一种缓蚀剂,可以保护金属表面;第四,与其他螯合剂复配使用时,表现出理想的协同效应;第五,稳定性好,不易水解,易生物降解。
具体实施方式
下面将结合实施例,对本发明实施例中的技术方案进行清楚、完整地描述。
在本发明提供的较佳实施例中,铝合金碱性盖板研磨液为水悬浮液,包括如下质量百分比的组分:
在本发明提供的另一较佳实施例中,所述研磨液具有上述质量百分比的组分,特别的是所述氧化铝颗粒的尺寸为4~6微米。另外,所述氧化铝优选的质量百分比为10~20%。
在本发明提供的另一较佳实施例中,所述螯合剂为柠檬酸、酒石酸、丁二酸、乙二胺四乙酸、葡萄糖酸、甘氨酸,羟乙基乙二胺三乙酸其中一种。所述螯合剂优选的质量百分比为0.5~1.5%。
在本发明提供的另一较佳实施例中,所述金属缓蚀剂为六次甲基四胺、硅酸钠、苯并三氮唑、偏硅酸钠、硫脲、钼酸钠、钨酸钠、十二烷基硫酸钠、硝酸钠其中至少一种。所述金属缓蚀剂优选的质量百分比为0.1~0.5%。
在本发明提供的另一较佳实施例中,所述分散剂为十二烷基苯磺酸钠、十二烷基硫酸钠、辛基酚聚氧乙烯醚、六偏磷酸钠、聚丙烯酸铵、三聚磷酸钠等其中至少一种。所述分散剂优选的质量百分比为0.01%~0.2%。
在本发明提供的另一较佳实施例中,所述润滑剂为甘油,聚乙二醇400及吐温-80其中一种。所述润滑剂优选的质量百分比为0.5~1%。
在本发明提供的另一较佳实施例中,所述研磨助剂为乙二胺四亚甲基膦酸、乙二胺四亚甲基膦酸钠、羟基乙叉二膦酸、羟基乙叉二膦酸二钠、氨基三亚甲基膦酸、氨基三亚甲基膦酸四钠其中一种。所述研磨助剂优选的质量百分比为0.1~0.5%。
在本发明提供的另一较佳实施例中,所述有机碱调节剂为乙醇胺、三乙醇胺、乙二胺、羟乙基乙二胺、四甲基氢氧化铵其中一种,优先pH值为8.5~9.5。
研磨组合物还可以含有下述物质作为其他添加剂组分:增稠剂,例如黄原胶、硅酸镁铝、瓜尔胶、海藻酸钠;防腐剂,例如卡松、苯甲酸钠、山梨酸钾;消泡剂,例如聚醚或甲基硅油。这些其他添加组分的含量可以根据抛研磨组合物所用的通常方法来确定。
实施例1-6
在机械搅拌作用下,将氧化铝粉加入至去离子水中分散,然后依次加入螯合剂、金属缓蚀剂、分散剂、润滑剂、研磨助剂,并使用有机碱调节pH值,其中具体配比见表1。
表1.实施例1-6中各组分配比
研磨对比试验:
使用本发明实施例1-6的铝合金研磨液、对比例1-2(市售研磨液),对铝合金外壳进行机化学机械研磨。研磨工艺:压力8.5kg/片,流量60mL/min,转速30rpm,时间6min。研磨评价标准:
(1)去除速率
研磨完成后,用清洗剂对铝合金外壳进行超声清洗和干燥,然后检测铝合金的表面质量与研磨速率。用电子千分尺和精密天平测量研磨前后的厚度差与质量差,综合评价去除速率;
(2)研磨后表面质量
采用目测法,检测研磨后的铝合金外壳表面质量,评价标准如下:
1级,表面有明显划痕、化学腐蚀、上道工序留下刀纹等;
2级,表面有轻微划痕,不影响下道工序进行;
3级,表面光滑,完好。
试验结果如表2所示:
表2.实施例及对比例的实验结果
显然,上面描述的仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
Claims (9)
1.铝合金碱性研磨液,其特征在于,所述研磨液为水悬浮液,包括如下质量百分比的组分:
2.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述氧化铝粉颗粒大小为4~6um。
3.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述螯合剂为柠檬酸、酒石酸、丁二酸、乙二胺四乙酸(EDTA)、葡萄糖酸、甘氨酸,羟乙基乙二胺三乙酸(HEDTA)其中一种。
4.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述金属缓蚀剂为六次甲基四胺、硅酸钠、苯并三氮唑(BTA)、偏硅酸钠、硫脲、钼酸钠、钨酸钠、十二烷基硫酸钠(SDS)、硝酸钠其中至少一种。
5.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述分散剂为十二烷基苯磺酸钠(SDBS)、十二烷基硫酸钠(SDS)、辛基酚聚氧乙烯醚(X-100)、六偏磷酸钠(SHMP)、聚丙烯酸铵(PAA-NH4)、三聚磷酸钠等其中至少一种。
6.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述润滑剂为丙三醇(甘油),聚乙二醇400及聚氧乙烯脱水山梨醇单油酸酯(吐温-80)其中一种。
7.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述研磨助剂为乙二胺四亚甲基膦酸(EDTMP)、乙二胺四亚甲基膦酸钠(EDTMPS)、羟基乙叉二膦酸(HEDP)、羟基乙叉二膦酸二钠(HEDP·2Na)、氨基三亚甲基膦酸(ATMP)、氨基三亚甲基膦酸四钠(ATMP·4Na)其中一种。
8.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述有机碱调节剂为乙醇胺、三乙醇胺、乙二胺、羟乙基乙二胺、四甲基氢氧化铵其中一种。
9.根据权利要求1所述的铝合金碱性研磨液,其特征在于,所述研磨液pH值为8.5~10。
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