MY160341A - Metal plating additive, and method for plating substrates and products therefrom. - Google Patents

Metal plating additive, and method for plating substrates and products therefrom.

Info

Publication number
MY160341A
MY160341A MYPI2011001188A MYPI2011001188A MY160341A MY 160341 A MY160341 A MY 160341A MY PI2011001188 A MYPI2011001188 A MY PI2011001188A MY PI2011001188 A MYPI2011001188 A MY PI2011001188A MY 160341 A MY160341 A MY 160341A
Authority
MY
Malaysia
Prior art keywords
plating
additive
metal
branched
alkyl
Prior art date
Application number
MYPI2011001188A
Other languages
English (en)
Inventor
Kevin Schell
Grant Keers
Shakeel Akhtar
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY160341A publication Critical patent/MY160341A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
MYPI2011001188A 2008-10-16 2009-10-16 Metal plating additive, and method for plating substrates and products therefrom. MY160341A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10603808P 2008-10-16 2008-10-16

Publications (1)

Publication Number Publication Date
MY160341A true MY160341A (en) 2017-02-28

Family

ID=42106921

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001188A MY160341A (en) 2008-10-16 2009-10-16 Metal plating additive, and method for plating substrates and products therefrom.

Country Status (6)

Country Link
US (1) US8557100B2 (https=)
EP (1) EP2347413B1 (https=)
JP (1) JP2012505970A (https=)
CN (1) CN102187391A (https=)
MY (1) MY160341A (https=)
WO (1) WO2010045559A1 (https=)

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* Cited by examiner, † Cited by third party
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JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
EP3026143A1 (en) 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers
US20180209047A1 (en) * 2015-07-17 2018-07-26 Coventya, Inc. Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
EP3409815B1 (en) 2017-06-02 2020-08-05 ATOTECH Deutschland GmbH Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits
EP3922753A1 (en) * 2020-06-10 2021-12-15 ATOTECH Deutschland GmbH Electroless nickel or cobalt plating solution
CN116041229A (zh) * 2023-02-21 2023-05-02 太原理工大学 蓖麻油基磺酸盐阴离子表面活性剂及其制备方法

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Also Published As

Publication number Publication date
EP2347413A1 (en) 2011-07-27
WO2010045559A1 (en) 2010-04-22
EP2347413A4 (en) 2012-02-29
JP2012505970A (ja) 2012-03-08
EP2347413B1 (en) 2016-06-22
US20110195278A1 (en) 2011-08-11
CN102187391A (zh) 2011-09-14
US8557100B2 (en) 2013-10-15

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