JP2012505970A5 - - Google Patents
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- Publication number
- JP2012505970A5 JP2012505970A5 JP2011532287A JP2011532287A JP2012505970A5 JP 2012505970 A5 JP2012505970 A5 JP 2012505970A5 JP 2011532287 A JP2011532287 A JP 2011532287A JP 2011532287 A JP2011532287 A JP 2011532287A JP 2012505970 A5 JP2012505970 A5 JP 2012505970A5
- Authority
- JP
- Japan
- Prior art keywords
- ion
- metal
- nickel
- composition according
- metal plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 22
- 238000007747 plating Methods 0.000 claims 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 17
- 229910052751 metal Inorganic materials 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 16
- 229910052759 nickel Inorganic materials 0.000 claims 8
- 239000000654 additive Substances 0.000 claims 7
- 230000000996 additive effect Effects 0.000 claims 7
- 229910021645 metal ion Inorganic materials 0.000 claims 6
- 125000000217 alkyl group Chemical group 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims 4
- 239000003638 chemical reducing agent Substances 0.000 claims 4
- -1 selenium ion Chemical class 0.000 claims 4
- 239000007795 chemical reaction product Substances 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000003381 stabilizer Substances 0.000 claims 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims 2
- 239000008139 complexing agent Substances 0.000 claims 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims 2
- 229930195729 fatty acid Natural products 0.000 claims 2
- 239000000194 fatty acid Substances 0.000 claims 2
- 150000004665 fatty acids Chemical class 0.000 claims 2
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 claims 2
- 239000013528 metallic particle Substances 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 229910001439 antimony ion Inorganic materials 0.000 claims 1
- 229910001451 bismuth ion Inorganic materials 0.000 claims 1
- 229910000085 borane Inorganic materials 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 230000032050 esterification Effects 0.000 claims 1
- 238000005886 esterification reaction Methods 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 238000001556 precipitation Methods 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 229910052711 selenium Inorganic materials 0.000 claims 1
- 239000011669 selenium Substances 0.000 claims 1
- 230000001180 sulfating effect Effects 0.000 claims 1
- 230000019635 sulfation Effects 0.000 claims 1
- 238000005670 sulfation reaction Methods 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
- 229910001432 tin ion Inorganic materials 0.000 claims 1
- 229910001456 vanadium ion Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10603808P | 2008-10-16 | 2008-10-16 | |
| US61/106,038 | 2008-10-16 | ||
| PCT/US2009/061011 WO2010045559A1 (en) | 2008-10-16 | 2009-10-16 | Metal plating additive, and method for plating substrates and products therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012505970A JP2012505970A (ja) | 2012-03-08 |
| JP2012505970A5 true JP2012505970A5 (https=) | 2012-11-29 |
Family
ID=42106921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011532287A Pending JP2012505970A (ja) | 2008-10-16 | 2009-10-16 | 金属めっき添加剤並びに基板のめっき方法およびこの方法により得られる製品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8557100B2 (https=) |
| EP (1) | EP2347413B1 (https=) |
| JP (1) | JP2012505970A (https=) |
| CN (1) | CN102187391A (https=) |
| MY (1) | MY160341A (https=) |
| WO (1) | WO2010045559A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012087386A (ja) * | 2010-10-21 | 2012-05-10 | Toyota Motor Corp | 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法 |
