JP2009510255A5 - - Google Patents
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- Publication number
- JP2009510255A5 JP2009510255A5 JP2008527028A JP2008527028A JP2009510255A5 JP 2009510255 A5 JP2009510255 A5 JP 2009510255A5 JP 2008527028 A JP2008527028 A JP 2008527028A JP 2008527028 A JP2008527028 A JP 2008527028A JP 2009510255 A5 JP2009510255 A5 JP 2009510255A5
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic plating
- composition according
- plating composition
- ion source
- substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 24
- 238000009713 electroplating Methods 0.000 claims 22
- 150000002500 ions Chemical class 0.000 claims 14
- 239000004094 surface-active agent Substances 0.000 claims 9
- -1 N-allyl-thiourea compound Chemical class 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 238000007747 plating Methods 0.000 claims 6
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims 6
- 229910020836 Sn-Ag Inorganic materials 0.000 claims 5
- 229910020988 Sn—Ag Inorganic materials 0.000 claims 5
- 239000002243 precursor Substances 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 5
- 125000001072 heteroaryl group Chemical group 0.000 claims 4
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 150000004786 2-naphthols Chemical class 0.000 claims 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 3
- 238000005272 metallurgy Methods 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 229910052717 sulfur Inorganic materials 0.000 claims 3
- 239000011593 sulfur Substances 0.000 claims 3
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 claims 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- JBIROUFYLSSYDX-UHFFFAOYSA-M benzododecinium chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 JBIROUFYLSSYDX-UHFFFAOYSA-M 0.000 claims 2
- OCBHHZMJRVXXQK-UHFFFAOYSA-M benzyl-dimethyl-tetradecylazanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 OCBHHZMJRVXXQK-UHFFFAOYSA-M 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 claims 2
- 125000005415 substituted alkoxy group Chemical group 0.000 claims 2
- 125000003107 substituted aryl group Chemical group 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US70832805P | 2005-08-15 | 2005-08-15 | |
| US60/708,328 | 2005-08-15 | ||
| US11/463,355 | 2006-08-09 | ||
| US11/463,355 US7713859B2 (en) | 2005-08-15 | 2006-08-09 | Tin-silver solder bumping in electronics manufacture |
| PCT/US2006/031618 WO2007022075A2 (en) | 2005-08-15 | 2006-08-14 | Tin-silver solder bumping in electronics manufacture |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009510255A JP2009510255A (ja) | 2009-03-12 |
| JP2009510255A5 true JP2009510255A5 (https=) | 2009-09-24 |
| JP5207968B2 JP5207968B2 (ja) | 2013-06-12 |
Family
ID=37743065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008527028A Active JP5207968B2 (ja) | 2005-08-15 | 2006-08-14 | 電子工学の製造分野での錫−銀ハンダ・バンプ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7713859B2 (https=) |
| EP (1) | EP1946362B1 (https=) |
| JP (1) | JP5207968B2 (https=) |
| KR (1) | KR101361305B1 (https=) |
| CN (1) | CN101622701B (https=) |
| AT (1) | ATE541306T1 (https=) |
| WO (1) | WO2007022075A2 (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7291201B2 (en) * | 2004-08-30 | 2007-11-06 | National Tsing Hua University | Method for making nano-scale lead-free solder |
| TW200735198A (en) * | 2006-03-01 | 2007-09-16 | Advanced Semiconductor Eng | The method for removing the residual flux |
| US20090145764A1 (en) * | 2007-12-11 | 2009-06-11 | Enthone Inc. | Composite coatings for whisker reduction |
| US8226807B2 (en) | 2007-12-11 | 2012-07-24 | Enthone Inc. | Composite coatings for whisker reduction |
| JP2009191335A (ja) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | めっき液及び電子部品 |
| JP4724192B2 (ja) * | 2008-02-28 | 2011-07-13 | 株式会社東芝 | 電子部品の製造方法 |
| EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
| US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
| US9017528B2 (en) | 2011-04-14 | 2015-04-28 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
| US9005409B2 (en) | 2011-04-14 | 2015-04-14 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
| US8113412B1 (en) * | 2011-05-13 | 2012-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd | Methods for detecting defect connections between metal bumps |
| CN103540971A (zh) * | 2013-10-29 | 2014-01-29 | 常熟市伟达电镀有限责任公司 | 导电强的电镀液 |
| US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
| US8877630B1 (en) * | 2013-11-12 | 2014-11-04 | Chipmos Technologies Inc. | Semiconductor structure having a silver alloy bump body and manufacturing method thereof |
| US9368340B2 (en) | 2014-06-02 | 2016-06-14 | Lam Research Corporation | Metallization of the wafer edge for optimized electroplating performance on resistive substrates |
| US9604316B2 (en) | 2014-09-23 | 2017-03-28 | Globalfoundries Inc. | Tin-based solder composition with low void characteristic |
