TW200500496A - Electroless gold plating solution - Google Patents

Electroless gold plating solution

Info

Publication number
TW200500496A
TW200500496A TW093109714A TW93109714A TW200500496A TW 200500496 A TW200500496 A TW 200500496A TW 093109714 A TW093109714 A TW 093109714A TW 93109714 A TW93109714 A TW 93109714A TW 200500496 A TW200500496 A TW 200500496A
Authority
TW
Taiwan
Prior art keywords
plating solution
gold plating
electroless gold
hydrogen
gold
Prior art date
Application number
TW093109714A
Other languages
Chinese (zh)
Other versions
TWI284157B (en
Inventor
Toru Imori
Yoshiyuki Hisumi
Yoshihisa Fujihira
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200500496A publication Critical patent/TW200500496A/en
Application granted granted Critical
Publication of TWI284157B publication Critical patent/TWI284157B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Abstract

This invention provides an electroless gold plating solution for the obtaining of a gold plated film without surface pitting and with sufficient soldering strength during soldering. The electroless gold plating solution comprising a gold-containing water-soluble compound, and a hydroxyalkylsulfonic acid represented by following general formula or its salt as a reducing agent, and an amine compound. , (wherein, R represents hydrogen, carboxyl, or any one of optionally substituted phenyl, naphthyl, saturated or unsaturated alkyl, acetyl, acetonyl, pyridyl, and furyl; X represents any one of hydrogen, Na, K and NH4; n represents an integer of 0 to 4.)
TW093109714A 2003-06-10 2004-04-08 Electroless gold plating solution TWI284157B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003164807 2003-06-10
JP2003416315 2003-12-15

Publications (2)

Publication Number Publication Date
TW200500496A true TW200500496A (en) 2005-01-01
TWI284157B TWI284157B (en) 2007-07-21

Family

ID=33554380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109714A TWI284157B (en) 2003-06-10 2004-04-08 Electroless gold plating solution

Country Status (5)

Country Link
JP (1) JP4638818B2 (en)
KR (1) KR100749992B1 (en)
CN (1) CN100510174C (en)
HK (1) HK1090096A1 (en)
TW (1) TWI284157B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526459B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP4941650B2 (en) * 2007-01-11 2012-05-30 上村工業株式会社 Plating ability maintenance management method of electroless gold plating bath
JP5013077B2 (en) 2007-04-16 2012-08-29 上村工業株式会社 Electroless gold plating method and electronic component
JP6619563B2 (en) * 2015-04-30 2019-12-11 日本高純度化学株式会社 Electroless gold plating solution, aldehyde-amine adduct replenisher, and gold film formed using them
CN105543816A (en) * 2016-02-01 2016-05-04 哈尔滨工业大学（威海） Chemical gold plating solution

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920462B2 (en) * 1998-07-13 2007-05-30 株式会社大和化成研究所 Aqueous solutions for obtaining noble metals by chemical reduction deposition

Also Published As

Publication number Publication date
JP4638818B2 (en) 2011-02-23
JPWO2004111287A1 (en) 2006-07-20
WO2004111287A3 (en) 2005-03-03
CN1802452A (en) 2006-07-12
WO2004111287A2 (en) 2004-12-23
KR100749992B1 (en) 2007-08-16
KR20060031617A (en) 2006-04-12
TWI284157B (en) 2007-07-21
HK1090096A1 (en) 2006-12-15
CN100510174C (en) 2009-07-08

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