JP5207968B2 - 電子工学の製造分野での錫−銀ハンダ・バンプ - Google Patents

電子工学の製造分野での錫−銀ハンダ・バンプ Download PDF

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Publication number
JP5207968B2
JP5207968B2 JP2008527028A JP2008527028A JP5207968B2 JP 5207968 B2 JP5207968 B2 JP 5207968B2 JP 2008527028 A JP2008527028 A JP 2008527028A JP 2008527028 A JP2008527028 A JP 2008527028A JP 5207968 B2 JP5207968 B2 JP 5207968B2
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electrolytic plating
bath
substituted
plating composition
plating
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Japanese (ja)
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JP2009510255A5 (https=
JP2009510255A (ja
Inventor
リチャードソン，トーマス，ビー．
クラインフェルト，マーリース
リートマン，クリスチャン
ザワリン，イゴール
シュタイニウス，オルトルート
チャン，ユン
アビス，ジョセフ，エー．
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エンソン インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP2008527028A 2005-08-15 2006-08-14 電子工学の製造分野での錫−銀ハンダ・バンプ Active JP5207968B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US70832805P 2005-08-15 2005-08-15
US60/708,328 2005-08-15
US11/463,355 2006-08-09
US11/463,355 US7713859B2 (en) 2005-08-15 2006-08-09 Tin-silver solder bumping in electronics manufacture
PCT/US2006/031618 WO2007022075A2 (en) 2005-08-15 2006-08-14 Tin-silver solder bumping in electronics manufacture

Publications (3)

Publication Number Publication Date
JP2009510255A JP2009510255A (ja) 2009-03-12
JP2009510255A5 JP2009510255A5 (https=) 2009-09-24
JP5207968B2 true JP5207968B2 (ja) 2013-06-12

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JP2008527028A Active JP5207968B2 (ja) 2005-08-15 2006-08-14 電子工学の製造分野での錫−銀ハンダ・バンプ

Country Status (7)

Country Link
US (1) US7713859B2 (https=)
EP (1) EP1946362B1 (https=)
JP (1) JP5207968B2 (https=)
KR (1) KR101361305B1 (https=)
CN (1) CN101622701B (https=)
AT (1) ATE541306T1 (https=)
WO (1) WO2007022075A2 (https=)

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US9604316B2 (en) 2014-09-23 2017-03-28 Globalfoundries Inc. Tin-based solder composition with low void characteristic
TWI559829B (zh) * 2014-10-22 2016-11-21 矽品精密工業股份有限公司 封裝結構及其製法
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US10793956B2 (en) * 2015-08-29 2020-10-06 Mitsubishi Materials Corporation Additive for high-purity copper electrolytic refining and method of producing high-purity copper
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CN106757212B (zh) * 2016-11-30 2018-02-02 昆山成功环保科技有限公司 用于晶圆级封装的电镀锡银合金溶液
KR102634249B1 (ko) 2018-12-27 2024-02-07 솔브레인 주식회사 도금 조성물 및 솔더 범프 형성 방법
CN111690958B (zh) * 2019-03-15 2023-07-28 上海新阳半导体材料股份有限公司 一种锡镀液、其制备方法和应用
US12559852B2 (en) 2019-09-16 2026-02-24 Basf Se Composition for tin-silver alloy electroplating comprising a complexing agent
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CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液
CN115029745A (zh) * 2022-07-08 2022-09-09 云南锡业集团（控股）有限责任公司研发中心 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法
CN115070259A (zh) * 2022-07-15 2022-09-20 深圳市同方电子新材料有限公司 一种新型超细焊锡粉的环保无铅焊锡膏
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Also Published As

Publication number Publication date
US7713859B2 (en) 2010-05-11
US20070037377A1 (en) 2007-02-15
KR101361305B1 (ko) 2014-02-21
WO2007022075A3 (en) 2009-04-30
JP2009510255A (ja) 2009-03-12
KR20080034514A (ko) 2008-04-21
CN101622701B (zh) 2013-06-19
ATE541306T1 (de) 2012-01-15
EP1946362A2 (en) 2008-07-23
EP1946362A4 (en) 2010-01-06
EP1946362B1 (en) 2012-01-11
CN101622701A (zh) 2010-01-06
WO2007022075A2 (en) 2007-02-22

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