| TWI559829B (zh) * | 2014-10-22 | 2016-11-21 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
| JP6631349B2 (ja) * | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | アンモニウム塩を用いためっき液 |
| WO2016152986A1 (ja) * | 2015-03-26 | 2016-09-29 | 三菱マテリアル株式会社 | アンモニウム塩を用いためっき液 |
| KR101722703B1 (ko) | 2015-04-10 | 2017-04-03 | 엘티씨에이엠 주식회사 | 주석-은 솔더 범프 도금액 |
| US20160308100A1 (en) * | 2015-04-17 | 2016-10-20 | Chipmos Technologies Inc | Semiconductor package and method of manufacturing thereof |
| JP6733313B2 (ja) * | 2015-08-29 | 2020-07-29 | 三菱マテリアル株式会社 | 高純度銅電解精錬用添加剤と高純度銅製造方法 |
| US10793956B2 (en) * | 2015-08-29 | 2020-10-06 | Mitsubishi Materials Corporation | Additive for high-purity copper electrolytic refining and method of producing high-purity copper |
| KR101722704B1 (ko) * | 2015-12-16 | 2017-04-11 | 엘티씨에이엠 주식회사 | 주석-은 솔더 범프 고속 도금액 및 이를 이용한 도금 방법 |
| CN106757212B (zh) * | 2016-11-30 | 2018-02-02 | 昆山成功环保科技有限公司 | 用于晶圆级封装的电镀锡银合金溶液 |
| KR102634249B1 (ko) | 2018-12-27 | 2024-02-07 | 솔브레인 주식회사 | 도금 조성물 및 솔더 범프 형성 방법 |
| CN111690958B (zh) * | 2019-03-15 | 2023-07-28 | 上海新阳半导体材料股份有限公司 | 一种锡镀液、其制备方法和应用 |
| US12559852B2 (en) | 2019-09-16 | 2026-02-24 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| US11280014B2 (en) | 2020-06-05 | 2022-03-22 | Macdermid Enthone Inc. | Silver/tin electroplating bath and method of using the same |
| CN112359380A (zh) * | 2020-10-23 | 2021-02-12 | 珠海鑫通化工有限公司 | 一种被动元器件化学镀锡用电镀液 |
| CN115029745A (zh) * | 2022-07-08 | 2022-09-09 | 云南锡业集团（控股）有限责任公司研发中心 | 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法 |
| CN115070259A (zh) * | 2022-07-15 | 2022-09-20 | 深圳市同方电子新材料有限公司 | 一种新型超细焊锡粉的环保无铅焊锡膏 |
| KR20250124510A (ko) * | 2024-02-13 | 2025-08-20 | 한국생산기술연구원 | 솔더 범프용 주석 도금액 |
| KR20250124512A (ko) * | 2024-02-13 | 2025-08-20 | 한국생산기술연구원 | 솔더 범프용 주석-은 도금액 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293391A (en) | 1980-04-02 | 1981-10-06 | Rohco, Inc. | Cadmium plating baths and methods for electrodepositing bright cadmium deposits |
| JPS5967387A (ja) * | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
| EP0126220A1 (de) * | 1983-04-26 | 1984-11-28 | Hüls Aktiengesellschaft | Beizlösung zum Beizen von Metalloberflächen und deren Anwendung |
| US4582576A (en) | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| US4715894A (en) | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| US4935312A (en) | 1987-06-25 | 1990-06-19 | Nippon Mining Co., Ltd. | Film carrier having tin and indium plated layers |
| JP3538499B2 (ja) * | 1996-05-15 | 2004-06-14 | 株式会社大和化成研究所 | 錫−銀合金電気めっき浴 |
| US6099713A (en) | 1996-11-25 | 2000-08-08 | C. Uyemura & Co., Ltd. | Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
| JP3776566B2 (ja) * | 1997-07-01 | 2006-05-17 | 株式会社大和化成研究所 | めっき方法 |
| JP3782869B2 (ja) * | 1997-07-01 | 2006-06-07 | 株式会社大和化成研究所 | 錫−銀合金めっき浴 |
| JP3904333B2 (ja) * | 1998-09-02 | 2007-04-11 | 株式会社大和化成研究所 | 錫又は錫合金めっき浴 |
| JP2000265294A (ja) * | 1999-03-15 | 2000-09-26 | Matsushita Electric Ind Co Ltd | 錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム |
| JP3433291B2 (ja) | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| US6638847B1 (en) | 2000-04-19 | 2003-10-28 | Advanced Interconnect Technology Ltd. | Method of forming lead-free bump interconnections |
| DE10026680C1 (de) | 2000-05-30 | 2002-02-21 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten |
| US6706418B2 (en) | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
| WO2002090623A1 (fr) * | 2001-05-09 | 2002-11-14 | Ebara-Udylite Co., Ltd. | Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain |
| US20030000846A1 (en) | 2001-05-25 | 2003-01-02 | Shipley Company, L.L.C. | Plating method |
| US7045050B2 (en) | 2001-07-31 | 2006-05-16 | Sekisui Chemical Co., Ltd. | Method for producing electroconductive particles |
| JP3881614B2 (ja) | 2002-05-20 | 2007-02-14 | 株式会社大和化成研究所 | 回路パターン形成方法 |
| US7273540B2 (en) | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| US20040025384A1 (en) | 2002-08-09 | 2004-02-12 | Ptacek Robert J. | Point of purchase display |
| US7012333B2 (en) * | 2002-12-26 | 2006-03-14 | Ebara Corporation | Lead free bump and method of forming the same |
| JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
| JP4758614B2 (ja) * | 2003-04-07 | 2011-08-31 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 電気めっき組成物および方法 |
| US7029761B2 (en) | 2003-04-30 | 2006-04-18 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
-
2006
- 2006-08-09 US US11/463,355 patent/US7713859B2/en active Active
- 2006-08-14 JP JP2008527028A patent/JP5207968B2/ja active Active
- 2006-08-14 AT AT06801412T patent/ATE541306T1/de active
- 2006-08-14 WO PCT/US2006/031618 patent/WO2007022075A2/en not_active Ceased
- 2006-08-14 EP EP06801412A patent/EP1946362B1/en active Active
- 2006-08-14 KR KR1020087006190A patent/KR101361305B1/ko active Active
- 2006-08-14 CN CN2006800378536A patent/CN101622701B/zh active Active
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