CN102187391A - 金属镀敷添加剂，镀敷基材的方法以及由其获得的产品 - Google Patents

金属镀敷添加剂，镀敷基材的方法以及由其获得的产品 Download PDF

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Publication number
CN102187391A
CN102187391A CN2009801408782A CN200980140878A CN102187391A CN 102187391 A CN102187391 A CN 102187391A CN 2009801408782 A CN2009801408782 A CN 2009801408782A CN 200980140878 A CN200980140878 A CN 200980140878A CN 102187391 A CN102187391 A CN 102187391A
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CN
China
Prior art keywords
metal
nickel
plating
additive
composition according
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Pending
Application number
CN2009801408782A
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English (en)
Chinese (zh)
Inventor
K·舍尔
G·基尔斯
S·阿克塔尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN102187391A publication Critical patent/CN102187391A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN2009801408782A 2008-10-16 2009-10-16 金属镀敷添加剂，镀敷基材的方法以及由其获得的产品 Pending CN102187391A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10603808P 2008-10-16 2008-10-16
US61/106,038 2008-10-16
PCT/US2009/061011 WO2010045559A1 (en) 2008-10-16 2009-10-16 Metal plating additive, and method for plating substrates and products therefrom

Publications (1)

Publication Number Publication Date
CN102187391A true CN102187391A (zh) 2011-09-14

Family

ID=42106921

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801408782A Pending CN102187391A (zh) 2008-10-16 2009-10-16 金属镀敷添加剂，镀敷基材的方法以及由其获得的产品

Country Status (6)

Country Link
US (1) US8557100B2 (https=)
EP (1) EP2347413B1 (https=)
JP (1) JP2012505970A (https=)
CN (1) CN102187391A (https=)
MY (1) MY160341A (https=)
WO (1) WO2010045559A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116041229A (zh) * 2023-02-21 2023-05-02 太原理工大学 蓖麻油基磺酸盐阴离子表面活性剂及其制备方法

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JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
EP3026143A1 (en) 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers
US20180209047A1 (en) * 2015-07-17 2018-07-26 Coventya, Inc. Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
EP3409815B1 (en) 2017-06-02 2020-08-05 ATOTECH Deutschland GmbH Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits
EP3922753A1 (en) * 2020-06-10 2021-12-15 ATOTECH Deutschland GmbH Electroless nickel or cobalt plating solution

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US2383798A (en) * 1940-12-11 1945-08-28 Du Pont Electroplating
GB1234793A (en) * 1967-06-26 1971-06-09 Tesla Np Brightening and hardening additive for electrolytic silvering baths
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CN1541143A (zh) * 2001-08-31 2004-10-27 麦克德米德有限公司 化学镀镍溶液及其方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116041229A (zh) * 2023-02-21 2023-05-02 太原理工大学 蓖麻油基磺酸盐阴离子表面活性剂及其制备方法

Also Published As

Publication number Publication date
EP2347413A1 (en) 2011-07-27
WO2010045559A1 (en) 2010-04-22
EP2347413A4 (en) 2012-02-29
JP2012505970A (ja) 2012-03-08
EP2347413B1 (en) 2016-06-22
US20110195278A1 (en) 2011-08-11
MY160341A (en) 2017-02-28
US8557100B2 (en) 2013-10-15

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Application publication date: 20110914