| US9708693B2 (en) * | 2014-06-03 | 2017-07-18 | Macdermid Acumen, Inc. | High phosphorus electroless nickel |
| EP3026143A1 (en) | 2014-11-26 | 2016-06-01 | ATOTECH Deutschland GmbH | Plating bath and method for electroless deposition of nickel layers |
| US20180209047A1 (en) * | 2015-07-17 | 2018-07-26 | Coventya, Inc. | Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use |
| EP3409815B1 (en) | 2017-06-02 | 2020-08-05 | ATOTECH Deutschland GmbH | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
| EP3922753A1 (en) * | 2020-06-10 | 2021-12-15 | ATOTECH Deutschland GmbH | Electroless nickel or cobalt plating solution |
| CN116041229A (zh) * | 2023-02-21 | 2023-05-02 | 太原理工大学 | 蓖麻油基磺酸盐阴离子表面活性剂及其制备方法 |
Family Cites Families (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2383798A (en) * | 1940-12-11 | 1945-08-28 | Du Pont | Electroplating |
| US2658841A (en) | 1950-11-08 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating and bath therefor |
| US2658842A (en) | 1951-01-04 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating and bath therefor |
| US2762723A (en) | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
| US2743288A (en) | 1953-06-24 | 1956-04-24 | Tennessee Corp | Production of monosulfonated carboxylic acids and their esters |
| US2847327A (en) | 1954-10-25 | 1958-08-12 | Gen Am Transport | Processes of chemical nickel plating and baths therefor |
| US2935425A (en) | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
| US3338726A (en) | 1958-10-01 | 1967-08-29 | Du Pont | Chemical reduction plating process and bath |
| NL281860A (https=) | 1961-08-08 | |||
| GB1234793A (en) * | 1967-06-26 | 1971-06-09 | Tesla Np | Brightening and hardening additive for electrolytic silvering baths |
| US3597266A (en) | 1968-09-23 | 1971-08-03 | Enthone | Electroless nickel plating |
| US3915716A (en) | 1969-04-17 | 1975-10-28 | Schering Ag | Chemical nickel plating bath |
| DE2028950B2 (de) | 1970-06-12 | 1976-05-13 | Shipley Co., Inc., Newton, Mass. (V.SLA.) | Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon |
| US3953654A (en) | 1973-08-13 | 1976-04-27 | Rca Corporation | Temperature-stable non-magnetic alloy |
| US4014761A (en) * | 1975-01-06 | 1977-03-29 | M & T Chemicals Inc. | Bright acid zinc plating |
| US3972788A (en) * | 1975-01-06 | 1976-08-03 | M & T Chemicals Inc. | Zinc anode benefaction |
| GB1563994A (en) | 1975-05-15 | 1980-04-02 | Albright & Wilson | Sulph(on)ation process and mixer |
| JPS5214725A (en) | 1975-07-21 | 1977-02-03 | Kao Corp | Method of sulfonation and its apparatus |
| JPS5892499A (ja) * | 1981-11-28 | 1983-06-01 | Nippon Nohyaku Co Ltd | スケ−ル除去剤 |
| US4466233A (en) | 1982-09-30 | 1984-08-21 | Thesman Industries, Inc. | Mower drive assembly |
| US4467067A (en) | 1982-12-27 | 1984-08-21 | Shipley Company | Electroless nickel plating |
| US4511614A (en) * | 1983-10-31 | 1985-04-16 | Ball Corporation | Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same |
| US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
| US4528245A (en) * | 1984-02-27 | 1985-07-09 | Allied Corporation | Pretreatment of plastic materials for metal plating |
| US4803097A (en) * | 1987-04-20 | 1989-02-07 | Allied-Signal Inc. | Metal plating of plastic materials |
| US4780342A (en) | 1987-07-20 | 1988-10-25 | General Electric Company | Electroless nickel plating composition and method for its preparation and use |
| JPH01201484A (ja) * | 1987-10-06 | 1989-08-14 | Hitachi Ltd | 化学ニッケルめっき液及びその使用方法 |
