CN106757212B - 用于晶圆级封装的电镀锡银合金溶液 - Google Patents
用于晶圆级封装的电镀锡银合金溶液 Download PDFInfo
- Publication number
- CN106757212B CN106757212B CN201611074410.6A CN201611074410A CN106757212B CN 106757212 B CN106757212 B CN 106757212B CN 201611074410 A CN201611074410 A CN 201611074410A CN 106757212 B CN106757212 B CN 106757212B
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- CN
- China
- Prior art keywords
- tin
- silver
- ion
- wafer
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611074410.6A CN106757212B (zh) | 2016-11-30 | 2016-11-30 | 用于晶圆级封装的电镀锡银合金溶液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611074410.6A CN106757212B (zh) | 2016-11-30 | 2016-11-30 | 用于晶圆级封装的电镀锡银合金溶液 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106757212A CN106757212A (zh) | 2017-05-31 |
CN106757212B true CN106757212B (zh) | 2018-02-02 |
Family
ID=58900841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201611074410.6A Active CN106757212B (zh) | 2016-11-30 | 2016-11-30 | 用于晶圆级封装的电镀锡银合金溶液 |
Country Status (1)
Country | Link |
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CN (1) | CN106757212B (zh) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7713859B2 (en) * | 2005-08-15 | 2010-05-11 | Enthone Inc. | Tin-silver solder bumping in electronics manufacture |
CN102162113A (zh) * | 2011-05-30 | 2011-08-24 | 长春工业大学 | 一种电镀锡银铜三元合金镀液及电镀方法 |
KR101346021B1 (ko) * | 2011-12-09 | 2013-12-31 | 주식회사 엠에스씨 | 주석-은 합금 도금액의 생성방법 및 그 도금액 |
CN103184483A (zh) * | 2011-12-31 | 2013-07-03 | 赵春美 | 一种电镀锡液 |
CN103184485A (zh) * | 2011-12-31 | 2013-07-03 | 赵春美 | 一种电镀锡液 |
US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
KR101636361B1 (ko) * | 2014-07-31 | 2016-07-06 | 주식회사 에이피씨티 | 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액 |
CN105648483B (zh) * | 2016-04-11 | 2018-09-18 | 济南德锡科技有限公司 | 一种高速镀锡溶液及其制备方法 |
CN106757213A (zh) * | 2016-11-15 | 2017-05-31 | 惠州市力道电子材料有限公司 | 一种无氰镀银锡合金的电镀液及其电镀方法 |
-
2016
- 2016-11-30 CN CN201611074410.6A patent/CN106757212B/zh active Active
Also Published As
Publication number | Publication date |
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CN106757212A (zh) | 2017-05-31 |
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Effective date of registration: 20180108 Address after: Kunshan Development Zone, Kunshan Road, Suzhou City, the Yangcheng Lake in Jiangsu province 215334 No. 248 room 3 Applicant after: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. Address before: 518100 Shenzhen City, Shenzhen, Guangdong, Baoan District Xin'an street, Liu Xian two road medium grain Commercial Park 1 building 1403A Applicant before: Shenzhen Chuangzhi Success Technology Co.,Ltd. |
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Address after: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Kunshan City, Suzhou City, Jiangsu Province 215334 Patentee after: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Kunshan City, Suzhou City, Jiangsu Province 215334 Patentee before: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221129 Address after: No. 323, Jinchuan Road, Nantong Hi tech Industrial Development Zone, Nantong, Jiangsu 226399 Patentee after: Jiangsu Sizhi Semiconductor Technology Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Kunshan City, Suzhou City, Jiangsu Province 215334 Patentee before: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. |
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