| US5405646A (en) | 1992-10-14 | 1995-04-11 | Nanis; Leonard | Method of manufacture thin film magnetic disk |
| US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| JPH1192953A (ja) * | 1997-09-16 | 1999-04-06 | Ebara Corp | 微細窪みの充填方法及び装置 |
| JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| US6316097B1 (en) * | 1998-09-28 | 2001-11-13 | Seagate Technology Llc | Electroless plating process for alternative memory disk substrates |
| US6685990B1 (en) * | 1999-04-20 | 2004-02-03 | Seagate Technology Llc | Nodule-free electroless nip plating |
| JP4847648B2 (ja) * | 2001-06-29 | 2011-12-28 | ブリヂストンスポーツ株式会社 | アクリル酸亜鉛組成物およびその製造方法ならびに当該組成物を用いてなるゴルフボール |
| JP4932094B2 (ja) * | 2001-07-02 | 2012-05-16 | 日本リーロナール有限会社 | 無電解金めっき液および無電解金めっき方法 |
| DE10141089A1 (de) * | 2001-08-22 | 2003-03-13 | Henkel Kgaa | Oberflächenfilm mit Depotfunktion, dessen Herstellung und Verwendung |
| US6500482B1 (en) * | 2001-08-31 | 2002-12-31 | Boules H. Morcos | Electroless nickel plating solution and process for its use |
| WO2003051126A1 (de) * | 2001-12-18 | 2003-06-26 | Henkel Kommanditgesellschaft Auf Aktien | Adhäsionshemmung von schimmelpilzen |
| JP2003342483A (ja) * | 2002-03-20 | 2003-12-03 | Sanyo Chem Ind Ltd | 導電性エラストマー |
| JP2004059998A (ja) * | 2002-07-29 | 2004-02-26 | Konica Minolta Holdings Inc | 無電解メッキ液及び無電解メッキ被覆方法 |
| US20060243604A1 (en) * | 2003-04-30 | 2006-11-02 | Sota Nakagawa | Method and apparatus for treating waste water |
| US6837923B2 (en) * | 2003-05-07 | 2005-01-04 | David Crotty | Polytetrafluoroethylene dispersion for electroless nickel plating applications |
| JP2005044488A (ja) * | 2003-07-09 | 2005-02-17 | Fuji Electric Device Technology Co Ltd | 磁気記録媒体用基板及び磁気記録媒体の製造方法並びに基板洗浄装置 |
| JP4407311B2 (ja) * | 2004-02-20 | 2010-02-03 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JP2005264256A (ja) * | 2004-03-19 | 2005-09-29 | Rikogaku Shinkokai | 共重合体高分子、金属被覆物、金属配線基板及びそれらの製造方法 |
| US20080124552A1 (en) * | 2004-05-24 | 2008-05-29 | Nisshinbo Industries, Inc. | Particle With Rough Surface For Plating Or Vapor Deposition |
| DE102004039472A1 (de) * | 2004-08-14 | 2006-03-02 | Henkel Kgaa | Verfahren zur Herstellung portionierter Wasch- oder Reinigungsmittel |
| DE102004047423C5 (de) * | 2004-09-28 | 2011-04-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung |
| DE102004056554A1 (de) * | 2004-11-23 | 2006-05-24 | Buck-Chemie Gmbh | Haftendes Sanitärreinigungs- und Beduftungsmittel |
| DE102005043188A1 (de) * | 2005-09-09 | 2007-03-22 | Henkel Kgaa | Verbrauchsprodukte mit wechselnden Geruchsbildern |
| US7601419B2 (en) * | 2005-12-19 | 2009-10-13 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| DE102006031149A1 (de) * | 2006-07-04 | 2008-01-10 | Merck Patent Gmbh | Fluortenside |
| CN103465525B (zh) * | 2006-12-27 | 2015-10-21 | 日立化成株式会社 | 凹版和使用该凹版的带有导体层图形的基材 |
| US9574093B2 (en) * | 2007-09-28 | 2017-02-21 | Ppg Industries Ohio, Inc. | Methods for coating a metal substrate and related coated metal substrates |
| JP5353705B2 (ja) * | 2007-10-26 | 2013-11-27 | コニカミノルタ株式会社 | 透明導電性フィルム及びその製造方法 |
| JP5080312B2 (ja) * | 2008-02-27 | 2012-11-21 | 富士フイルム株式会社 | 磁気記録媒体の製造方法 |
-
2009
- 2009-10-16 WO PCT/US2009/061011 patent/WO2010045559A1/en not_active Ceased
- 2009-10-16 EP EP09821323.4A patent/EP2347413B1/en not_active Not-in-force
- 2009-10-16 CN CN2009801408782A patent/CN102187391A/zh active Pending
- 2009-10-16 MY MYPI2011001188A patent/MY160341A/en unknown
- 2009-10-16 JP JP2011532287A patent/JP2012505970A/ja active Pending
- 2009-10-16 US US13/123,778 patent/US8557100B2/en not_active Expired - Fee Related
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